CS239279B1 - Handling mechanism - Google Patents

Abstract

Manipulation mechanism consisting of multipurpose bushings, which are placed in the walls of the vacuum chamber, where e.g. magnetron deposition correction is performed. Preferably, 3 bushings are used, where one bushing is sliding and supporting, the second bushing also has a rotating mechanism and the third bushing is sliding, supporting and current. < It is used in sputtering devices, where thin layers are created on metal, non-metal, electrically conductive and non-conductive components. Especially advantageous for two-chamber, vertically arranged devices.

Description

(54) Handling mechanism

Handling mechanism, consisting of multipurpose bushings, which are located in the walls of the vacuum chamber, where for example correction by magnetron deposition is performed.

Preferably, 3 bushings are used, where one bushing is a retractable and supportive, the second bushing has an additional rotation mechanism and a third bushing is a retractable, supportive, and jet. <

It is used in sputtering equipment where thin films are formed on metal, non-metallic, el. conductive and non-conductive components. Particularly advantageous for a two-chamber, vertically arranged device.

OSR. 1

BACKGROUND OF THE INVENTION The present invention relates to a mechanism for handling batch in vacuum, multi-chamber sputtering devices.

The known thin-film vacuum devices are designed as single-chamber or multi-chamber with horizontal arrangement. Due to this arrangement, different handling devices are also designed horizontally.

The movement of these devices is induced by means of reverse electric motors, which move through the rotary bushings and internal friction elements with the charge carriers. Furthermore, lever handling devices, roller conveyors, etc. are known.

Handling mechanism for multi-chamber, vacuum sputtering chambers according to the invention, characterized in that in the walls of the chamber there are bushings which are insulated from the walls, the first bushing being designed as extendable and supporting, the second bushing being designed as extendable, supporting and it has a mechanism for rotating the base, and the third bushing is designed as a slide-out, support and current bushing.

A higher effect according to the invention can be seen in the fact that the grommets combine several functions at the same time, thus minimizing the number of passages into the vacuum chamber. This improves the vacuum tightness of the device.

The manipulation mechanism enables vertical arrangement of the vacuum chambers, thus saving the building area and simplifying the production of the technological equipment. The handling mechanism according to the invention is shown in the accompanying drawings, in which Fig. 1 shows a cross-section of a multi-chamber sputtering device and Fig. 2 shows a plan view of the chamber 5 in cross-section (schematically) showing the location of the bushings.

In Fig. 1, a multi-chamber vacuum sputtering device with a chamber 7 and a chamber in the chamber 1, the carrier with a charge 2 is placed on a base 3, which is movably actuated (ejected and lowered) by a handling roller 4.

Both chambers are separated by a vacuum seal 6. In the chamber 5, there are bushings 7, 8, 9 in the walls, which are multipurpose. All bushings are sealed and insulated in the walls 10.

In the chamber, the charge is placed on the charge carrier 2, which is mounted on the base 3 of the handling cylinder 6. After completion of the respective technological operations in the vacuum chamber 7, it is necessary to transfer the charge to the chamber 5.

This can be done after opening the vacuum seal 6. Furthermore, the working stroke of the handling cylinder 4 is carried out with the base 3 on which the charge carrier 2 is supported. The handling cylinder 4 remains in the extended position until the grommets 7, 8, 9 are extended.

Thereby the charge carrier 2 is supported and the handling cylinder 4 returns to the initial position in the chamber 7. After this operation, the vacuum seal is closed again. Thereby the charge in the chamber 5 is ready for sputtering operations.

These operations are made possible by special bushings 7.r 8? 2. ' which, in the extended position, support the charge carrier 2, rotate the base 2 ^and one of them also has the function of a current feed-through for securing the current supply - see further description.

The first bushing 1 is designed to serve as a pull-out and support bushing as it supports the charge carrier in the extended position. The second bushing 6 is also multi-purpose and is equipped with a mechanism for rotating the charge carrier.

The charge carrier 2 performs a rotary movement during the process. In the case where it is necessary for technological reasons to supply the charge carrier 2 with electric current, this possibility is provided by a third bushing 9, which is also designed as a multipurpose and serves as support, ejection and current supply.

All bushings 7, Q 2, 3 ^SOU ° d of the vacuum chamber 2 insulated insulation 10, to meet the requirements of technology.

The handling mechanism is applicable in sputtering or vaporizing vacuum devices where thin films are formed on metallic, non-metallic, electrically conductive and non-conductive components. Preferably, it can be used in a two-chamber, vertically arranged sputtering device.

Claims (1)

SUBJECT OF THE INVENTION Handling mechanism for multi-chamber vacuum sputtering chambers equipped in the chamber with a lifting cylinder, a base and a vacuum closure, characterized in that bushings (7, 8, 9) are placed in the walls of the chamber (5), which are insulated from the walls by insulation (10). wherein the first bushing (7) is designed as an eject and support, the second bushing (8) is designed as an eject and support, and is simultaneously equipped with a base pivot mechanism (3) and the third bushing (9) is designed as an eject, support and stream bushing.