CS243675B1 - Hinge for local electroplating - Google Patents

Abstract

The solution concerns the solution of a covering suspension for local galvanic plating, especially of small and medium series of small components. Its essence lies in the fact that the conductive part of the suspension, which ensures the supply of current to the plated components, is completely covered on both sides with a flexible non-conductive layer, which also covers non-functional areas of the components and, with its elasticity, ensures contact of the conductive layer with the plated component.

Description

The invention relates to a solution of a hinge for the local electroplating of small and medium series of small parts.

Local plating, that is, plating only the functional parts of the components is one of the most effective ways of saving mainly precious metals.

Local metal plating is very difficult to carry out on small components used in electrical engineering such as pens, contacts, sockets, pins. These components are very diverse in shape and often have more functional surfaces that must be metallized.

The metal hinges shall meet the following necessary requirements:

- perfect conductive connection of each component to the conductive part of the hinge and hence to the cathode;

- the non-functional surface of the metal parts of the hinge must be covered with a non-conductive layer in such a way as to prevent the loss of the deposited metal;

- the hinges must be inert to the galvanic bath used and must not contaminate it;

- the hinge must be made free of articulations and slits in such a way that individual baths are not transferred during degreasing, pickling and plating;

- the hinge must not shield the metallized functional surfaces.

Hinges for local plating are usually made in a modular manner by a combination of metals, plastics, rubber or paints. After assembly of the components, the assembly is mechanically connected by a screw, spring or other fastener.

Hinges are usually designed separately for each type of component, they are difficult to manufacture, metal plating is laborious, and auxiliary anodes are often required. In spite of these facts, due to the savings of precious metals, they are economically beneficial, even in smaller series.

The invention provides an advantageous solution of a hinge for the local galvanic plating of small parts, which is characterized in that the conductive layer is placed between two non-conductive layers, at least one of which is flexible and cavities for forming the parts are formed in these layers they remain outside the non-conductive layer. It meets all of the above requirements and is applicable to all types of electroplating baths.

The proposed solution eliminates especially structural complexities, minimizes laboriousness during loading of metallized parts and reduces consumption of materials, especially non-ferrous metals.

The simplicity and versatility of the solved elevation extends its field of application. The main advantages can be seen in that the conductive part of the hinge providing current to the metallized part is completely covered on both sides with a flexible non-conductive layer, which also covers the non-functional surfaces of the part and its elasticity ensures contact of the conductive layer with the metallized part.

BRIEF DESCRIPTION OF THE DRAWINGS The invention is illustrated in greater detail in the accompanying drawings, in which: FIG.

The principle of the invention is best seen in Figs. 1 and 2, wherein Fig. 1 shows a front view in partial cross-section and Fig. 2 the same in side view. The representation of the part X and the surface to be metallized g outside the hinge is evident from FIG. 2, where the conductive layer X conductively connected to the power supply 4 is completely covered on both sides with the non-conductive layer g.

In this assembly, cavities g are formed in which the components X are inserted, the surfaces to be metallized g being located outside the hinge. At the same time, the power supply g serves to fasten the entire hinge to the cathode rod of the electroplating bath. The cavities X formed in the hinge assembly have the shape of a metal-plated component but are reasonably smaller, so that upon insertion of the components, the flexible non-conductive layer ensures good contact of the conductive layer with the metal-plated component.

Fig. 3 shows a simplified embodiment of the hinge. The hinge consists of a conductive layer 1, a power supply 6, a flexible non-conductive layer 2 of rubber. The shape of the part At is used which is pressed directly into the hinge without preforming the holes.

The hinge utilizes the inherent elasticity of the non-conductive layer, which may advantageously be vulcanized rubber. This then performs two functions - it protects the non-functional surfaces of the part from metal plating and ensures that the part contacts the conductive layer of the hinge.

The solved hinge can be used for local plating of small parts, especially small and medium series. Effective use is possible in electrotechnics for metallization of small electro-conductive components. The most effective use of the hinge is for metal plating with metal.

Claims (3)

SUBJECT OF THE INVENTION Hinge for galvanic plating, characterized in that the conductive layer (1) is placed between two non-conductive layers (2), at least one of which is flexible and cavities (3) are formed in these layers for positioning the components (4) so The functional surface (5) of the components remains outside the non-conductive layer. The hinge for localized galvanizing according to claim 1, characterized in that the conductive layer (1) is vulcanized on both sides into rubber, thereby forming non-conductive hinge layers (2). Hinge for electroplating according to claim 1, characterized in that the flexible non-conductive layers (3) are integral.