CS254670B1

CS254670B1 - The process has bonded the solids with an organic substance

Info

Publication number: CS254670B1
Application number: CS852379A
Authority: CS
Inventors: Ivan Stelmak
Original assignee: Ivan Stelmak
Priority date: 1985-04-01
Filing date: 1985-04-01
Publication date: 1988-01-15
Also published as: CS237985A1

Abstract

Sposob spájanla pevných materiálov organickou látkou s použitím hlavně v drevárskom a nábytkárskom priemysle. Medzi dva pevne spájané materiály a do vyhotovenoj drážky sa vloží organický prvok, v ktorom je zaliatý kovový odporový materiál (drót, mriežka, platnička a pod.). Na kovové vývody organického prvku sa privedie elektrický prúd, ktorým sa roztaví organická látka, a po odpojení prúdu nastane opatovné stuhnutie a vytvorenie pevného spojenia za krátký čas.A method of joining solid materials with an organic substance, used mainly in the woodworking and furniture industries. An organic element, in which a metal resistance material (wire, grid, plate, etc.) is embedded, is inserted between the two materials to be joined and into the groove made. An electric current is applied to the metal terminals of the organic element, which melts the organic substance, and after the current is disconnected, solidification occurs again and a solid connection is formed in a short time.

Description

Vynález sa týká spósobu spájania pevných materiálov, a to pevnou organickou látkou za pomoci jej roztavenia a spatného stuhnutia za účelom vytvorenia pevného spoja, hlavně u pórovitých materiálov. V súčasnosti sa v nábytkářském a drevárskom priemysle na spájanie korpusov a konštrukcii používajú rózne druhy mechanických spojovacích prvkov, ako sú skrutky, klínce, excentre, nity, závlačky a podobné, potom sú to rózne druhy lepidiel, pričom ak sa jedná o tavné lepidlá, tieto sa roztavia a nanesú na spájaný materiál před jeho vlastným spájaním. Ďalej sú to organické roztavené látky, ktoré sa do vyfrézováných drážok (otvorov) spojovaných pórovitých pevných materiálov vstrekuje pod tlakorn a po vychladnutí zabezpečí pevný spoj. Vačšina spomenutých sposobov spájania vyžaduje přesné opracovanie spojov, přesné přípravky na spájanie korpusov s využíváním rózne pósobiacich přítlačných zariadení.BACKGROUND OF THE INVENTION The present invention relates to a method for bonding solid materials, namely a solid organic material, by melting it and stiffening it to form a solid bond, particularly for porous materials. Nowadays, various types of mechanical fasteners such as bolts, wedges, eccentrics, rivets, cotter pins and the like are used in the furniture and timber joining industry, such as bolts, wedges, eccentrics, and these are various types of adhesives, with are melted and applied to the binder prior to joining. Furthermore, they are organic molten substances which are injected into the milled grooves (openings) of the bonded porous solids under pressure and provide a firm bond after cooling. Most of the aforementioned joining processes require precise joint processing, precision fixtures for joining corpora with the use of pressurized pressure devices.

Uvedené spůsoby spájania doplňuje a nedostatky odstraňuje sposob spájania pevných materiálov pevnou organickou látkou, ktorého podstata spočívá v tom, že medzi pevné spájané materiály, v ktorých je vyhotovená drážky potřebného tvaru, sa vloží pevný tavný organický prvok, na ktorého kovové vývody sa privedie elektrické napatie od 12 V do 40 V o prúde 10 A až 30 A po dobu 5 až 20 sekúnd a po- dosiahnutí tavenia organického prvku sa preruší přívod elektrického prúdu a nastáva stuhnutie a vytvorenie pevného spoja.The aforementioned joining methods are remedied by the method of joining solid materials with a solid organic substance, wherein a solid organic melting element is inserted between the solid bonded materials in which the grooves of the required shape are formed, to which the metal terminals are supplied with electrical tension. from 12 V to 40 V by a current of 10 A to 30 A for 5 to 20 seconds, and the melting of the organic element is interrupted by the electric current supply and solidification and solid bonding occur.

Nový účinok spájania pevných materiálov organickými látkami odporovou metodou sa prejavuje v tom, že umožňuje tvorbu pev-The new effect of bonding solids with organic materials by the resistive method is that it allows the formation of

Claims

OBJECT A method of bonding solid materials with an organic substance, characterized in that a solid organic melt of polyamide 6 is inserted between the solid bonded materials in which the groove of the required shape is formed, to which the metal outlets are connected to several corner joints in the manufacture of different materials. products as well as cabinets of furniture cabinets and assemblies without the use of complex and precise devices and joining under the pressure without the need for very precise machining of jointed joints. In forming the individual box assemblies, it allows the formation of rigid assemblies without the use of double walls in that the bottom of one cabinet can also be the top of the cabinet located underneath and similar to the side, where the right side of one cabinet can be simultaneously the left side of the adjacent cabinet. When creating furniture sets without double walls in the proposed way, it is possible to achieve maximum variability of their creation in terms of consumer requirements. Figures 1 to 4 show the embodiments of a solid bonding organic element with a sealed metal resistance (wire mesh - plates, Figures 6 to 11 illustrate some examples of embodiments of visible corner joints of an organic material according to the invention. is carried out as follows: the organic element 1 of PA 6 of the respective shape with a sealed metal resistor and lead out metal outlets 2 is inserted between the materials to be joined 3 into a shape groove 4, and an electrical voltage of 24 V and a current of 15 A is applied to the metal outlets 2. Upon reaching the degree of melting of the organic substance (PA 6), the power supply is interrupted and at an operating temperature of 18 to 20 ° C, the bonding organic element 1 is solidified at a time of about 45 seconds. And up to 30 A for 5 to 20 seconds and after melting has been achieved the electrical element is cut off and the solidification and solid bonding occur between 30 seconds and 1 minute.

2 sheets of drawings 254670

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