CS259554B1 - Low-cure, inherently pasty solder - Google Patents

Abstract

Low-corrosive soft paste solder with rosin content is intended for soft soldering, especially of electrically conductive parts of a wide range of product types, mainly in the electrical industry, but also for joining parts of other product types. The essence of the low-corrosive soft paste solder, consisting mainly of soft solder in the form of SnPb-based powder and rosin, is defined by the content of 77.7 to 88.5 wt. % soft solder in the form of powder, 3.2 to 8.7 wt. % rosin, 1.2 to 3.5 wt. % zinc stearate, 0.2 to 2.4 wt. % ammonium chloride, 1.3 to 5.9 wt. % diethylene glycol and 1.8 to 5.5 wt. % triethanolamine.

Description

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BACKGROUND OF THE INVENTION The present invention relates to a low-corrosive colostrum-containing blast-like solder.

The prior art brazing process currently employs the most advanced pasty solder that the component cleaning and diffusion properties are based on chlorides, polyethylene glycol, glycerin, ethylene glycol, starch, water and the like. The undesirable properties of the pasty solder used so far include corrosive residues, excessive smoke development, excessive flux, high release rates, depending on the refinement fineness, paste spraying, extrusion of bonding mastic in some types of bonded bonding, technological-operative and economical the non-directional dosing as well as the constant content of solder in the paste. Of these undesirable properties, their unacceptability is generally known. In the manufacture of gums and the like. it causes excessive spillage degradation of the bonding agent, reduces the locally effective amount of cleansing and diffusion-promoting liquids, stains, and degrades the bonding environment to an undesirable extent. Also, the excessively rapid release of fumes produces a concomitant decrease in the active substance content in the flux and moves the chemical-thermal reaction to an unsuitable to non-efficient area, thereby increasing the overall consumption of the solder. It is desirable from the manufacturing and technological point of view that the pasty braze is transported to the site of the joint in a limited amount, while at the same time ensuring a constant content of solder in the paste, for example by precise automatic dosing.

Existing, noncorrosive or low-coccurate, pasty solder pastes with colophony content, these undesirable properties of anni-induced deficiencies did not allow any desired effect to be achieved.

The aforementioned drawbacks in a considerable or complete manner removes the low-rust, round-phony, pasty solder solder, the essence of which is its overall composition concept in weight percentages of 77.7 to 88.5%, the powdered braze on SnPb base, from 3.2 to 8.7% colophony, 1.2 to 3.5% zinc stearate, 0.2 to 2.4% ammonium chloride, 1.3 to 5.9% diethylene glycol and 1, 8 to 5.6% triethanolamine. The low-corrosive, damp pasty solder comprising colophony according to the invention has a composition and consistency with consistently high uniformity of component distribution, which allows its dispensing by preserving high uniformity of the components even in particularly small doses ranging from 0.05 g higher. Of particular importance is the uniformity of the distribution and the constant ratios of the solder and the flux component of the paste-like solder, which increases the performance of its basic functions. The soft paste of the present invention allows for dosing by known methods, i.e., automatically under pressure, within a wide dosage range, with the constant rheological properties of the paste applied at ambient temperature. The present invention is applicable to soldering Cu, Ag, their alloys, steels and their nickel-plated surfaces. It can be stored in commercially sealed containers, while its long-term storage does not change its properties. The paste does not sediment and does not shed.

The control of the uniformity of the components is based on the tried and tested methodological concept, which is defined by checking the ratio of the solder content to the content of the residue by weighing from a uniform determined amount taken from the sample. The basic measure is determined by directing the charge and measuring the fresh product. Against this background, it is considered that the uniformity of the distribution of the components in the rhodium content site is based on the sample (s) from each batch, the sedimentation pattern.

In particular, drying is monitored as a technological parameter directly in production. The consistency of the consistency towards the top would be reduced by small doses (stiffness would increase) and the adhesion and positioning of the soldered object would decrease. Production controls in the 1st and 3rd months show the same results and full consumer satisfaction. The low-corrosive, damp pasty solder comprises colophony according to the invention, with flow parameters and capillarity conditions even at high temperature rise rates of up to 10 ° C. s-1 up to the desired working temperature. The introduced solder heat in the required temperature range causes less smoke to be absorbed in the paste, resulting in reduced paste spraying and completely or largely stopped extrusion of the additional solder joint sealant. The flux residues are particularly corrosive due to the appropriate ratio between the relatively high proportion of colophony and zinc stearate to the low ammonium chloride moiety, and can be purified if necessary by washing with either a suitable solvent but also with water as required.

According to the invention, low-yielding pasty solder pastes with colophony have been produced in a defined range of component-paste solders of 77.7% by weight composition. powdered solder solder, 8.7% wt. colophony, 3.5% wt. % of stearous gum, 2.4 wt. % ammonium chloride, 5.9 wt. % diethylene glycol and 1.8 wt. triethanolamine to paste solder composition of 88.5 wt. of soft solder in tva-re powder, 3.2 wt. colophony, 1.2%

Claims (1)

239554 wt. zinc stearate, 0.2 wt% ammonium chloride, 1.3 wt% ammonium chloride; % diethylene glycol and 5.6 wt. triethanolamine. As a rule, the rapid rate of heat build-up during soldering is usually measured by the time required to achieve solder temperature, or at least the lower limit of solder temperature from ambient and ambient. It depends heavily on the yield of the heat source, against the total heat dissipation, in the case of one burner type at a suitable set thermal output and the same weld rate was measured for an area of 20 to 250 degrees Celsius 2.4 s. Sn4OPbmala base solidus-liquidus range 200-208 ° C. High gas generators with constant impact on solder spray were constant. The spraying was measured by weighing the charged batch of solder flux (2 g), weighing the soldered item and weighing the article after soldering, together with the solder, the difference in weight being defined by the spatial spray. In the present case, the spatter was 0.34 g. At the same time, due to the spatter, the inadequate coverage of the solder binder would occur by all negative phenomena. In the case of a non-corrosive SnPb-based, non-corrosive paste braze of the invention, the same torch, set to a higher thermal performance, was used with the same weld. The heat output was about 20% higher than the previous test for growth and splash. The rate of increase for the range of 20-250 ° C was 1.9 s. The solidus-liquidus range for the solder was 163 to 17 ° C. Low gas formation, with low speed, without the effect of solder spraying was determined. The spread was measured as the first dose of noncorrosive solder solder 2 g, solder weight 1.91 g. Loss0.09 g corresponds to heat degassing. Metal spray was not detected. In all cases, low-corrosive, colophony-containing solders containing PREDMET low-rusted, low-paste, pasty, bonded in a solder base based on SnPb and colophony, comprising 77.7 to 88.5% by weight. Powder solder solder, 3.2 to the invention showed an increase in temperature rise rate to working temperature over paste spray, further showed good soldering properties even in limited bonding conditions, good dispensability, particularly low flux and solder joints, especially on sockets sulfite gums and the like. In particular, more extensive tests have been carried out on the coarseness of the macaque pasty solder. The method of corrosion resistance of a pasty solder is based on the determination and measurement of the degree of corrosion through the size (quantity, quality, type) of the compounds, or compounds, by which a state of balanced neutrality of the measured and measured substance can be induced. In the case of pasty solders with acidic reaction, it is usually carried out by means of KOH, which is injected into the solder in an amount which induces the complete and long-term neutrality of the mixture. The KOH proportion in mg is an expression of the degree of co-activity of the substance under investigation. For orientation, we mention the degree of corrosion of the Multicore Sollder, Oxide Free, SN 60, PRAB 60, New West York, 590 590 Wood Lane End, Hemel Hempstead, Herts, UK England. 10.9 to 11.8 mg of KOH, and a degree of corrosion, e.g., brazed colophony, which is generally known to be a low corrosive flux and which has a corrosion resistance of 104 to 115 mg KOH. The metering and evaluation of the low-corrosive macaque braze solder according to the invention has an equivalent corrosivity of 16.8 to 17.6 mg KOH per 10 g of the test sample. Colophony low-resilient, low-paste, pasty solder is mainly used for serial and mass automated soldering, but it is also fully usable in repair, production, tare, small-lot and special individual production as well as in households for maternity work and minor maintenance. 8.7 wt. 1.2 to 3.5% by weight of zinc stearate; 0.2 to 2.4% by weight of ammonium chloride; diethylene glycol and 1.8 to 5.5 wt. triethylamine.