CU22566A3 - Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construcción electrónicos en las superficies de la placa conductora - Google Patents

Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construcción electrónicos en las superficies de la placa conductora

Info

Publication number
CU22566A3
CU22566A3 CU1997016A CU1997016A CU22566A3 CU 22566 A3 CU22566 A3 CU 22566A3 CU 1997016 A CU1997016 A CU 1997016A CU 1997016 A CU1997016 A CU 1997016A CU 22566 A3 CU22566 A3 CU 22566A3
Authority
CU
Cuba
Prior art keywords
conductive plate
construction elements
electronic construction
electronic
conductor board
Prior art date
Application number
CU1997016A
Other languages
English (en)
Inventor
Thomas Lade
Carsten Storbeck
Ralf-Dieter Busse
Original Assignee
Krone Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Krone Gmbh filed Critical Krone Gmbh
Publication of CU22566A3 publication Critical patent/CU22566A3/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La invención se refiere a una placa conductora (1) y a un procedimiento para el posicionamiento preciso de los elementos de construcción electrónicos en la superficie (12) de la placa conductora (1), en cuyo caso los elementos de construcción electrónicos han de ser unidos de forma eléctricamente conductiva y estable en la placa conductora (1), mediante la técnica de soldadura Reflow. Para ello, se emplea una placa conductora (1) que dispone de zonas (2,3), por lo menos parcialmente adaptadas a los elementos de construcción electrónicos en la superficie (12) del contorno exterior, para el alojamiento de los elementos de construcción electrónicos. Estas zonas que están configuradas como contornos de hendidura (3) o como ranuras elaboradas (2), aseguran que los elementos de construcción electrónicos colocados quedan sujetados en la posición deseada, después de la aplicación de la pasta de soldar y antes de la propia realización de soldadura. Adicionalmente, se puede empalmar la placa conductora equipada, con una caja consistente en los aditamentos de configuración abovedada de un material por lo menos parcialmente conformable. Los aditamentos, atravesando la placa conductora, se introducen en las escotaduras (14, 15 ó 17) elaboradas en ella y así se consigue una unión contundente en forma y/o fuerza entre la caja y la placa conductora mediante la conformación de los aditamentos (14). Además se puede colocar un enchufe de protección contra sobre tensiones para las regletas de la técnica de telecomunicación con un descargador de sobre tensión (4), que une las dos funciones de "contacto a tierra"y "contacto fail-safe" en una misma pieza y por lo tanto, se puede realizar un equipamiento con un montaje con costes y esfuerzos reducidos.
CU1997016A 1996-03-18 1997-02-03 Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construcción electrónicos en las superficies de la placa conductora CU22566A3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19610586A DE19610586B4 (de) 1996-03-18 1996-03-18 Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte

Publications (1)

Publication Number Publication Date
CU22566A3 true CU22566A3 (es) 1999-08-03

Family

ID=7788627

Family Applications (1)

Application Number Title Priority Date Filing Date
CU1997016A CU22566A3 (es) 1996-03-18 1997-02-03 Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construcción electrónicos en las superficies de la placa conductora

Country Status (3)

Country Link
CU (1) CU22566A3 (es)
DE (1) DE19610586B4 (es)
ZA (1) ZA972269B (es)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1942135U (de) * 1965-03-06 1966-07-14 Norbert Knauer Gedruckte elektrische schaltung.
GB1246127A (en) * 1968-08-20 1971-09-15 Lilly Industries Ltd Bis-piperazinyl compounds
DE8600878U1 (de) * 1986-01-16 1986-02-27 Philips Patentverwaltung GmbH, 22335 Hamburg Elektrische Schaltungsplatte aus einem isolierenden Schichtstoff-Papiermaterial
JPH02224293A (ja) * 1989-02-27 1990-09-06 Toshiba Corp 印刷配線板
DE9012638U1 (de) * 1990-09-04 1990-11-08 Siemens AG, 8000 München Im Spritzgußverfahren hergestellte Leiterplatte
JPH04373198A (ja) * 1991-06-21 1992-12-25 Sony Corp プリント基板
DE9201118U1 (de) * 1992-01-30 1992-03-12 Siemens AG, 8000 München Leiterplatte

Also Published As

Publication number Publication date
DE19610586A1 (de) 1997-09-25
DE19610586B4 (de) 2006-04-27
ZA972269B (en) 1998-09-17

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