CZ20052A3 - Bezolovnatá pájka - Google Patents
Bezolovnatá pájkaInfo
- Publication number
- CZ20052A3 CZ20052A3 CZ20050002A CZ20052A CZ20052A3 CZ 20052 A3 CZ20052 A3 CZ 20052A3 CZ 20050002 A CZ20050002 A CZ 20050002A CZ 20052 A CZ20052 A CZ 20052A CZ 20052 A3 CZ20052 A3 CZ 20052A3
- Authority
- CZ
- Czechia
- Prior art keywords
- leadless solder
- bismuth
- tin
- solder
- leadless
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical group [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Bezolovnatá pájka je tvořená slitinou na bázi bismutu a cínu, přičemž tato slitina obsahuje 1,5 až 18 % hmotn. bismutu 0,2 až 1,8 % hmotn.mědi a/nebo 0,1 až 1,8 % hmotn. stříbra, a zbytek tvoří cín.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CZ20050002A CZ300575B6 (cs) | 2005-01-04 | 2005-01-04 | Bezolovnatá pájka |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CZ20050002A CZ300575B6 (cs) | 2005-01-04 | 2005-01-04 | Bezolovnatá pájka |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CZ20052A3 true CZ20052A3 (cs) | 2007-01-31 |
| CZ300575B6 CZ300575B6 (cs) | 2009-06-17 |
Family
ID=37685403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CZ20050002A CZ300575B6 (cs) | 2005-01-04 | 2005-01-04 | Bezolovnatá pájka |
Country Status (1)
| Country | Link |
|---|---|
| CZ (1) | CZ300575B6 (cs) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CS214623B1 (cs) * | 1980-04-09 | 1982-05-28 | Pavel Sefl | Nízkotavná pájka na bázi olova nebo cínu |
| KR19980068127A (ko) * | 1997-02-15 | 1998-10-15 | 김광호 | 납땜용 무연 합금 |
| JP4338854B2 (ja) * | 1999-11-25 | 2009-10-07 | 三井金属鉱業株式会社 | スズ−ビスマス系無鉛はんだ |
| CN1128037C (zh) * | 2000-10-24 | 2003-11-19 | 北京工业大学 | 含稀土的锡基无铅钎料及其制备方法 |
| RU2254971C2 (ru) * | 2000-11-16 | 2005-06-27 | Сингапур Асахи Кемикал Энд Соулдер Индастриз Птэ. Лтд. | Бессвинцовый припой |
| JP2002248596A (ja) * | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | 耐酸化性に優れる鉛レス半田ボール |
| CN1555960A (zh) * | 2004-01-10 | 2004-12-22 | 大连理工大学 | 锡锌铜无铅钎料合金 |
-
2005
- 2005-01-04 CZ CZ20050002A patent/CZ300575B6/cs not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CZ300575B6 (cs) | 2009-06-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Patent lapsed due to non-payment of fee |
Effective date: 20150104 |