CZ290052B6 - Způsob a zapojení pro vytváření proudových impulzů pro elektrolytické vylučování kovů - Google Patents
Způsob a zapojení pro vytváření proudových impulzů pro elektrolytické vylučování kovů Download PDFInfo
- Publication number
- CZ290052B6 CZ290052B6 CZ19981700A CZ170098A CZ290052B6 CZ 290052 B6 CZ290052 B6 CZ 290052B6 CZ 19981700 A CZ19981700 A CZ 19981700A CZ 170098 A CZ170098 A CZ 170098A CZ 290052 B6 CZ290052 B6 CZ 290052B6
- Authority
- CZ
- Czechia
- Prior art keywords
- current
- bath
- pulse
- galvanizing
- electroplating
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000009713 electroplating Methods 0.000 title claims abstract description 20
- 238000004804 winding Methods 0.000 claims abstract description 29
- 239000003990 capacitor Substances 0.000 claims abstract description 14
- 238000005246 galvanizing Methods 0.000 claims description 44
- 238000007747 plating Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 4
- 230000010363 phase shift Effects 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 abstract description 4
- 238000007599 discharging Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 150000002739 metals Chemical group 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 210000001061 forehead Anatomy 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Ac-Ac Conversion (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19547948A DE19547948C1 (de) | 1995-12-21 | 1995-12-21 | Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CZ170098A3 CZ170098A3 (cs) | 1998-10-14 |
| CZ290052B6 true CZ290052B6 (cs) | 2002-05-15 |
Family
ID=7780889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CZ19981700A CZ290052B6 (cs) | 1995-12-21 | 1996-09-27 | Způsob a zapojení pro vytváření proudových impulzů pro elektrolytické vylučování kovů |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6132584A (2) |
| EP (1) | EP0868545B1 (2) |
| JP (1) | JP4028892B2 (2) |
| KR (1) | KR100465545B1 (2) |
| CN (1) | CN1093337C (2) |
| AT (1) | ATE186081T1 (2) |
| BR (1) | BR9612163A (2) |
| CA (1) | CA2241055A1 (2) |
| CZ (1) | CZ290052B6 (2) |
| DE (2) | DE19547948C1 (2) |
| ES (1) | ES2139388T3 (2) |
| WO (1) | WO1997023665A1 (2) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174425B1 (en) * | 1997-05-14 | 2001-01-16 | Motorola, Inc. | Process for depositing a layer of material over a substrate |
| US6793796B2 (en) | 1998-10-26 | 2004-09-21 | Novellus Systems, Inc. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| US6946065B1 (en) * | 1998-10-26 | 2005-09-20 | Novellus Systems, Inc. | Process for electroplating metal into microscopic recessed features |
| US6344419B1 (en) | 1999-12-03 | 2002-02-05 | Applied Materials, Inc. | Pulsed-mode RF bias for sidewall coverage improvement |
| US6231743B1 (en) | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
| KR20020078307A (ko) | 2001-04-09 | 2002-10-18 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 제조 방법 |
| DE10259365A1 (de) * | 2002-04-08 | 2003-10-30 | Siemens Ag | Vorrichtung und Verfahren zur Entfernung von Oberflächenbereichen eines Bauteils |
| NL1022786C2 (nl) * | 2003-02-26 | 2004-08-30 | Tendris Solutions Bv | Omzetschakeling, systeem en werkwijze voor het uitvoeren van een elektrochemisch proces. |
| DE10311575B4 (de) * | 2003-03-10 | 2007-03-22 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis |
| US20070068821A1 (en) * | 2005-09-27 | 2007-03-29 | Takahisa Hirasawa | Method of manufacturing chromium plated article and chromium plating apparatus |
| RU2248416C1 (ru) * | 2003-11-04 | 2005-03-20 | Никифоров Алексей Александрович | Устройство для микродугового оксидирования |
| US20050157475A1 (en) * | 2004-01-15 | 2005-07-21 | Endicott Interconnect Technologies, Inc. | Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
| DE102004045451B4 (de) | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| SE0403047D0 (sv) * | 2004-12-14 | 2004-12-14 | Polymer Kompositer I Goeteborg | Pulse-plating method and apparatus |
| PL377451A1 (pl) * | 2005-10-05 | 2007-04-16 | Instytut Wysokich Ciśnień PAN | Sposób prowadzenia reakcji i reaktor chemiczny |
| EP1890004A1 (de) | 2006-08-08 | 2008-02-20 | Siemens Aktiengesellschaft | Verfahren zum Herstellen einer Nutzschicht aus wiederverwendetem Schichtmaterial |
| DE102006044416A1 (de) * | 2006-09-18 | 2008-03-27 | Siemens Ag | Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen |
| US20080271995A1 (en) * | 2007-05-03 | 2008-11-06 | Sergey Savastiouk | Agitation of electrolytic solution in electrodeposition |
| US8603864B2 (en) | 2008-09-11 | 2013-12-10 | Infineon Technologies Ag | Method of fabricating a semiconductor device |
| US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US9011706B2 (en) * | 2008-12-16 | 2015-04-21 | City University Of Hong Kong | Method of making foraminous microstructures |
| US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
| JP6161863B2 (ja) * | 2010-12-28 | 2017-07-12 | 株式会社荏原製作所 | 電気めっき方法 |
| US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
| CN102277603A (zh) * | 2011-08-03 | 2011-12-14 | 深圳大学 | 一种感应热/电沉积制备涂层或薄膜的装置及方法 |
| CA2929515C (en) * | 2013-11-19 | 2019-12-31 | Hecker Electronica Potencia Y Procesos S.A. | Process for superimposing ac over dc used in copper, or other products, electrowinning or electrorefining processes, wherein the ac source is connected between two consecutive cells from the group of electrolytic cells using an inductor to inject ac and a capacitor to close the electrical circuit |
| EP3029178A1 (en) | 2014-12-05 | 2016-06-08 | ATOTECH Deutschland GmbH | Method and apparatus for electroplating a metal onto a substrate |
| JP7358238B2 (ja) | 2016-07-13 | 2023-10-10 | イオントラ インコーポレイテッド | 電気化学的方法、装置及び組成物 |
| RU2722754C1 (ru) * | 2019-04-23 | 2020-06-03 | Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") | Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах |
| CN114836797B (zh) * | 2022-05-12 | 2023-08-29 | 广州市慧科高新材料科技有限公司 | 一种基于脉冲搭桥的通孔填孔电镀工艺 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3616434A (en) * | 1968-04-18 | 1971-10-26 | Novachrome Inc | Apparatus with power source for plating |
| US3959088A (en) * | 1975-03-19 | 1976-05-25 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for generating high amperage pulses from an A-C power source |
| CH629542A5 (de) * | 1976-09-01 | 1982-04-30 | Inoue Japax Res | Verfahren und vorrichtung zur galvanischen materialablagerung. |
| US4208254A (en) * | 1976-09-22 | 1980-06-17 | Satoshi Ichioka | Method of plating an iron-cobalt alloy on a substrate |
| US4517059A (en) * | 1981-07-31 | 1985-05-14 | The Boeing Company | Automated alternating polarity direct current pulse electrolytic processing of metals |
| GB8801827D0 (en) * | 1988-01-27 | 1988-02-24 | Jct Controls Ltd | Improvements in electrochemical processes |
| DE4005346A1 (de) * | 1990-02-20 | 1991-08-22 | Siemens Ag | Verfahren zur erzeugung von hochfrequenten strompulsen mit steilen pulsflanken in galvanikanlagen und versorgungsschaltung zur durchfuehrung des verfahrens |
-
1995
- 1995-12-21 DE DE19547948A patent/DE19547948C1/de not_active Expired - Fee Related
-
1996
- 1996-09-27 WO PCT/EP1996/004232 patent/WO1997023665A1/de not_active Ceased
- 1996-09-27 US US09/091,136 patent/US6132584A/en not_active Expired - Fee Related
- 1996-09-27 EP EP96934478A patent/EP0868545B1/de not_active Expired - Lifetime
- 1996-09-27 CA CA002241055A patent/CA2241055A1/en not_active Abandoned
- 1996-09-27 DE DE59603510T patent/DE59603510D1/de not_active Expired - Fee Related
- 1996-09-27 JP JP52324197A patent/JP4028892B2/ja not_active Expired - Fee Related
- 1996-09-27 BR BR9612163A patent/BR9612163A/pt not_active Application Discontinuation
- 1996-09-27 ES ES96934478T patent/ES2139388T3/es not_active Expired - Lifetime
- 1996-09-27 CZ CZ19981700A patent/CZ290052B6/cs not_active IP Right Cessation
- 1996-09-27 KR KR10-1998-0704072A patent/KR100465545B1/ko not_active Expired - Fee Related
- 1996-09-27 CN CN96199166A patent/CN1093337C/zh not_active Expired - Fee Related
- 1996-09-27 AT AT96934478T patent/ATE186081T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE19547948C1 (de) | 1996-11-21 |
| HK1017392A1 (en) | 1999-11-19 |
| CN1205745A (zh) | 1999-01-20 |
| KR100465545B1 (ko) | 2005-02-28 |
| CA2241055A1 (en) | 1997-07-03 |
| EP0868545B1 (de) | 1999-10-27 |
| KR19990071793A (ko) | 1999-09-27 |
| ES2139388T3 (es) | 2000-02-01 |
| JP4028892B2 (ja) | 2007-12-26 |
| CZ170098A3 (cs) | 1998-10-14 |
| BR9612163A (pt) | 1999-07-13 |
| JP2000505145A (ja) | 2000-04-25 |
| DE59603510D1 (de) | 1999-12-02 |
| CN1093337C (zh) | 2002-10-23 |
| US6132584A (en) | 2000-10-17 |
| ATE186081T1 (de) | 1999-11-15 |
| EP0868545A1 (de) | 1998-10-07 |
| WO1997023665A1 (de) | 1997-07-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PD00 | Pending as of 2000-06-30 in czech republic | ||
| MM4A | Patent lapsed due to non-payment of fee |
Effective date: 20060927 |