CZ310612B9 - Způsob analýzy předmětu a přístroj s částicovým paprskem pro provádění způsobu - Google Patents
Způsob analýzy předmětu a přístroj s částicovým paprskem pro provádění způsobuInfo
- Publication number
- CZ310612B9 CZ310612B9 CZ2015-916A CZ2015916A CZ310612B9 CZ 310612 B9 CZ310612 B9 CZ 310612B9 CZ 2015916 A CZ2015916 A CZ 2015916A CZ 310612 B9 CZ310612 B9 CZ 310612B9
- Authority
- CZ
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- Prior art keywords
- detector segment
- control device
- detection units
- particle
- analyzing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/2206—Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement
- G01N23/2208—Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement all measurements being of a secondary emission, e.g. combination of SE measurement and characteristic X-ray measurement
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
- G01N23/203—Measuring back scattering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
- G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
- G01N23/2254—Measuring cathodoluminescence
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G1/00—X-ray apparatus involving X-ray tubes; Circuits therefor
- H05G1/08—Electrical details
- H05G1/64—Circuit arrangements for X-ray apparatus incorporating image intensifiers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2441—Semiconductor detectors, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2446—Position sensitive detectors
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Toxicology (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Engineering & Computer Science (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
Vynález se týká způsobu analýzy předmětu částicovým zářičem, například elektronovým zářičem a/nebo iontovým zářičem, nebo rentgenovým přístrojem. Dále se vynález týká částicového zářiče nebo rentgenového přístroje, se kterým je způsob prováděn. U způsobu jsou do řídicího zařízení (404) natahovány informace o předmětu z datové paměti (409). Dále je identifikována skupina detekčních jednotek (1 až 30) z velkého množství detekčních jednotek (1 až 30) prostřednictvím informací, natažených do řídicího zařízení (404). Skupina detekčních jednotek (1 až 30) je při použití řídicího zařízení (404) vytvořena jako první detektorový segment. Přivedením svazku částicového záření na předmět a řádkováním předmětu svazkem částicového záření jsou vytvářeny částice ze vzájemného působení a/nebo záření ze vzájemného působení, které jsou detekovány, přičemž z detektorového segmentu je odečítán signál detektorového segmentu. Potom je vytvořeno znázornění předmětu prostřednictvím prvního signálu detektorového segmentu a předmět je prostřednictvím znázornění předmětu v analytické jednotce (401) analyzován.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014226985.7A DE102014226985B4 (de) | 2014-12-23 | 2014-12-23 | Verfahren zum Analysieren eines Objekts, Computerprogrammprodukt sowie Teilchenstrahlgerät zur Durchführung des Verfahrens |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| CZ2015916A3 CZ2015916A3 (cs) | 2016-07-07 |
| CZ310612B6 CZ310612B6 (cs) | 2026-01-28 |
| CZ310612B9 true CZ310612B9 (cs) | 2026-05-06 |
Family
ID=56129096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CZ2015-916A CZ310612B9 (cs) | 2014-12-23 | 2015-12-18 | Způsob analýzy předmětu a přístroj s částicovým paprskem pro provádění způsobu |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9535020B2 (cs) |
| CZ (1) | CZ310612B9 (cs) |
| DE (1) | DE102014226985B4 (cs) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6425096B2 (ja) * | 2015-05-14 | 2018-11-21 | 国立大学法人 東京大学 | 電子顕微鏡および測定方法 |
| KR102468155B1 (ko) * | 2017-02-07 | 2022-11-17 | 에이에스엠엘 네델란즈 비.브이. | 하전 입자 검출 방법 및 장치 |
| DE112017007498B4 (de) * | 2017-06-02 | 2020-11-19 | Hitachi High-Tech Corporation | Ladungsträgerstrahlvorrichtung |
| JP6929760B2 (ja) * | 2017-11-07 | 2021-09-01 | キヤノン株式会社 | 電子線検出素子、電子顕微鏡、透過型電子顕微鏡 |
| KR102198707B1 (ko) | 2019-03-25 | 2021-01-05 | (주)코셈 | 착탈 가능한 컬럼을 구비하는 주사 전자 현미경 및, 이를 이용한 영상 획득 방법 |
| EP3736561B1 (en) * | 2019-05-08 | 2021-05-05 | Bruker Nano GmbH | Method for improving an ebsd/tkd map |
| US11114275B2 (en) * | 2019-07-02 | 2021-09-07 | Fei Company | Methods and systems for acquiring electron backscatter diffraction patterns |
| US11227743B2 (en) * | 2019-08-20 | 2022-01-18 | Attolight AG | Accurate wavelength calibration in cathodoluminescence SEM |
| DE102019214936A1 (de) * | 2019-09-27 | 2021-04-01 | Carl Zeiss Microscopy Gmbh | Verfahren zum Bestimmen einer Materialzusammensetzung eines Objekts mit einem Teilchenstrahlgerät, Computerprogrammprodukt und Teilchenstrahlgerät zur Durchführung des Verfahrens sowie System mit einem Teilchenstrahlgerät |
| US11094501B2 (en) * | 2019-11-19 | 2021-08-17 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Secondary charged particle imaging system |
| EP3835768B1 (en) * | 2019-12-13 | 2021-10-27 | Bruker Nano GmbH | Method for improving kikuchi diffraction patterns |
| DE102021205001B4 (de) * | 2021-05-18 | 2023-07-27 | Carl Zeiss Microscopy Gmbh | Verfahren zum Positionieren von Objekten in einem Teilchenstrahlmikroskop mithilfe einer flexiblen Teilchenstrahlschranke sowie Computerprogrammprodukt |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4897545A (en) | 1987-05-21 | 1990-01-30 | Electroscan Corporation | Electron detector for use in a gaseous environment |
| US5973323A (en) | 1997-11-05 | 1999-10-26 | Kla-Tencor Corporation | Apparatus and method for secondary electron emission microscope |
| US6201240B1 (en) | 1998-11-04 | 2001-03-13 | Applied Materials, Inc. | SEM image enhancement using narrow band detection and color assignment |
| DE10156275B4 (de) | 2001-11-16 | 2006-08-03 | Leo Elektronenmikroskopie Gmbh | Detektoranordnung und Detektionsverfahren |
| US7010088B2 (en) * | 2003-07-22 | 2006-03-07 | General Electric Company | Multi-slice CT multi-layer flexible signal transmission detector circuit |
| DE102006029184A1 (de) * | 2006-06-24 | 2007-12-27 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Photonendetektor |
| US7525090B1 (en) * | 2007-03-16 | 2009-04-28 | Kla-Tencor Technologies Corporation | Dynamic centering for behind-the-lens dark field imaging |
| US7787588B1 (en) * | 2008-07-21 | 2010-08-31 | Xradia, Inc. | System and method for quantitative reconstruction of Zernike phase-contrast images |
| US7932495B2 (en) * | 2008-09-02 | 2011-04-26 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Fast wafer inspection system |
| DE102009024928B4 (de) | 2009-04-06 | 2012-07-12 | Bruker Nano Gmbh | Detektor, Vorrichtung und Verfahren zur gleichzeitigen, energiedispersiven Aufnahme von Rückstreuelektronen und Röntgenquanten |
| JP5430216B2 (ja) | 2009-04-30 | 2014-02-26 | 東海旅客鉄道株式会社 | 台車横移動規制装置 |
| EP2346094A1 (en) | 2010-01-13 | 2011-07-20 | FEI Company | Method of manufacturing a radiation detector |
| US8629395B2 (en) | 2010-01-20 | 2014-01-14 | Hitachi High-Technologies Corporation | Charged particle beam apparatus |
| DE102011012989B4 (de) | 2011-03-03 | 2019-05-02 | Ketek Gmbh | Sensorkopf für einen Röntgendetektor |
| WO2013003566A2 (en) * | 2011-06-29 | 2013-01-03 | Viztek, Llc | Digital retrofit system and method for x-ray radiography |
| EP2557584A1 (en) | 2011-08-10 | 2013-02-13 | Fei Company | Charged-particle microscopy imaging method |
| JP5914404B2 (ja) * | 2012-04-12 | 2016-05-11 | 富士フイルム株式会社 | X線露出制御装置、x線画像検出装置及びx線画像撮影システム |
| US8729466B1 (en) | 2013-03-14 | 2014-05-20 | Electron Optica, Inc. | Aberration-corrected and energy-filtered low energy electron microscope with monochromatic dual beam illumination |
-
2014
- 2014-12-23 DE DE102014226985.7A patent/DE102014226985B4/de active Active
-
2015
- 2015-12-17 US US14/972,589 patent/US9535020B2/en active Active
- 2015-12-18 CZ CZ2015-916A patent/CZ310612B9/cs unknown
-
2016
- 2016-10-20 US US15/298,689 patent/US20170038321A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014226985A1 (de) | 2016-07-07 |
| US20170038321A1 (en) | 2017-02-09 |
| US20160178543A1 (en) | 2016-06-23 |
| US9535020B2 (en) | 2017-01-03 |
| CZ310612B6 (cs) | 2026-01-28 |
| CZ2015916A3 (cs) | 2016-07-07 |
| DE102014226985B4 (de) | 2024-02-08 |
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