DD143331A1 - FILM CARRIER BOND AND INTERMEDIATE - Google Patents

Abstract

The invention relates to film carrier bonding with intermediate electrical testing of the chips, as well as to a specially structured intermediate carrier. The invention aims to reduce the costs of film carrier bonding with possible intermediate electrical testing of the chips. The invention solves the problem of being able to use cheaper insulation layers and adhesives than previously in film carrier bonding with intermediate electrical testing of the chips after internal bonding. According to the invention, this problem is solved by using a single-layer metal intermediate carrier at least up to the "internal chip bonding*" step, and only then is an insulation layer with cutouts applied. - Fig. 2 -

Description

-4- Zl 2 55

Film carrier bonds and intermediate carrier

Field of application of the invention

The invention relates to film carrier bonding, i. the contacting of semiconductor devices (chips) using ribbon-like intermediate carriers with kinofilmartiger perforation at the edges, wherein an electrical intermediate test of the chips after Innenleiterbonden is possible, and a specially structured for this intermediate carrier.

Characteristic of the known technical solutions

Film carrier bonding is known as a productive bonding process. The subcarrier consists of one, two or three layers.

The multilayer designs - metal and insulation layer or metal, adhesive and insulation layer - have the advantage that the insulation layer mechanically stiffens the structured metal layer and electrically insulates the conductor tracks. An insulation layer is required in particular for the electrical intermediate testing of the chips after internal bonding.

For intermediate testing, it is necessary that the conductors are arranged electrically isolated from each other. On the other hand, for a prior galvanic finishing of the conductor their electrical connection is required. This means that first an electrical connection must be provided, which then has to be severed.

In a known embodiment of the metal structure, the insulated conductor tracks and Außenkontaktfläch are over

extends the Außenkohtaktbereich out with thin conductor tracks, which unite in four rings. First, the chip can be thermally stressed after internal bonding. At least now, the thin conductor tracks must be electrically separated by punching out the rings and the electrical test follows. The metal structure far beyond the Außenkontaktierbereich also creates a structure that would be completely unstable without the supporting insulation layer even before the punching of the rings.

The insulating layer and the possible adhesive between insulation and metal layer are chemically stressed during film carrier bonding. The metal foil must be etched and electroplated. There are thermal stresses in the inlet processes (burn in), in the interior and possibly in the external contact. Thus, only extremely temperature-resistant and chemically resilient insulation materials and adhesives can be used. The intermediate carriers thus become very expensive.

Single-layer subcarriers are cheaper, but do not allow electrical intermediate testing of the chips after internal bonding. As a result of the further processing of defective chips, greater costs are incurred as compared to film carrier bonding with multilayer carriers and electrical intermediate testing of the chips.

Object of the invention -. ,

The invention aims to reduce the cost of film carrier bonding with possible electrical intermediate testing of the chips.

Explanation of the essence of the invention

The invention solves the problem of being able to use cheaper insulating layers and adhesives in film carrier bonding with electrical intermediate testing of the chips after inner bonding.

According to the invention, the object is achieved in that at least until the step "internal chip bonding" a single-layer intermediate carrier

used metal and only then a cut-out insulation layer is applied ·

The insulation layer is preferably applied only before the step "sever electrical connections". It is then no longer subject to high loads by etching, refining, contacting or enema processes. This allows a cheaper material to be used. · ...

If an additional guard ring is required around the inner bonding surface, then it can be applied beforehand. Since it is enclosed by the housing, it had to consist of higher-quality material according to standard and can therefore also undergo all incriminating process steps.

So either no high quality insulation material is required or only in much smaller quantities.

The method is only applicable if the metal layer is structured as specified in the invention claim and explained in more detail in the exemplary embodiment.

embodiment

In the drawings show

Pig. 1 shows an intermediate carrier according to the invention, in which the conductor ends terminate outside the outer bonding region in a metal surface

Mg · 2 the section corresponding to Fig. 1

3 shows an intermediate carrier according to the invention, in which the conductor ends in the outer bonding region in a metal surface and additional apertures are provided outside the outer bonding region.

Fig. 4 belonging to FIG. 3 Stansschnitt.

A single-layer subcarrier made of metal is patterned according to FIG. V or FIG. 3. Due to the special nature of the structure, a mechanically rigid intermediate substructure arises in contrast to previous structures outside the outer bonding area. He has

as usual, the kinematic perforation 1. The conductors 2 terminate outside the outer bonding region 3 in the metal layer. In the other variant, additional openings 5 are arranged opposite their ends. The inner bonding region 4 is provided for receiving the chip. It can also be reinforced by a polyimide guard ring.

The in the Pig. The structure shown in FIGS. 1 or 3 is etched, the conductors are optionally refined, the chip is bonded inside and thermally stressed (burn in).

Thereafter, an insulating layer 6 of polyester is applied with the cutouts 7 terminating outside the outer contacting surface, e.g. glued. The next step is the separation of the electrical connections by punching according to the figures 2 and 4 · Then it is electrically tested and completed the device as usual.

Claims (4)

Erfindungsahspruch 1. Film carrier bonding using an intermediary carrier with the steps of structuring and, if necessary, refining metal foil, inwardly bonding chips, thermally stressing ("burn in"), severing electrical connections, electrically testing, punching and externally contacting, characterized in that at least until the step "chips internal bonding "used a single-layer intermediate carrier made of metal and only then a cut-out insulation layer is applied. 2. Film carrier bonding according to item 1, characterized in that the insulation layer is applied only before the step "electrical connections cut". 3. Filmtragerbonden according to item 1, characterized in that 'before the step "in-chip chip" on the metal layer in the vicinity of the Innenkontaktierbereich.es a guard ring is attached, which has a higher material quality than the insulating layer. 4. An intermediate carrier for a film carrier bonding, in which a single-layer intermediate carrier made of metal is used until the step "in-chip bonding" and only then applied a cut-out insulating layer, characterized in that the conductor tracks beyond the Außenkontaktierbereich in the remaining metal surface and ends if necessary, additional openings are provided in this metal surface opposite their ends. ^{K / erzu} offer drawings