DD296510A5 - Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung - Google Patents

Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung Download PDF

Info

Publication number: DD296510A5
Authority: DD; German Democratic Republic
Prior art keywords: copper; metallization; swelling agent; base material; etching
Prior art date: 1989-07-06

Application number

DD90342489A

Other languages

German (de)

English (en)

Inventor

Andrea Riedl

Detlef Tessmann

Burkhard Bressel

Original Assignee

Schering Ag,Wb

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-07-06

Filing date

1990-07-04

Publication date

1991-12-05

1990-07-04 Application filed by Schering Ag,Wb filed Critical Schering Ag,Wb

1991-12-05 Publication of DD296510A5 publication Critical patent/DD296510A5/de

Links

238000001465 metallisation Methods 0.000 title claims abstract description 25
229920005989 resin Polymers 0.000 title description 13
239000011347 resin Substances 0.000 title description 13
230000008961 swelling Effects 0.000 claims abstract description 22
239000003795 chemical substances by application Substances 0.000 claims abstract description 20
229920003002 synthetic resin Polymers 0.000 claims abstract description 11
239000000057 synthetic resin Substances 0.000 claims abstract description 11
239000002904 solvent Substances 0.000 claims abstract description 5
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 3
125000000217 alkyl group Chemical group 0.000 claims description 2
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
150000005840 aryl radicals Chemical class 0.000 claims 1
239000000463 material Substances 0.000 abstract description 36
238000004519 manufacturing process Methods 0.000 abstract description 18
-1 glycol ethers Chemical class 0.000 abstract description 11
LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract description 10
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract description 7
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 42
229910052802 copper Inorganic materials 0.000 description 36
239000010949 copper Substances 0.000 description 36
238000000034 method Methods 0.000 description 36
239000010410 layer Substances 0.000 description 29
239000000243 solution Substances 0.000 description 27
239000002585 base Substances 0.000 description 26
238000005530 etching Methods 0.000 description 17
239000000758 substrate Substances 0.000 description 15
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
239000011248 coating agent Substances 0.000 description 7
238000000576 coating method Methods 0.000 description 7
239000004020 conductor Substances 0.000 description 7
239000003365 glass fiber Substances 0.000 description 7
230000001590 oxidative effect Effects 0.000 description 7
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
239000000654 additive Substances 0.000 description 6
230000001070 adhesive effect Effects 0.000 description 6
238000004140 cleaning Methods 0.000 description 6
239000003822 epoxy resin Substances 0.000 description 6
229920000647 polyepoxide Polymers 0.000 description 6
ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 6
230000004913 activation Effects 0.000 description 5
239000000853 adhesive Substances 0.000 description 5
239000002131 composite material Substances 0.000 description 5
239000011889 copper foil Substances 0.000 description 5
238000005553 drilling Methods 0.000 description 5
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
239000004593 Epoxy Substances 0.000 description 4
230000005670 electromagnetic radiation Effects 0.000 description 4
238000005516 engineering process Methods 0.000 description 4
229910052751 metal Inorganic materials 0.000 description 4
239000002184 metal Substances 0.000 description 4
238000007747 plating Methods 0.000 description 4
238000007788 roughening Methods 0.000 description 4
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
230000000996 additive effect Effects 0.000 description 3
230000001464 adherent effect Effects 0.000 description 3
239000007864 aqueous solution Substances 0.000 description 3
239000000969 carrier Substances 0.000 description 3
150000001875 compounds Chemical class 0.000 description 3
230000003750 conditioning effect Effects 0.000 description 3
SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
230000000694 effects Effects 0.000 description 3
238000005259 measurement Methods 0.000 description 3
239000000203 mixture Substances 0.000 description 3
238000000465 moulding Methods 0.000 description 3
229910052759 nickel Inorganic materials 0.000 description 3
239000003960 organic solvent Substances 0.000 description 3
239000007800 oxidant agent Substances 0.000 description 3
229910052763 palladium Inorganic materials 0.000 description 3
238000003825 pressing Methods 0.000 description 3
239000011265 semifinished product Substances 0.000 description 3
238000012360 testing method Methods 0.000 description 3
YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
239000002253 acid Substances 0.000 description 2
239000002318 adhesion promoter Substances 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 2
239000000956 alloy Substances 0.000 description 2
238000009835 boiling Methods 0.000 description 2
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
239000011651 chromium Substances 0.000 description 2
229940117975 chromium trioxide Drugs 0.000 description 2
WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 2
GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
229920001577 copolymer Polymers 0.000 description 2
229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
238000007772 electroless plating Methods 0.000 description 2
239000000835 fiber Substances 0.000 description 2
239000011152 fibreglass Substances 0.000 description 2
239000004811 fluoropolymer Substances 0.000 description 2
229920002313 fluoropolymer Polymers 0.000 description 2
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
238000003801 milling Methods 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
230000035939 shock Effects 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
239000004332 silver Substances 0.000 description 2
CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
229910000679 solder Inorganic materials 0.000 description 2
238000005476 soldering Methods 0.000 description 2
229910052718 tin Inorganic materials 0.000 description 2
239000011135 tin Substances 0.000 description 2
239000000080 wetting agent Substances 0.000 description 2
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 1
RMOVWLRCAAYVFD-UHFFFAOYSA-N C(C)OCCOCCOCC.COCCOCCOCCOCCOC.COCCOCCOCCOC.COCCOCCOC Chemical compound C(C)OCCOCCOCC.COCCOCCOCCOCCOC.COCCOCCOCCOC.COCCOCCOC RMOVWLRCAAYVFD-UHFFFAOYSA-N 0.000 description 1
229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
229910000990 Ni alloy Inorganic materials 0.000 description 1
229910001096 P alloy Inorganic materials 0.000 description 1
ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
229910007116 SnPb Inorganic materials 0.000 description 1
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
239000003929 acidic solution Substances 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
230000003213 activating effect Effects 0.000 description 1
239000012190 activator Substances 0.000 description 1
239000012790 adhesive layer Substances 0.000 description 1
239000003513 alkali Substances 0.000 description 1
229910001854 alkali hydroxide Inorganic materials 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
150000008044 alkali metal hydroxides Chemical class 0.000 description 1
125000003118 aryl group Chemical group 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
239000007767 bonding agent Substances 0.000 description 1
125000002091 cationic group Chemical group 0.000 description 1
239000003093 cationic surfactant Substances 0.000 description 1
239000003638 chemical reducing agent Substances 0.000 description 1
229910017052 cobalt Inorganic materials 0.000 description 1
239000010941 cobalt Substances 0.000 description 1
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
238000011109 contamination Methods 0.000 description 1
OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
229930003836 cresol Natural products 0.000 description 1
230000007547 defect Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000013461 design Methods 0.000 description 1
230000029087 digestion Effects 0.000 description 1
230000002500 effect on skin Effects 0.000 description 1
239000003792 electrolyte Substances 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
239000000945 filler Substances 0.000 description 1
239000012535 impurity Substances 0.000 description 1
229910001867 inorganic solvent Inorganic materials 0.000 description 1
239000003049 inorganic solvent Substances 0.000 description 1
238000010030 laminating Methods 0.000 description 1
239000011133 lead Substances 0.000 description 1
229920003986 novolac Polymers 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
229920002120 photoresistant polymer Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
238000006116 polymerization reaction Methods 0.000 description 1
229910052700 potassium Inorganic materials 0.000 description 1
239000011591 potassium Substances 0.000 description 1
230000002787 reinforcement Effects 0.000 description 1
239000011342 resin composition Substances 0.000 description 1
239000012260 resinous material Substances 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
230000035945 sensitivity Effects 0.000 description 1
239000012279 sodium borohydride Substances 0.000 description 1
229910000033 sodium borohydride Inorganic materials 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
230000008646 thermal stress Effects 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
229910052725 zinc Inorganic materials 0.000 description 1
239000011701 zinc Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Chemically Coating (AREA)
ing And Chemical Polishing (AREA)

DD90342489A 1989-07-06 1990-07-04 Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung DD296510A5 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19893922477 DE3922477A1 (de)	1989-07-06	1989-07-06	Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung

Publications (1)

Publication Number	Publication Date
DD296510A5 true DD296510A5 (de)	1991-12-05

Family

ID=6384549

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DD90342489A DD296510A5 (de)	1989-07-06	1990-07-04	Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung

Country Status (5)

Country	Link
EP (1)	EP0406678A1 (ja)
JP (1)	JPH03204992A (ja)
CA (1)	CA2020624A1 (ja)
DD (1)	DD296510A5 (ja)
DE (1)	DE3922477A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5183552A (en) *	1989-09-14	1993-02-02	Schering Aktiengesellschaft	Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces
DE4108461C1 (ja) *	1991-03-13	1992-06-25	Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4221948C1 (de) *	1992-07-02	1993-10-21	Schering Ag	Verfahren zur Metallisierung von Kunststoffen und Verwendung
DE4326079A1 (de) *	1993-07-30	1995-02-02	Atotech Deutschland Gmbh	Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung
US7354870B2 (en)	2005-11-14	2008-04-08	National Research Council Of Canada	Process for chemical etching of parts fabricated by stereolithography
JP5342258B2 (ja) *	2009-02-06	2013-11-13	上村工業株式会社	デスミア処理方法
EP2639334A1 (de) *	2012-03-15	2013-09-18	Atotech Deutschland GmbH	Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) *	2012-03-15	2013-09-18	Atotech Deutschland GmbH	Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
CN109072438B (zh)	2016-05-04	2021-08-13	德国艾托特克公司	沉积金属或金属合金到衬底表面及包括衬底表面活化的方法
DE102017213023A1 (de)	2017-07-28	2019-01-31	Bayerische Motoren Werke Aktiengesellschaft	Verfahren zum Herstellen eines Bauteils, insbesondere für ein Kraftfahrzeug, sowie Bauteil
JP7138880B1 (ja) *	2021-08-06	2022-09-20	株式会社太洋工作所	無電解めっき方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1964161A1 (de) *	1969-01-02	1970-07-16	Dow Chemical Co	Zubereitungen zum Einebnen von organischen Oberflaechen
US3769061A (en) *	1971-06-14	1973-10-30	Shipley Co	Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
JPS5133833B2 (ja) *	1973-03-19	1976-09-22
WO1987000391A1 (en) *	1985-06-24	1987-01-15	Enthone, Incorporated	Process for conditioning the surface of plastic substrates prior to metal plating
DE3638630A1 (de) *	1986-11-11	1988-05-26	Schering Ag	Verfahren zur entfernung von harzverschmutzungen in bohrloechern von leiterplatten
US4775557A (en) *	1987-11-09	1988-10-04	Enthone, Incorporated	Composition and process for conditioning the surface of polycarbonate resins prior to metal plating

1989
- 1989-07-06 DE DE19893922477 patent/DE3922477A1/de not_active Withdrawn
1990
- 1990-06-27 EP EP19900112204 patent/EP0406678A1/de not_active Withdrawn
- 1990-07-04 DD DD90342489A patent/DD296510A5/de not_active IP Right Cessation
- 1990-07-06 JP JP2177628A patent/JPH03204992A/ja active Pending
- 1990-07-06 CA CA 2020624 patent/CA2020624A1/en not_active Abandoned

Also Published As

Publication number	Publication date
JPH03204992A (ja)	1991-09-06
EP0406678A1 (de)	1991-01-09
DE3922477A1 (de)	1991-01-17
CA2020624A1 (en)	1991-01-07

Legal Events

Date	Code	Title	Description
2000-07-20	ENJ	Ceased due to non-payment of renewal fee

Publication	Publication Date	Title
DE69926939T2 (de)	2006-07-13	Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte
DE60000315T3 (de)	2006-10-12	Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte und verbundfolie zur verwendung darin
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