DE163155T1 - Bei niederer temperatur gebrannte keramiken. - Google Patents

Bei niederer temperatur gebrannte keramiken.

Info

Publication number
DE163155T1
DE163155T1 DE198585105284T DE85105284T DE163155T1 DE 163155 T1 DE163155 T1 DE 163155T1 DE 198585105284 T DE198585105284 T DE 198585105284T DE 85105284 T DE85105284 T DE 85105284T DE 163155 T1 DE163155 T1 DE 163155T1
Authority
DE
Germany
Prior art keywords
low temperature
impurities
munich
mixture
powder containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE198585105284T
Other languages
English (en)
Inventor
Shirohito Tempaku-Ku Nagoya-Shi Aichi Matsuyama
Susumu Nagoya-Shi Aichi Nishigaki
Shinsuke Midori-Ku Nagoya-Shi Aichi Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NARUMI CHINA CORP NAGOYA AICHI JP
Original Assignee
NARUMI CHINA CORP NAGOYA AICHI JP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NARUMI CHINA CORP NAGOYA AICHI JP filed Critical NARUMI CHINA CORP NAGOYA AICHI JP
Publication of DE163155T1 publication Critical patent/DE163155T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)

Claims (2)

SCHWASE :· SANDMAIR · MARX PATENTANWÄLTE STUNTZSTRASSE 16 ■ 8000 MÜNCHEN 80 U I D J I b 105 284.5-2104 NARUMI CHINA CORPORATION Anwaltsakte: 50 550 V Patentansprüche
1. Bei niederer Temperatur gebrannte Keramiken, hergestellt durch Brennen einer Mischung bei niederer Temperatur, dadurch gekennzeichnet, daß die Mischung, in Gewichtsprozenten, enthält:
(a) 50 bis 65 % Glaspulver, enthaltend 10 bis 55 % CaO, 45 bis 70 % SiO2, 0 bis 30 % Al2O3 und bis zu 10 % Verunreinigungen; und
(b) 50 bis 35 % Al203-Pulver, enthaltend bis zu 10 % Verunreinigungen.
2. Bei niederer Temperatur gebrannte Keramiken, hergestellt durch Brennen einer Mischung bei niederer Temperatur, dadurch gekennzeichnet, daß die Mischung, in Gewichtsprozenten, enthält:
(a) 50 bis 65 % Glaspulver, enthaltend
(i) 10 bis 55 % CaO, 45 bis 70 % SiO2, 0 bis 30 % Al3O3 und bis zu 10 % Verunreinigungen; und
(ii) bis zu 20 %t bezogen auf das Gesamtgewicht der vorherigen Bestandteile (i), B2O3; und
(b) 50 bis 35 % Al203-Pulver, enthaltend bis zu 10 % Verunreinigungen.
* (089) 988272-74 Telekopierer: (089) 983049 Bankkonten: Bayer. Vereinsbank München 453100 (BLZ 70020270,
Telex: 524560 Swan d KaIIe Infotec 6350 Gr. Il + III Hvoo-Bank München Λ4in 19?mn ml 7 7nnonmi\ <:,...<. rv«<~ uv
DE198585105284T 1984-06-01 1985-04-30 Bei niederer temperatur gebrannte keramiken. Pending DE163155T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59110973A JPS60260465A (ja) 1984-06-01 1984-06-01 低温焼成セラミツクス

Publications (1)

Publication Number Publication Date
DE163155T1 true DE163155T1 (de) 1986-04-10

Family

ID=14549184

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8585105284T Expired DE3561547D1 (en) 1984-06-01 1985-04-30 Low temperature fired ceramics
DE198585105284T Pending DE163155T1 (de) 1984-06-01 1985-04-30 Bei niederer temperatur gebrannte keramiken.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE8585105284T Expired DE3561547D1 (en) 1984-06-01 1985-04-30 Low temperature fired ceramics

Country Status (4)

Country Link
US (1) US4621066A (de)
EP (1) EP0163155B1 (de)
JP (1) JPS60260465A (de)
DE (2) DE3561547D1 (de)

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JPH0783180B2 (ja) * 1987-05-20 1995-09-06 松下電器産業株式会社 セラミック多層基板とその製造方法
DE3879301D1 (de) * 1987-07-06 1993-04-22 Tokuyama Soda Kk Verfahren zur erzeugung eines koerpers aus gesinterten anorthit.
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JPH0728128B2 (ja) * 1988-03-11 1995-03-29 松下電器産業株式会社 セラミック多層配線基板とその製造方法
US5164342A (en) * 1988-10-14 1992-11-17 Ferro Corporation Low dielectric, low temperature fired glass ceramics
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JPH09246723A (ja) * 1996-03-11 1997-09-19 Sumitomo Kinzoku Electro Device:Kk 低温焼成セラミック回路基板
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US5830251A (en) * 1996-04-10 1998-11-03 Vortec Corporation Manufacture of ceramic tiles from industrial waste
JPH11335162A (ja) * 1998-05-25 1999-12-07 Murata Mfg Co Ltd セラミック基板用組成物およびセラミック回路部品
JP4852778B2 (ja) * 1999-06-22 2012-01-11 株式会社村田製作所 セラミック基板用組成物およびセラミック回路部品
JP3591437B2 (ja) * 2000-09-07 2004-11-17 株式会社村田製作所 多層セラミック基板およびその製造方法ならびに電子装置
JP4590866B2 (ja) * 2001-11-05 2010-12-01 旭硝子株式会社 ガラスセラミックス組成物
KR100484892B1 (ko) * 2002-08-28 2005-04-28 재단법인서울대학교산학협력재단 자가발포형 다공성 세라믹 조성물 및 이를 이용한 다공성 세라믹의 제조방법
US7510995B2 (en) * 2003-04-01 2009-03-31 United Technologies Corporation Application of a mixed metal oxide catalyst to a metallic substrate
JP4748701B2 (ja) * 2003-04-28 2011-08-17 日本特殊陶業株式会社 低温焼成磁器組成物、およびそれを用いた配線基板
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JP6927251B2 (ja) * 2019-07-08 2021-08-25 Tdk株式会社 ガラスセラミックス焼結体および配線基板
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Also Published As

Publication number Publication date
JPH0353269B2 (de) 1991-08-14
US4621066A (en) 1986-11-04
JPS60260465A (ja) 1985-12-23
EP0163155B1 (de) 1988-02-03
DE3561547D1 (en) 1988-03-10
EP0163155A1 (de) 1985-12-04

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