DE19882289T1 - Rückwandplatinen-Versteifungseinrichtung - Google Patents

Rückwandplatinen-Versteifungseinrichtung

Info

Publication number
DE19882289T1
DE19882289T1 DE19882289T DE19882289T DE19882289T1 DE 19882289 T1 DE19882289 T1 DE 19882289T1 DE 19882289 T DE19882289 T DE 19882289T DE 19882289 T DE19882289 T DE 19882289T DE 19882289 T1 DE19882289 T1 DE 19882289T1
Authority
DE
Germany
Prior art keywords
backplane
stiffener
backplane stiffener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19882289T
Other languages
English (en)
Inventor
Richard N Rehlander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hybricon Corp
Original Assignee
Hybricon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hybricon Corp filed Critical Hybricon Corp
Publication of DE19882289T1 publication Critical patent/DE19882289T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE19882289T 1997-04-07 1998-04-06 Rückwandplatinen-Versteifungseinrichtung Withdrawn DE19882289T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/835,348 US6084182A (en) 1997-04-07 1997-04-07 Backplane stiffener
PCT/US1998/006731 WO1998046057A1 (en) 1997-04-07 1998-04-06 Backplane stiffener

Publications (1)

Publication Number Publication Date
DE19882289T1 true DE19882289T1 (de) 2000-06-15

Family

ID=25269283

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882289T Withdrawn DE19882289T1 (de) 1997-04-07 1998-04-06 Rückwandplatinen-Versteifungseinrichtung

Country Status (4)

Country Link
US (1) US6084182A (de)
AU (1) AU6884398A (de)
DE (1) DE19882289T1 (de)
WO (1) WO1998046057A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6726505B2 (en) 2000-07-20 2004-04-27 Silicon Graphics, Inc. Memory daughter card apparatus, configurations, and methods
US6512676B1 (en) 2000-07-20 2003-01-28 Silicon Graphics, Inc. Printed circuit board stiffener
US6682802B2 (en) * 2000-12-14 2004-01-27 Intel Corporation Selective PCB stiffening with preferentially oriented fibers
EP1337137A1 (de) * 2002-02-19 2003-08-20 Alcatel Gehäuse mit Versteifungsstangen für das Tragen von ein- oder mehrerer Rückwandplatten
US6880243B2 (en) * 2002-10-04 2005-04-19 Sanmina-Sci Corporation Stiffener for stiffening a circuit board
FR2848773B1 (fr) * 2002-12-13 2005-02-18 Thales Sa Carte electronique a structure haubanee
US7095622B2 (en) * 2003-06-11 2006-08-22 Hewlett-Packard Development Company, L.P. Backplane support system with stiffener
WO2008119393A1 (en) * 2007-04-03 2008-10-09 Telefonaktiebolaget Lm Ericsson (Publ) Backplane to mate boards with different widths
CN111988949B (zh) * 2020-08-28 2021-12-14 江西米赞科技有限公司 一种柔性印刷电路板
US12464638B2 (en) * 2023-02-28 2025-11-04 Hyve Solutions Corporation Vibration dampening for high-density storage system structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3341742A (en) * 1965-02-18 1967-09-12 Burroughs Corp Circuit assembly
GB1083000A (en) * 1966-04-07 1967-09-13 Standard Telephones Cables Ltd Improvements in or relating to electrical equipment practice
US4988577A (en) * 1989-06-08 1991-01-29 Bussco Engineering, Inc. Printed circuit board stiffener
US5198279A (en) * 1991-02-28 1993-03-30 Amp Incorporated Circuit board stiffener
JP2703475B2 (ja) * 1993-02-03 1998-01-26 日本メクトロン株式会社 フレキシブル・サーキット
US5378545A (en) * 1993-04-02 1995-01-03 Ag Communication Systems Corporation Removable snap-on card stiffener
DE4498145C1 (de) * 1993-10-26 2003-06-26 Kota Koehn Tastatursysteme Und Flacheingabetastatur für Datenverarbeitungsgerät oder dergleichen sowie Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
US6084182A (en) 2000-07-04
WO1998046057A1 (en) 1998-10-15
AU6884398A (en) 1998-10-30

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination
8110 Request for examination paragraph 44
8170 Reinstatement of the former position
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20111102