DE3318110C2 - Device for assembling printed circuit boards - Google Patents
Device for assembling printed circuit boardsInfo
- Publication number
- DE3318110C2 DE3318110C2 DE19833318110 DE3318110A DE3318110C2 DE 3318110 C2 DE3318110 C2 DE 3318110C2 DE 19833318110 DE19833318110 DE 19833318110 DE 3318110 A DE3318110 A DE 3318110A DE 3318110 C2 DE3318110 C2 DE 3318110C2
- Authority
- DE
- Germany
- Prior art keywords
- connection
- circuit board
- openings
- feet
- anvil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000835 fiber Substances 0.000 claims abstract 8
- 238000012806 monitoring device Methods 0.000 claims abstract 8
- 238000005452 bending Methods 0.000 claims abstract 7
- 230000003287 optical effect Effects 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 238000012544 monitoring process Methods 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 claims 1
- 230000000284 resting effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Die Erfindung bezieht sich auf eine Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauelementen. Hierbei werden die Anschlußfüße der Bauelemente in Anschlußöffnungen der auf einem Amboß aufliegenden Leiterplatte eingefügt. Eine Überwachungseinrichtung überprüft das Durchführen der Anschlußfüße durch die Anschlußöffnungen dadurch, daß federbelastete Stößel je Anschlußfuß um einen gewissen Betrag bewegt werden und hierbei Austrittsöffnungen von Glasfaserlichtleitkabeln abschließen und so eine Reflexion hervorrufen. Diese Reflexion wird ausgewertet. Hiervon abhängig wird das Ablängen und Abbiegen der Anschlußfüße auf der den Bauelementen abgewandten Seite der Leiterplatte freigegeben.The invention relates to a device for populating printed circuit boards with electronic components. Here, the connection feet of the components are inserted into connection openings of the printed circuit board resting on an anvil. A monitoring device checks the passage of the connection feet through the connection openings in that spring-loaded plungers are moved by a certain amount for each connection foot and thereby close off outlet openings of fiber optic cables and thus cause a reflection. This reflection is evaluated. Depending on this, the cutting to length and bending of the connection feet on the side of the circuit board facing away from the components is released.
Claims (2)
echte Durchsteckkontrolle der Anschlußbeine vor dem
Abbiegen und Abschneiden zuläßt. Dies wird auf einfa- 60
ehe Weise dadurch erreicht, daß jedem Anschlußfuß ein
federbelasteter Stößel zugeordnet ist, denen jeweils eine Fahne angeformt ist, die jeweils eine Austrittsöffnung des Glasfaserlichtleitkabels in einer Stellung des
Stößels abdeckt. 65reasons to create a simple device, the one
real push-through check of the connecting legs before the
Turning and cutting off allows. This is easy to 60
before way achieved by the fact that each connection foot a
is assigned a spring-loaded plunger, each of which a flag is formed, each having an outlet opening of the fiber optic cable in a position of the
Tappet covers. 65
gemäß der Erfindung beschrieben und die Wirkungsweise näher erläutert. Es zeigtAn exemplary embodiment is shown on the basis of the drawing
described according to the invention and the mode of operation explained in more detail. It shows
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833318110 DE3318110C2 (en) | 1983-05-18 | 1983-05-18 | Device for assembling printed circuit boards |
| JP59096297A JPS59232500A (en) | 1983-05-18 | 1984-05-14 | Device for mounting electronic device on printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833318110 DE3318110C2 (en) | 1983-05-18 | 1983-05-18 | Device for assembling printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3318110A1 DE3318110A1 (en) | 1985-01-10 |
| DE3318110C2 true DE3318110C2 (en) | 1986-12-18 |
Family
ID=6199313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19833318110 Expired DE3318110C2 (en) | 1983-05-18 | 1983-05-18 | Device for assembling printed circuit boards |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS59232500A (en) |
| DE (1) | DE3318110C2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0213496B1 (en) * | 1985-08-26 | 1990-01-24 | Siemens Aktiengesellschaft | Device for mounting components on circuit boards |
| EP0337274B1 (en) * | 1988-04-14 | 1994-11-30 | Unilever N.V. | Fabric-washing compositions |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5543837A (en) * | 1978-09-20 | 1980-03-27 | Matsushita Electric Industrial Co Ltd | Lead wire detector |
| US4499649A (en) * | 1982-08-11 | 1985-02-19 | Usm Corporation | All lead sensor |
-
1983
- 1983-05-18 DE DE19833318110 patent/DE3318110C2/en not_active Expired
-
1984
- 1984-05-14 JP JP59096297A patent/JPS59232500A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3318110A1 (en) | 1985-01-10 |
| JPS59232500A (en) | 1984-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |