DE60038115D1 - Flüssigkeitsabgabestabilisierung für wafervorbereitungssystem - Google Patents

Flüssigkeitsabgabestabilisierung für wafervorbereitungssystem

Info

Publication number
DE60038115D1
DE60038115D1 DE60038115T DE60038115T DE60038115D1 DE 60038115 D1 DE60038115 D1 DE 60038115D1 DE 60038115 T DE60038115 T DE 60038115T DE 60038115 T DE60038115 T DE 60038115T DE 60038115 D1 DE60038115 D1 DE 60038115D1
Authority
DE
Germany
Prior art keywords
diw
drawer
chemical
substantially steady
chemicals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60038115T
Other languages
English (en)
Other versions
DE60038115T2 (de
Inventor
Larry Ping-Kwan Wong
Larios John Martin De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60038115D1 publication Critical patent/DE60038115D1/de
Publication of DE60038115T2 publication Critical patent/DE60038115T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87652—With means to promote mixing or combining of plural fluids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • External Artificial Organs (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
DE60038115T 1999-06-25 2000-06-23 Flüssigkeitsabgabestabilisierung für wafervorbereitungssystem Expired - Lifetime DE60038115T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US344674 1999-06-25
US09/344,674 US6267142B1 (en) 1999-06-25 1999-06-25 Fluid delivery stablization for wafer preparation systems
PCT/US2000/017453 WO2001001459A1 (en) 1999-06-25 2000-06-23 Fluid delivery stabilization for wafer preparation systems

Publications (2)

Publication Number Publication Date
DE60038115D1 true DE60038115D1 (de) 2008-04-03
DE60038115T2 DE60038115T2 (de) 2009-02-19

Family

ID=23351508

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038115T Expired - Lifetime DE60038115T2 (de) 1999-06-25 2000-06-23 Flüssigkeitsabgabestabilisierung für wafervorbereitungssystem

Country Status (8)

Country Link
US (1) US6267142B1 (de)
EP (1) EP1190440B1 (de)
JP (1) JP4518721B2 (de)
KR (1) KR100700956B1 (de)
AT (1) ATE387009T1 (de)
DE (1) DE60038115T2 (de)
TW (1) TW466551B (de)
WO (1) WO2001001459A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6685440B2 (en) * 2001-05-18 2004-02-03 Lam Research Corporation Methods of pressure fluctuation dampening
TW583355B (en) * 2001-06-21 2004-04-11 M Fsi Ltd Slurry mixing feeder and slurry mixing and feeding method
US20040049301A1 (en) * 2002-09-10 2004-03-11 M Fsi Ltd. Apparatus and method for preparing and supplying slurry for CMP machine
US6881437B2 (en) * 2003-06-16 2005-04-19 Blue29 Llc Methods and system for processing a microelectronic topography
JP6149421B2 (ja) * 2013-02-20 2017-06-21 栗田工業株式会社 溶液の供給方法及び供給装置
JP6211877B2 (ja) * 2013-10-03 2017-10-11 東京エレクトロン株式会社 基板処理システム
JP6640041B2 (ja) * 2016-06-27 2020-02-05 株式会社荏原製作所 洗浄装置及び基板処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5129955A (en) 1989-01-11 1992-07-14 Dainippon Screen Mfg. Co., Ltd. Wafer cleaning method
US5341646A (en) 1993-07-15 1994-08-30 Air Products And Chemicals, Inc. Triple column distillation system for oxygen and pressurized nitrogen production
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
DE19525521B4 (de) 1994-07-15 2007-04-26 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Verfahren zum Reinigen von Substraten
WO1997013590A1 (en) 1995-10-13 1997-04-17 Ontrak Systems, Inc. Method and apparatus for chemical delivery through the brush
US5899216A (en) * 1996-07-08 1999-05-04 Speedfam Corporation Apparatus for rinsing wafers in the context of a combined cleaning rinsing and drying system
JP3636268B2 (ja) * 1997-03-27 2005-04-06 大日本スクリーン製造株式会社 基板処理装置
US6070600A (en) * 1997-07-01 2000-06-06 Motorola, Inc. Point of use dilution tool and method
JP3107009B2 (ja) * 1997-09-01 2000-11-06 日本電気株式会社 金属膜の研磨方法及び研磨装置
JPH1187295A (ja) * 1997-09-03 1999-03-30 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
DE60038115T2 (de) 2009-02-19
US6267142B1 (en) 2001-07-31
JP2003503846A (ja) 2003-01-28
KR100700956B1 (ko) 2007-03-28
EP1190440B1 (de) 2008-02-20
WO2001001459A1 (en) 2001-01-04
JP4518721B2 (ja) 2010-08-04
ATE387009T1 (de) 2008-03-15
EP1190440A1 (de) 2002-03-27
TW466551B (en) 2001-12-01
KR20020019104A (ko) 2002-03-09

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