DE602007012995D1 - Mikromechanischer Drucksensor - Google Patents

Mikromechanischer Drucksensor

Info

Publication number
DE602007012995D1
DE602007012995D1 DE602007012995T DE602007012995T DE602007012995D1 DE 602007012995 D1 DE602007012995 D1 DE 602007012995D1 DE 602007012995 T DE602007012995 T DE 602007012995T DE 602007012995 T DE602007012995 T DE 602007012995T DE 602007012995 D1 DE602007012995 D1 DE 602007012995D1
Authority
DE
Germany
Prior art keywords
pressure sensor
micromechanical pressure
micromechanical
sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007012995T
Other languages
English (en)
Inventor
Henrik Jakobsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of DE602007012995D1 publication Critical patent/DE602007012995D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D65/00—Accessories or auxiliary operations, in general, for separation processes or apparatus using semi-permeable membranes
    • B01D65/10—Testing of membranes or membrane apparatus; Detecting or repairing leaks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D65/00—Accessories or auxiliary operations, in general, for separation processes or apparatus using semi-permeable membranes
    • B01D65/10—Testing of membranes or membrane apparatus; Detecting or repairing leaks
    • B01D65/102—Detection of leaks in membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G01L19/0076—Electrical connection means from the sensor to its support using buried connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/006—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of metallic strain gauges fixed to an element other than the pressure transmitting diaphragm
    • G01L9/0064—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of metallic strain gauges fixed to an element other than the pressure transmitting diaphragm the element and the diaphragm being in intimate contact

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE602007012995T 2007-01-31 2007-01-31 Mikromechanischer Drucksensor Active DE602007012995D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07101491A EP1953516B1 (de) 2007-01-31 2007-01-31 Mikromechanischer Drucksensor

Publications (1)

Publication Number Publication Date
DE602007012995D1 true DE602007012995D1 (de) 2011-04-21

Family

ID=38358001

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007012995T Active DE602007012995D1 (de) 2007-01-31 2007-01-31 Mikromechanischer Drucksensor

Country Status (3)

Country Link
US (2) US7681457B2 (de)
EP (1) EP1953516B1 (de)
DE (1) DE602007012995D1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009114818A2 (en) * 2008-03-13 2009-09-17 University Of Utah Research Foundation Methods of forming an embedded cavity for sensors
US8695407B2 (en) * 2009-04-17 2014-04-15 Cornell University Microtensiometer sensor, probe and method of use
US8569851B2 (en) * 2010-06-18 2013-10-29 General Electric Company Sensor and method for fabricating the same
JP2012073163A (ja) * 2010-09-29 2012-04-12 Seiko Epson Corp 圧力センサー
JP5915103B2 (ja) * 2011-11-11 2016-05-11 セイコーエプソン株式会社 物理量検出器
US9470593B2 (en) 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
US9267857B2 (en) * 2014-01-07 2016-02-23 Honeywell International Inc. Pressure sensor having a bossed diaphragm
US9316552B2 (en) * 2014-02-28 2016-04-19 Measurement Specialties, Inc. Differential pressure sensing die
US10032936B2 (en) * 2015-05-29 2018-07-24 Seiko Epson Corporation Method for manufacturing resistive element, method for manufacturing pressure sensor element, pressure sensor element, pressure sensor, altimeter, electronic apparatus, and moving object
EP3258235A1 (de) 2016-06-16 2017-12-20 Huba Control Ag Differenzialdruckwandler
EP3392633B1 (de) 2017-04-19 2019-12-11 Huba Control Ag Drucksensor
US11092504B2 (en) * 2019-05-21 2021-08-17 Rosemount Aerospace Inc. Micromechanical redundant piezoresistive array pressure sensor
EP3748323B1 (de) 2019-06-03 2022-01-12 Huba Control Ag Differenzdrucksensor

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697918A (en) * 1971-08-03 1972-10-10 Gen Electric Silicon diaphragm pressure sensor having improved configuration of integral strain gage elements
US4023562A (en) * 1975-09-02 1977-05-17 Case Western Reserve University Miniature pressure transducer for medical use and assembly method
CA1078217A (en) * 1976-03-31 1980-05-27 Robert C. Whitehead (Jr.) Force transducing cantilever beam and pressure transducer incorporating it
DE2809549C2 (de) * 1977-03-07 1985-03-14 Hitachi, Ltd., Tokio/Tokyo Verfahren zur Herstellung eines Halbleiter-Druckmeßfühlers und Halbleiter-Druckmeßfühler
JPS5544786A (en) * 1978-09-27 1980-03-29 Hitachi Ltd Pressure sensor
US4327350A (en) 1979-07-17 1982-04-27 Data Instruments, Inc. Pressure transducer
US4651120A (en) * 1985-09-09 1987-03-17 Honeywell Inc. Piezoresistive pressure sensor
US4899125A (en) * 1987-07-24 1990-02-06 Kulite Semiconductor Products, Inc. Cantilever beam transducers and methods of fabrication
US5255427A (en) * 1989-03-07 1993-10-26 Pfister Gmbh Ceramic hollow bodies and method of manufacturing such bodies
US5163328A (en) * 1990-08-06 1992-11-17 Colin Electronics Co., Ltd. Miniature pressure sensor and pressure sensor arrays
JPH05196458A (ja) * 1991-01-04 1993-08-06 Univ Leland Stanford Jr 原子力顕微鏡用ピエゾ抵抗性片持ばり構造体
US5209122A (en) * 1991-11-20 1993-05-11 Delco Electronics Corporation Pressurer sensor and method for assembly of same
US5591679A (en) 1995-04-12 1997-01-07 Sensonor A/S Sealed cavity arrangement method
US6000280A (en) * 1995-07-20 1999-12-14 Cornell Research Foundation, Inc. Drive electrodes for microfabricated torsional cantilevers
US6073484A (en) * 1995-07-20 2000-06-13 Cornell Research Foundation, Inc. Microfabricated torsional cantilevers for sensitive force detection
US5614678A (en) * 1996-02-05 1997-03-25 Kulite Semiconductor Products, Inc. High pressure piezoresistive transducer
DE19714703B4 (de) * 1996-04-13 2014-02-13 Robert Bosch Gmbh Drucksensor
US6157985A (en) * 1997-10-16 2000-12-05 Seagate Technology Llc Single-cycle variable period buffer manager for disk controllers
SG68002A1 (en) * 1997-11-25 1999-10-19 Inst Of Microelectronics Natio Cmos compatible integrated pressure sensor
JPH11230981A (ja) * 1998-02-13 1999-08-27 Matsushita Electric Works Ltd 半導体加速度センサ及びその製造方法
US6006607A (en) * 1998-08-31 1999-12-28 Maxim Integrated Products, Inc. Piezoresistive pressure sensor with sculpted diaphragm
EP0994330B1 (de) 1998-10-12 2007-01-03 Infineon Technologies SensoNor AS Verfahren zur Herstellung von Winkelgeschwindigkeitsmessern
FR2786564B1 (fr) * 1998-11-27 2001-04-13 Commissariat Energie Atomique Capteur de pression a membrane comportant du carbure de silicium et procede de fabrication
JP3506932B2 (ja) * 1998-12-09 2004-03-15 株式会社山武 半導体圧力センサ及びその製造方法
US6422088B1 (en) * 1999-09-24 2002-07-23 Denso Corporation Sensor failure or abnormality detecting system incorporated in a physical or dynamic quantity detecting apparatus
US6959608B2 (en) * 2002-05-23 2005-11-01 The Board Of Trustees Of The Leland Stanford Junior University Ultra-miniature pressure sensors and probes
TWI224190B (en) * 2003-05-28 2004-11-21 Au Optronics Corp Semiconductor pressure sensor
DE102004010295A1 (de) * 2004-03-03 2005-09-22 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
US6945120B1 (en) * 2004-07-02 2005-09-20 Honeywell International Inc. Exhaust gas recirculation system using absolute micromachined pressure sense die
US7311009B2 (en) * 2004-11-17 2007-12-25 Lawrence Livermore National Security, Llc Microelectromechanical systems contact stress sensor
US7290453B2 (en) * 2004-12-28 2007-11-06 Amnon Brosh Composite MEMS pressure sensor configuration
US7461559B2 (en) * 2005-03-18 2008-12-09 Citizen Holdings Co., Ltd. Electromechanical transducer and method of fabricating the same

Also Published As

Publication number Publication date
US7681457B2 (en) 2010-03-23
EP1953516B1 (de) 2011-03-09
EP1953516A1 (de) 2008-08-06
US20080178680A1 (en) 2008-07-31
US8256301B2 (en) 2012-09-04
US20100139410A1 (en) 2010-06-10

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