DE69840077D1 - Festkörperrelais - Google Patents

Festkörperrelais

Info

Publication number
DE69840077D1
DE69840077D1 DE69840077T DE69840077T DE69840077D1 DE 69840077 D1 DE69840077 D1 DE 69840077D1 DE 69840077 T DE69840077 T DE 69840077T DE 69840077 T DE69840077 T DE 69840077T DE 69840077 D1 DE69840077 D1 DE 69840077D1
Authority
DE
Germany
Prior art keywords
solid state
state relay
relay
solid
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69840077T
Other languages
English (en)
Inventor
Masahiko Suzumura
Hitomichi Takano
Yuji Suzuki
Takashi Kishida
Yoshiki Hayasaki
Yoshifumi Shirai
Takeshi Yoshida
Yasunori Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31402997A external-priority patent/JP3319999B2/ja
Priority claimed from JP35257697A external-priority patent/JP3513851B2/ja
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of DE69840077D1 publication Critical patent/DE69840077D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65—Lateral DMOS [LDMOS] FETs
    • H10D30/657—Lateral DMOS [LDMOS] FETs having substrates comprising insulating layers, e.g. SOI-LDMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H10D62/116—Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
DE69840077T 1997-06-30 1998-06-29 Festkörperrelais Expired - Lifetime DE69840077D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP17430697 1997-06-30
JP31403697 1997-11-14
JP31402997A JP3319999B2 (ja) 1997-11-14 1997-11-14 半導体スイッチ素子
JP35257697A JP3513851B2 (ja) 1997-12-22 1997-12-22 半導体装置

Publications (1)

Publication Number Publication Date
DE69840077D1 true DE69840077D1 (de) 2008-11-13

Family

ID=27474558

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69840077T Expired - Lifetime DE69840077D1 (de) 1997-06-30 1998-06-29 Festkörperrelais
DE69838805T Expired - Lifetime DE69838805T2 (de) 1997-06-30 1998-06-29 Festkörperrelais

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69838805T Expired - Lifetime DE69838805T2 (de) 1997-06-30 1998-06-29 Festkörperrelais

Country Status (9)

Country Link
US (3) US6211551B1 (de)
EP (2) EP1227520B1 (de)
KR (1) KR100310479B1 (de)
CN (1) CN1156978C (de)
CA (1) CA2241765C (de)
DE (2) DE69840077D1 (de)
MY (2) MY118511A (de)
SG (1) SG67518A1 (de)
TW (1) TW386313B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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SE9901575L (sv) * 1999-05-03 2000-11-04 Eklund Klas Haakan Halvledarelement
KR100751100B1 (ko) * 1999-09-16 2007-08-22 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 반도체 디바이스
US6552396B1 (en) * 2000-03-14 2003-04-22 International Business Machines Corporation Matched transistors and methods for forming the same
US6614054B1 (en) * 2000-11-27 2003-09-02 Lg.Philips Lcd Co., Ltd. Polysilicon thin film transistor used in a liquid crystal display and the fabricating method
JP2003101017A (ja) * 2001-09-27 2003-04-04 Mitsubishi Electric Corp 半導体装置
US6919236B2 (en) * 2002-03-21 2005-07-19 Advanced Micro Devices, Inc. Biased, triple-well fully depleted SOI structure, and various methods of making and operating same
DE10227310A1 (de) * 2002-06-19 2004-01-15 Siemens Ag Halbleiter-Schaltvorrichtung
CN101567373B (zh) * 2004-02-16 2011-04-13 富士电机系统株式会社 双方向元件及其制造方法
DE102006008539A1 (de) 2006-02-22 2007-08-30 Robert Bosch Gmbh Verfahren und Schaltungsanordnung zur Simulation von Fehlerzuständen in einem Steuergerät
JP5157164B2 (ja) * 2006-05-29 2013-03-06 富士電機株式会社 半導体装置、バッテリー保護回路およびバッテリーパック
JP2008085188A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 絶縁ゲート型半導体装置
JP5511124B2 (ja) * 2006-09-28 2014-06-04 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 絶縁ゲート型半導体装置
KR100840667B1 (ko) * 2007-06-26 2008-06-24 주식회사 동부하이텍 수평형 디모스 소자 및 그 제조방법
JP5337470B2 (ja) * 2008-04-21 2013-11-06 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 絶縁ゲート型半導体装置
JP2010010256A (ja) * 2008-06-25 2010-01-14 Panasonic Electric Works Co Ltd 半導体装置
US20100127392A1 (en) * 2008-11-25 2010-05-27 Joe Yang Semiconductor die
US8319255B2 (en) * 2010-04-01 2012-11-27 Texas Instruments Incorporated Low side Zener reference voltage extended drain SCR clamps
US8524548B2 (en) * 2011-04-26 2013-09-03 National Semiconductor Corporation DMOS Transistor with a cavity that lies below the drift region
JP5801713B2 (ja) 2011-12-28 2015-10-28 株式会社ソシオネクスト 半導体装置とその製造方法、およびｃａｎシステム
EP2869339B1 (de) * 2013-10-31 2016-07-27 Ampleon Netherlands B.V. Transistoranordnung
CN103915505A (zh) * 2014-04-21 2014-07-09 天津理工大学 一种槽栅槽源soi ldmos器件
CN105374883B (zh) * 2014-08-28 2018-06-08 旺宏电子股份有限公司 高压元件及其制造方法
US9455339B2 (en) * 2014-09-09 2016-09-27 Macronix International Co., Ltd. High voltage device and method for manufacturing the same
TWI719982B (zh) * 2015-05-15 2021-03-01 美商西凱渥資訊處理科技公司 半導體裝置中之空腔形成
US9899527B2 (en) * 2015-12-31 2018-02-20 Globalfoundries Singapore Pte. Ltd. Integrated circuits with gaps
GB2553822B (en) 2016-09-15 2018-12-26 Murata Manufacturing Co DC-DC Converter device
TWI829371B (zh) * 2022-09-29 2024-01-11 車王電子股份有限公司 固態繼電器
CN120882054A (zh) * 2024-04-18 2025-10-31 东南大学 绝缘体上硅半导体结构及其制造方法

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JPS63278375A (ja) * 1987-05-11 1988-11-16 Nec Corp 半導体集積回路装置
US4864126A (en) 1988-06-17 1989-09-05 Hewlett-Packard Company Solid state relay with optically controlled shunt and series enhancement circuit
DE4042334C2 (de) 1990-02-27 1993-11-18 Fraunhofer Ges Forschung Verfahren zum Erzeugen einer isolierten, einkristallinen Siliziuminsel
GB2243485A (en) 1990-04-27 1991-10-30 Motorola Gmbh Semiconductor device contact pads
US5126827A (en) * 1991-01-17 1992-06-30 Avantek, Inc. Semiconductor chip header having particular surface metallization
US5138177A (en) * 1991-03-26 1992-08-11 At&T Bell Laboratories Solid-state relay
JP2654268B2 (ja) * 1991-05-13 1997-09-17 株式会社東芝 半導体装置の使用方法
DE4129835A1 (de) 1991-09-07 1993-03-11 Bosch Gmbh Robert Leistungselektroniksubstrat und verfahren zu dessen herstellung
US5286995A (en) * 1992-07-14 1994-02-15 Texas Instruments Incorporated Isolated resurf LDMOS devices for multiple outputs on one die
JPH06268247A (ja) * 1993-03-15 1994-09-22 Matsushita Electric Works Ltd 光結合型半導体リレー
US5378912A (en) * 1993-11-10 1995-01-03 Philips Electronics North America Corporation Lateral semiconductor-on-insulator (SOI) semiconductor device having a lateral drift region
US5382818A (en) * 1993-12-08 1995-01-17 Philips Electronics North America Corporation Lateral semiconductor-on-insulator (SOI) semiconductor device having a buried diode
JPH07211911A (ja) 1994-01-19 1995-08-11 Nippon Telegr & Teleph Corp <Ntt> 絶縁ゲート型電界効果トランジスタ
US5874768A (en) * 1994-06-15 1999-02-23 Nippondenso Co., Ltd. Semiconductor device having a high breakdown voltage
JPH08335684A (ja) * 1995-06-08 1996-12-17 Toshiba Corp 半導体装置
US5828112A (en) * 1995-09-18 1998-10-27 Kabushiki Kaisha Toshiba Semiconductor device incorporating an output element having a current-detecting section
TW360982B (en) * 1996-01-26 1999-06-11 Matsushita Electric Works Ltd Thin film transistor of silicon-on-insulator type
JP3575908B2 (ja) * 1996-03-28 2004-10-13 株式会社東芝 半導体装置
JP3082189B2 (ja) 1996-05-22 2000-08-28 横河電機株式会社 半導体リレー
US5760473A (en) * 1996-06-25 1998-06-02 Brush Wellman Inc. Semiconductor package having a eutectic bonding layer
US5981983A (en) * 1996-09-18 1999-11-09 Kabushiki Kaisha Toshiba High voltage semiconductor device

Also Published As

Publication number Publication date
EP0892438A3 (de) 2000-09-13
EP1227520B1 (de) 2008-10-01
KR100310479B1 (ko) 2001-11-30
MY130491A (en) 2007-06-29
EP1227520A3 (de) 2003-06-18
CA2241765C (en) 2001-08-28
DE69838805D1 (de) 2008-01-17
US6373101B1 (en) 2002-04-16
KR19990007497A (ko) 1999-01-25
EP0892438B1 (de) 2007-12-05
MY118511A (en) 2004-11-30
US6580126B1 (en) 2003-06-17
SG67518A1 (en) 1999-09-21
US6211551B1 (en) 2001-04-03
CN1222789A (zh) 1999-07-14
EP1227520A2 (de) 2002-07-31
CN1156978C (zh) 2004-07-07
EP0892438A2 (de) 1999-01-20
DE69838805T2 (de) 2008-03-20
CA2241765A1 (en) 1998-12-30
TW386313B (en) 2000-04-01

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