DE69920407D1 - Umhülltes oberflächenwellen-bauelement und massenherstellungsverfahren - Google Patents

Umhülltes oberflächenwellen-bauelement und massenherstellungsverfahren

Info

Publication number
DE69920407D1
DE69920407D1 DE69920407T DE69920407T DE69920407D1 DE 69920407 D1 DE69920407 D1 DE 69920407D1 DE 69920407 T DE69920407 T DE 69920407T DE 69920407 T DE69920407 T DE 69920407T DE 69920407 D1 DE69920407 D1 DE 69920407D1
Authority
DE
Germany
Prior art keywords
production method
mass production
surface wave
wave component
enclosed surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69920407T
Other languages
English (en)
Other versions
DE69920407T2 (de
Inventor
Agnes Bidard
Jean-Marc Bureau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Application granted granted Critical
Publication of DE69920407D1 publication Critical patent/DE69920407D1/de
Publication of DE69920407T2 publication Critical patent/DE69920407T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE69920407T 1998-12-08 1999-12-07 Umhülltes oberflächenwellen-bauelement und massenherstellungsverfahren Expired - Fee Related DE69920407T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9815478 1998-12-08
FR9815478A FR2786959B1 (fr) 1998-12-08 1998-12-08 Composant a ondes de surface encapsule et procede de fabrication collective
PCT/FR1999/003036 WO2000035085A1 (fr) 1998-12-08 1999-12-07 Composant a ondes de surface encapsule et procede de fabrication collective

Publications (2)

Publication Number Publication Date
DE69920407D1 true DE69920407D1 (de) 2004-10-28
DE69920407T2 DE69920407T2 (de) 2005-09-29

Family

ID=9533716

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69920407T Expired - Fee Related DE69920407T2 (de) 1998-12-08 1999-12-07 Umhülltes oberflächenwellen-bauelement und massenherstellungsverfahren

Country Status (9)

Country Link
US (1) US6852561B2 (de)
EP (1) EP1053592B1 (de)
JP (1) JP2002532934A (de)
KR (1) KR20010040597A (de)
CN (1) CN1158757C (de)
CA (1) CA2320343A1 (de)
DE (1) DE69920407T2 (de)
FR (1) FR2786959B1 (de)
WO (1) WO2000035085A1 (de)

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FR2838578B1 (fr) * 2002-04-12 2005-04-08 Thales Sa Dispositif d'interconnexion pour composants a ondes acoustiques d'interface
DE10253163B4 (de) * 2002-11-14 2015-07-23 Epcos Ag Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung
JP4177182B2 (ja) * 2003-06-13 2008-11-05 富士通メディアデバイス株式会社 弾性表面波デバイス、そのパッケージ及びその製造方法
US7230512B1 (en) * 2003-08-19 2007-06-12 Triquint, Inc. Wafer-level surface acoustic wave filter package with temperature-compensating characteristics
US7534639B2 (en) * 2003-11-14 2009-05-19 Nxp B.V. Semiconductor device with a resonator
KR100691160B1 (ko) * 2005-05-06 2007-03-09 삼성전기주식회사 적층형 표면탄성파 패키지 및 그 제조방법
DE102005026243B4 (de) * 2005-06-07 2018-04-05 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
US7807550B2 (en) * 2005-06-17 2010-10-05 Dalsa Semiconductor Inc. Method of making MEMS wafers
US8062930B1 (en) 2005-08-08 2011-11-22 Rf Micro Devices, Inc. Sub-module conformal electromagnetic interference shield
US8053872B1 (en) 2007-06-25 2011-11-08 Rf Micro Devices, Inc. Integrated shield for a no-lead semiconductor device package
US8359739B2 (en) 2007-06-27 2013-01-29 Rf Micro Devices, Inc. Process for manufacturing a module
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
CN100546180C (zh) * 2005-08-24 2009-09-30 京瓷株式会社 表面声波装置及其制造方法
US20070048887A1 (en) * 2005-08-26 2007-03-01 Innovative Micro Technology Wafer level hermetic bond using metal alloy
KR100653089B1 (ko) * 2005-10-31 2006-12-04 삼성전자주식회사 탄성 표면파 디바이스 웨이퍼 레벨 패키지 및 그 패키징방법
GB2443756B (en) * 2006-02-24 2010-03-17 Wolfson Microelectronics Plc MEMS device
JP5269301B2 (ja) * 2006-07-21 2013-08-21 太陽誘電株式会社 弾性表面波装置
JP2009010559A (ja) 2007-06-27 2009-01-15 Nippon Dempa Kogyo Co Ltd 圧電部品及びその製造方法
JP4468436B2 (ja) * 2007-12-25 2010-05-26 富士通メディアデバイス株式会社 弾性波デバイスおよびその製造方法
US8384272B2 (en) * 2008-01-30 2013-02-26 Kyocera Corporation Acoustic wave device and method for production of same
US8372674B2 (en) * 2008-02-01 2013-02-12 Honeywell International Inc. Method for chemical sensor fabrication and related sensor
US8101460B2 (en) * 2008-06-04 2012-01-24 Stats Chippac, Ltd. Semiconductor device and method of shielding semiconductor die from inter-device interference
TWI406382B (zh) * 2010-03-09 2013-08-21 台灣晶技股份有限公司 Welded - type vibrator device wafer - level package structure
CN101820264B (zh) * 2010-04-06 2012-06-06 台晶(宁波)电子有限公司 一种贯孔式振子装置晶圆级封装结构
CN101807898B (zh) * 2010-04-06 2012-05-09 台晶(宁波)电子有限公司 一种振子装置三维晶圆级封装结构
US9137934B2 (en) 2010-08-18 2015-09-15 Rf Micro Devices, Inc. Compartmentalized shielding of selected components
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9627230B2 (en) 2011-02-28 2017-04-18 Qorvo Us, Inc. Methods of forming a microshield on standard QFN package
CN103460599B (zh) 2011-03-28 2016-08-17 株式会社村田制作所 电子部件及其制造方法
US9324659B2 (en) * 2011-08-01 2016-04-26 Stats Chippac, Ltd. Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die
US8866285B2 (en) * 2012-09-05 2014-10-21 Taiwan Semiconductor Manufacturing Company, Ltd. Fan-out package comprising bulk metal
US9807890B2 (en) 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
DE102014211558A1 (de) * 2014-06-17 2015-12-17 Robert Bosch Gmbh Mikroelektromechanisches System und Verfahren zum Herstellen eines mikroelektromechanischen Systems
KR102556333B1 (ko) * 2015-12-18 2023-07-17 (주)와이솔 표면 탄성파 웨이퍼 레벨 패키지 및 이를 위한 pcb 제작 방법
US20180269853A1 (en) * 2017-03-14 2018-09-20 Wisol Co., Ltd. Surface acoustic wave wafer level package and method of manufacturing pcb for the same
CN108666410A (zh) * 2017-03-28 2018-10-16 天津威盛电子有限公司 表面声波晶片级封装及其所用的pcb的制造方法
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
CN109728790A (zh) * 2019-01-16 2019-05-07 厦门云天半导体科技有限公司 一种滤波器的晶圆级封装结构及其工艺
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules
US11557491B2 (en) 2019-10-31 2023-01-17 Nxp B.V. Selective underfill assembly and method therefor
CN110943710A (zh) * 2019-11-18 2020-03-31 王之奇 一种滤波器芯片封装结构及其晶圆级封装方法
EP4016620A1 (de) 2020-12-16 2022-06-22 Nxp B.V. Package mit einem ic-chip und einem wellenleiter-anreger
US11963291B2 (en) 2022-04-21 2024-04-16 Nxp B.V. Efficient wave guide transition between package and PCB using solder wall

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GB2171850B (en) * 1985-02-22 1988-05-18 Racal Mesl Ltd Mounting surface acoustic wave components
JPS62109420A (ja) * 1985-11-07 1987-05-20 Alps Electric Co Ltd 弾性表面波素子
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JP2562661Y2 (ja) * 1992-10-13 1998-02-16 株式会社村田製作所 圧電素子の実装構造
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JP3328102B2 (ja) * 1995-05-08 2002-09-24 松下電器産業株式会社 弾性表面波装置及びその製造方法
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JP3196693B2 (ja) * 1997-08-05 2001-08-06 日本電気株式会社 表面弾性波装置およびその製造方法
JP3123477B2 (ja) * 1997-08-08 2001-01-09 日本電気株式会社 表面弾性波素子の実装構造および実装方法
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Also Published As

Publication number Publication date
WO2000035085A1 (fr) 2000-06-15
CN1158757C (zh) 2004-07-21
KR20010040597A (ko) 2001-05-15
HK1036367A1 (en) 2001-12-28
FR2786959B1 (fr) 2001-05-11
JP2002532934A (ja) 2002-10-02
CN1290424A (zh) 2001-04-04
DE69920407T2 (de) 2005-09-29
FR2786959A1 (fr) 2000-06-09
EP1053592B1 (de) 2004-09-22
US20040103509A1 (en) 2004-06-03
US6852561B2 (en) 2005-02-08
CA2320343A1 (fr) 2000-06-15
EP1053592A1 (de) 2000-11-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee