DK0660861T3 - Vandige VOC-frie epoxygrundersammensætninger - Google Patents
Vandige VOC-frie epoxygrundersammensætningerInfo
- Publication number
- DK0660861T3 DK0660861T3 DK93921482.1T DK93921482T DK0660861T3 DK 0660861 T3 DK0660861 T3 DK 0660861T3 DK 93921482 T DK93921482 T DK 93921482T DK 0660861 T3 DK0660861 T3 DK 0660861T3
- Authority
- DK
- Denmark
- Prior art keywords
- primer compositions
- epoxy primer
- free epoxy
- aqueous
- adherend
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000004593 Epoxy Substances 0.000 title 1
- 239000007787 solid Substances 0.000 abstract 3
- 239000002904 solvent Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/166—Metal in the pretreated surface to be joined
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94457092A | 1992-09-14 | 1992-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK0660861T3 true DK0660861T3 (da) | 1997-08-25 |
Family
ID=25481659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK93921482.1T DK0660861T3 (da) | 1992-09-14 | 1993-09-10 | Vandige VOC-frie epoxygrundersammensætninger |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US5461090A (da) |
| EP (1) | EP0660861B1 (da) |
| JP (1) | JPH08501341A (da) |
| AT (1) | ATE153039T1 (da) |
| CA (1) | CA2144547C (da) |
| DE (1) | DE69310754T2 (da) |
| DK (1) | DK0660861T3 (da) |
| ES (1) | ES2102059T3 (da) |
| WO (1) | WO1994006876A1 (da) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2235195T3 (es) * | 1995-08-30 | 2005-07-01 | Cytec Technology Corp. | Composiciones que contienen 1,3,5-triazina carbamatos y compuestos epoxido. |
| JP2001502003A (ja) * | 1996-10-08 | 2001-02-13 | サイテク・テクノロジー・コーポレーシヨン | 架橋剤組成物およびそれを用いた低光沢のエポキシコーティング |
| TW457284B (en) | 1997-09-12 | 2001-10-01 | Cytec Tech Corp | Water based primer compositions and their use for treating metal surfaces |
| MXPA01008705A (es) * | 2000-09-03 | 2004-08-12 | Rohm & Haas | Sistemas de aditivos polimericos multiples: composiciones, procesos y productos derivados. |
| MXPA01008706A (es) | 2000-09-03 | 2004-08-12 | Rohm & Haas | Sistemas aditivos polimericos altos en solidos: composiciones, procesos y productos de los mismos. |
| MXPA01008532A (es) * | 2000-09-03 | 2002-08-06 | Rohm & Haas | Sistema de acitivos funcionales de liquidos-solidos; sus composiciones, procesos y productos. |
| DE10058870A1 (de) | 2000-11-27 | 2002-06-06 | Basf Coatings Ag | Wässriger Beschichtungsstoff, Verfahren zu seiner Herstellung und seine Verwendung |
| US6750274B2 (en) * | 2001-02-08 | 2004-06-15 | Ppg Industries Ohio. Inc. | Weldable coating of phosphated epoxy polymer, curing agent and electroconductive pigment |
| WO2002083328A1 (en) * | 2001-04-11 | 2002-10-24 | World Properties Inc. | Method for improving bonding of rigid, thermosetting compositions to metal and articles formed thereby |
| WO2003004086A2 (en) * | 2001-07-05 | 2003-01-16 | Precision Vascular Systems, Inc. | Troqueable soft tip medical device and method of usage |
| WO2003020000A1 (en) * | 2001-08-22 | 2003-03-06 | World Properties Inc. | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| MXPA04002112A (es) * | 2001-09-06 | 2004-07-08 | Valspar Sourcing Inc | Composiciones de revestimiento estabilizadas. |
| US6916874B2 (en) * | 2001-09-06 | 2005-07-12 | Valspar Sourcing, Inc. | Coating compositions having epoxy functional stabilizer |
| US6924328B2 (en) * | 2001-09-06 | 2005-08-02 | Valspar Sourcing, Inc. | Stabilized coating compositions |
| US7878984B2 (en) * | 2002-07-25 | 2011-02-01 | Boston Scientific Scimed, Inc. | Medical device for navigation through anatomy and method of making same |
| US7914467B2 (en) * | 2002-07-25 | 2011-03-29 | Boston Scientific Scimed, Inc. | Tubular member having tapered transition for use in a medical device |
| US7001369B2 (en) | 2003-03-27 | 2006-02-21 | Scimed Life Systems, Inc. | Medical device |
| JP4433368B2 (ja) * | 2003-04-08 | 2010-03-17 | ジャパンエポキシレジン株式会社 | エポキシ樹脂粒状化物及びその製造方法 |
| JP4151573B2 (ja) * | 2003-12-16 | 2008-09-17 | 東洋紡績株式会社 | 硬化型組成物 |
| US7348370B2 (en) * | 2005-04-27 | 2008-03-25 | United Technologies Corporation | Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer |
| EP1902106B1 (en) * | 2005-07-08 | 2014-08-20 | Henkel Corporation | Primer compositions for adhesive bonding systems |
| WO2009039249A1 (en) * | 2007-09-18 | 2009-03-26 | Martinrea Industries, Inc. | Waterborne corrosion-resistant coating |
| WO2009036790A1 (en) * | 2007-09-21 | 2009-03-26 | Henkel Ag & Co. Kgaa | Primer compositions for adhesive bonding systems and coatings |
| EP2414467B1 (en) * | 2009-03-31 | 2017-05-10 | Cytec Technology Corp. | Water based non-chromated primers for structural bonding applications |
| US7897703B2 (en) * | 2009-05-20 | 2011-03-01 | Hexcel Corporation | Epoxy resin and 4,4′-diaminobenzanilide powder |
| WO2011025472A1 (en) | 2009-08-24 | 2011-03-03 | Dow Global Technologies Inc. | Method of making a particulate epoxy resin |
| US8551021B2 (en) | 2010-03-31 | 2013-10-08 | Boston Scientific Scimed, Inc. | Guidewire with an improved flexural rigidity profile |
| US9068040B2 (en) * | 2010-10-12 | 2015-06-30 | Hexcel Corporation | Solvent resistant thermoplastic toughened epoxy |
| JP6171204B2 (ja) | 2010-12-14 | 2017-08-02 | ディーエスエム アイピー アセッツ ビー.ブイ. | レドーム用材料およびその製造方法 |
| WO2012110091A1 (en) | 2011-02-17 | 2012-08-23 | Dsm Ip Assets B.V. | Enhanced transmission-energy material and method for manufacturing the same |
| US9346925B2 (en) | 2012-06-29 | 2016-05-24 | Dow Global Technologies Llc | Epoxy resin blend dispersion and a process for preparing the dispersion |
| JP5786839B2 (ja) * | 2012-12-05 | 2015-09-30 | 株式会社デンソー | エポキシ樹脂組成物および接着構造体の製造方法 |
| GB201421373D0 (en) | 2014-12-02 | 2015-01-14 | Cytec Ind Inc | Modified amine curing agents, their preparation and use in curable compositions |
| JP2018522954A (ja) | 2015-05-01 | 2018-08-16 | ロード コーポレイション | ゴム接合用接着剤 |
| US11434380B2 (en) | 2017-03-24 | 2022-09-06 | 3M Innovative Properties Company | Aqueous primer composition and related methods |
| JP7465093B2 (ja) * | 2017-10-10 | 2024-04-10 | 味の素株式会社 | 硬化体及びその製造方法、樹脂シート及び樹脂組成物 |
| EP4048739B1 (en) | 2019-10-21 | 2023-05-10 | 3M Innovative Properties Company | Aqueous primer compositions and methods thereof |
| WO2021094899A1 (en) | 2019-11-15 | 2021-05-20 | 3M Innovative Properties Company | Primer composition and methods |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE541693A (da) * | 1954-10-04 | 1900-01-01 | ||
| US3926904A (en) * | 1974-09-30 | 1975-12-16 | United Technologies Corp | Curable crack-resistant epoxy resin |
| CH614972A5 (en) * | 1975-05-20 | 1979-12-28 | Inventa Ag | Process for preparing substrates coated with storage-stable, rapidly curable epoxy resin/hardener mixtures |
| ATE13436T1 (de) * | 1981-03-13 | 1985-06-15 | Akzo Nv | Verfahren zum aufbringen einer beschichtung auf ein substrat. |
| DE3147458A1 (de) * | 1981-12-01 | 1983-07-14 | Hoechst Ag, 6230 Frankfurt | Stabile waessrige epoxidharzdispersion, verfahren zu deren herstellung und deren verwendung |
| JPS58120639A (ja) * | 1982-01-14 | 1983-07-18 | Toho Rayon Co Ltd | 高伸度かつ耐熱性コンポジツト用プリプレグ |
| DE3300561A1 (de) * | 1983-01-10 | 1984-07-12 | Basf Farben + Fasern Ag, 2000 Hamburg | Waessrige dispersion |
| DE3424700A1 (de) * | 1984-07-05 | 1986-02-06 | Basf Ag, 6700 Ludwigshafen | Faserverbundwerkstoffe auf basis von epoxidharzen |
| US5001173A (en) * | 1987-05-11 | 1991-03-19 | Morton Coatings, Inc. | Aqueous epoxy resin compositions and metal substrates coated therewith |
| US4855386A (en) * | 1987-12-31 | 1989-08-08 | Shell Oil Company | Curing agents for epoxy resins comprising diamines with the di(p-aminophenyl)-diisopropyl benzene structure |
| GB9000564D0 (en) * | 1990-01-10 | 1990-03-14 | Dow Rheinmuenster | Modified polyoxyethlene epoxy resin amphiphiles and stable aqueous epoxy dispersions thereof |
-
1993
- 1993-09-10 AT AT93921482T patent/ATE153039T1/de active
- 1993-09-10 CA CA002144547A patent/CA2144547C/en not_active Expired - Lifetime
- 1993-09-10 ES ES93921482T patent/ES2102059T3/es not_active Expired - Lifetime
- 1993-09-10 EP EP93921482A patent/EP0660861B1/en not_active Expired - Lifetime
- 1993-09-10 WO PCT/US1993/008547 patent/WO1994006876A1/en not_active Ceased
- 1993-09-10 DE DE69310754T patent/DE69310754T2/de not_active Expired - Lifetime
- 1993-09-10 JP JP6508183A patent/JPH08501341A/ja active Pending
- 1993-09-10 DK DK93921482.1T patent/DK0660861T3/da active
- 1993-10-01 US US08/130,229 patent/US5461090A/en not_active Expired - Lifetime
-
1995
- 1995-05-15 US US08/441,490 patent/US5576061A/en not_active Expired - Lifetime
- 1995-05-15 US US08/441,487 patent/US5641818A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO1994006876A1 (en) | 1994-03-31 |
| EP0660861A1 (en) | 1995-07-05 |
| DE69310754T2 (de) | 1997-11-27 |
| CA2144547C (en) | 2003-09-09 |
| ES2102059T3 (es) | 1997-07-16 |
| EP0660861B1 (en) | 1997-05-14 |
| ATE153039T1 (de) | 1997-05-15 |
| US5576061A (en) | 1996-11-19 |
| US5641818A (en) | 1997-06-24 |
| DE69310754D1 (de) | 1997-06-19 |
| JPH08501341A (ja) | 1996-02-13 |
| US5461090A (en) | 1995-10-24 |
| CA2144547A1 (en) | 1994-03-31 |
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