DK0697018T3 - Fremgangsmåde til fremstilling af glycidylestere til brug i elektronik-klæbemidler - Google Patents

Fremgangsmåde til fremstilling af glycidylestere til brug i elektronik-klæbemidler

Info

Publication number
DK0697018T3
DK0697018T3 DK95912035T DK95912035T DK0697018T3 DK 0697018 T3 DK0697018 T3 DK 0697018T3 DK 95912035 T DK95912035 T DK 95912035T DK 95912035 T DK95912035 T DK 95912035T DK 0697018 T3 DK0697018 T3 DK 0697018T3
Authority
DK
Denmark
Prior art keywords
glycidyl esters
producing glycidyl
adhesives
electronics
electronics adhesives
Prior art date
Application number
DK95912035T
Other languages
Danish (da)
English (en)
Inventor
Rose Ann Schultz
Sharon Chaplinsky
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of DK0697018T3 publication Critical patent/DK0697018T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
  • Polymerization Catalysts (AREA)
DK95912035T 1994-03-04 1995-03-03 Fremgangsmåde til fremstilling af glycidylestere til brug i elektronik-klæbemidler DK0697018T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/206,778 US5536855A (en) 1994-03-04 1994-03-04 Process for preparing glycidyl esters for use in electronics adhesives
PCT/US1995/002623 WO1995023794A2 (fr) 1994-03-04 1995-03-03 Esters de glycidyle pour adhesifs utilises en electronique et procede de preparation

Publications (1)

Publication Number Publication Date
DK0697018T3 true DK0697018T3 (da) 1999-08-02

Family

ID=22767924

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95912035T DK0697018T3 (da) 1994-03-04 1995-03-03 Fremgangsmåde til fremstilling af glycidylestere til brug i elektronik-klæbemidler

Country Status (10)

Country Link
US (1) US5536855A (fr)
EP (1) EP0697018B1 (fr)
JP (1) JPH08510473A (fr)
KR (1) KR100263526B1 (fr)
AU (1) AU1938295A (fr)
CA (1) CA2162253C (fr)
DE (2) DE69506056T2 (fr)
DK (1) DK0697018T3 (fr)
GB (1) GB2292148B (fr)
WO (1) WO1995023794A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717054A (en) * 1995-06-07 1998-02-10 National Starch & Chemical Investment Holding Corp. Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives
US5646315A (en) * 1995-06-07 1997-07-08 National Starch And Chemical Investment Holding Corporation Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives
US5770706A (en) * 1995-06-07 1998-06-23 National Starch And Chemical Investment Holding Corporation Snap-cure epoxy adhesives
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6936664B2 (en) * 2000-10-04 2005-08-30 Henkel Corporation Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
US20050137357A1 (en) * 2003-12-18 2005-06-23 Skoglund Michael J. Epoxy adhesive composition method of preparing and using
US20070299218A1 (en) * 2006-06-22 2007-12-27 Syh-Tau Yeh Solder-resistant flexible thermosetting epoxy resin system
US8372994B2 (en) 2007-06-28 2013-02-12 Basf Se C10 alkanoic acid glycidyl esters and use thereof
DE102009056187A1 (de) 2008-11-28 2010-07-15 Basf Se Polyesterharz auf Basis von 2-Propylheptansäureglycidester und/oder 4-Methyl-2 propylhexansäureglycidester
JP6686457B2 (ja) * 2016-01-15 2020-04-22 住友ベークライト株式会社 封止用樹脂組成物および電子装置
CN114478622A (zh) * 2022-03-17 2022-05-13 沈阳金久奇科技有限公司 一种磷脂酰胆碱的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7514137L (sv) * 1975-01-24 1976-07-26 Ciba Geigy Ag Sett att framstella polykarboxylsyrapolyglycidylestrar
CH619218A5 (en) * 1975-12-03 1980-09-15 Ciba Geigy Ag Process for the preparation of polyglycidyl polycarboxylates
DE2835886A1 (de) * 1978-08-16 1980-02-28 Bayer Ag Verfahren zur herstellung von glycidylestern aromatischer polycarbonsaeuren
DE2835881A1 (de) * 1978-08-16 1980-02-28 Bayer Ag Verfahren zur herstellung von glycidylestern cycloaliphatischer polycarbonsaeuren
JPS588710B2 (ja) * 1978-10-31 1983-02-17 大阪曹達株式会社 ロジングリシジルエステルの製法
JPS6011910B2 (ja) * 1979-10-26 1985-03-28 岡村製油株式会社 ポリカルボン酸グリシジルエステル
JPS58201866A (ja) * 1982-05-19 1983-11-24 Arakawa Chem Ind Co Ltd ロジンジグリセリドの選択的製造法
DE3247255A1 (de) * 1982-12-21 1984-06-28 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von isolierung von polyglycidylverbindungen
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5036154A (en) * 1989-11-15 1991-07-30 The Dow Chemical Company Preparation of glycidyl esters
US5138078A (en) * 1990-03-15 1992-08-11 Ciba-Geigy Corporation Glycidyl esters of tricarboxylic acid adducts
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
US5218063A (en) * 1991-06-26 1993-06-08 W. R. Grace & Co.-Conn. Epoxy adhesives and methods of using cured compositions therefrom
JP3142610B2 (ja) * 1991-09-25 2001-03-07 株式会社日本触媒 不飽和エステル化合物の製造方法

Also Published As

Publication number Publication date
JPH08510473A (ja) 1996-11-05
GB2292148A (en) 1996-02-14
GB2292148B (en) 1996-05-01
CA2162253A1 (fr) 1995-09-08
DE69506056D1 (de) 1998-12-24
DE69506056T2 (de) 1999-07-15
KR100263526B1 (ko) 2001-11-30
EP0697018B1 (fr) 1998-11-18
WO1995023794A3 (fr) 1995-10-19
US5536855A (en) 1996-07-16
WO1995023794A2 (fr) 1995-09-08
DE697018T1 (de) 1996-10-10
EP0697018A1 (fr) 1996-02-21
AU1938295A (en) 1995-09-18
CA2162253C (fr) 1998-06-30
GB9522618D0 (en) 1996-01-03

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