DK0715927T3 - Blyfrit, blødt loddemetal og anvendelse heraf - Google Patents

Blyfrit, blødt loddemetal og anvendelse heraf

Info

Publication number
DK0715927T3
DK0715927T3 DK95118930T DK95118930T DK0715927T3 DK 0715927 T3 DK0715927 T3 DK 0715927T3 DK 95118930 T DK95118930 T DK 95118930T DK 95118930 T DK95118930 T DK 95118930T DK 0715927 T3 DK0715927 T3 DK 0715927T3
Authority
DK
Denmark
Prior art keywords
soft solder
lead free
free
lead
solder
Prior art date
Application number
DK95118930T
Other languages
English (en)
Inventor
Isabell Dipl-Ing Dr Re Buresch
Original Assignee
Wieland Werke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke Ag filed Critical Wieland Werke Ag
Application granted granted Critical
Publication of DK0715927T3 publication Critical patent/DK0715927T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Coating With Molten Metal (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Powder Metallurgy (AREA)
  • Nonmetallic Welding Materials (AREA)
DK95118930T 1994-12-07 1995-12-01 Blyfrit, blødt loddemetal og anvendelse heraf DK0715927T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4443459A DE4443459C2 (de) 1994-12-07 1994-12-07 Bleifreies Weichlot und seine Verwendung

Publications (1)

Publication Number Publication Date
DK0715927T3 true DK0715927T3 (da) 2001-07-16

Family

ID=6535091

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95118930T DK0715927T3 (da) 1994-12-07 1995-12-01 Blyfrit, blødt loddemetal og anvendelse heraf

Country Status (6)

Country Link
EP (1) EP0715927B1 (da)
JP (1) JP3562891B2 (da)
AT (1) ATE200048T1 (da)
DE (2) DE4443459C2 (da)
DK (1) DK0715927T3 (da)
ES (1) ES2156914T3 (da)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2138378C1 (ru) * 1996-08-30 1999-09-27 Ооо "Арт-Эксперт" Припой для пайки цинка и его сплавов
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
GB9701819D0 (en) * 1997-01-29 1997-03-19 Alpha Fry Ltd Lead-free tin alloy
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP3622462B2 (ja) 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
JP2000068410A (ja) * 1998-08-20 2000-03-03 Nishihara Riko Kk Ｐｂに代わる接合材料で接合端子部にバンプメッキを施した ＢＧＡ又は ＣＳＰ等のＩＣパッケ−ジ
US6660226B1 (en) 2000-08-07 2003-12-09 Murata Manufacturing Co., Ltd. Lead free solder and soldered article
JP3599101B2 (ja) 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
JP4064217B2 (ja) * 2002-11-26 2008-03-19 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用材料
US20140145097A1 (en) * 2004-04-14 2014-05-29 Steven G. Caldwell Radiation shields and methods of making the same
TWI279281B (en) * 2004-05-20 2007-04-21 Theresa Inst Co Ltd Lead-free solder alloy and preparation thereof
JP4939072B2 (ja) * 2005-02-15 2012-05-23 パナソニック株式会社 導電性接着剤
EP1930117B1 (en) * 2005-08-18 2017-05-17 Senju Metal Industry Co., Ltd. Lead-free low-temperature solder
EP2052805B1 (en) * 2006-08-04 2016-09-28 Panasonic Intellectual Property Management Co., Ltd. Bonding material, bonded portion and circuit board
KR102045951B1 (ko) * 2011-08-02 2019-11-18 알파 어셈블리 솔루션스 인크. 고 충격 인성 땜납 합금
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
DE102018104662B4 (de) 2018-03-01 2026-03-26 Endress+Hauser SE+Co. KG Elektronische Schaltung zum Erzeugen, Aufbereiten und/oder Verarbeiten von hochfrequenten Signalen
JP6418349B1 (ja) * 2018-03-08 2018-11-07 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN115647642B (zh) * 2022-11-05 2023-05-16 郑州机械研究所有限公司 一种低熔合金钎料粉及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481795A (en) * 1965-08-09 1969-12-02 Westinghouse Electric Corp Thermoelectric device including tin solder with particles of iron,cobalt or nickel
GB8617676D0 (en) * 1986-07-19 1986-08-28 Ae Plc Bearing alloys
SU1479250A1 (ru) * 1987-05-12 1989-05-15 Киевское Научно-Производственное Объединение Малотоннажных Смазочных Материалов "Масма" Припой дл низкотемпературной пайки
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金

Also Published As

Publication number Publication date
ES2156914T3 (es) 2001-08-01
DE4443459C2 (de) 1996-11-21
EP0715927A1 (de) 1996-06-12
DE59509128D1 (de) 2001-05-03
JPH08224689A (ja) 1996-09-03
EP0715927B1 (de) 2001-03-28
JP3562891B2 (ja) 2004-09-08
ATE200048T1 (de) 2001-04-15
DE4443459A1 (de) 1996-06-13

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