DK0754249T3 - Anvendelse af en forbindelse - Google Patents

Anvendelse af en forbindelse

Info

Publication number
DK0754249T3
DK0754249T3 DK95936651T DK95936651T DK0754249T3 DK 0754249 T3 DK0754249 T3 DK 0754249T3 DK 95936651 T DK95936651 T DK 95936651T DK 95936651 T DK95936651 T DK 95936651T DK 0754249 T3 DK0754249 T3 DK 0754249T3
Authority
DK
Denmark
Prior art keywords
pct
metal
date
chelate
sec
Prior art date
Application number
DK95936651T
Other languages
English (en)
Inventor
John Alexander Macmillan
Original Assignee
Ass Octel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ass Octel filed Critical Ass Octel
Application granted granted Critical
Publication of DK0754249T3 publication Critical patent/DK0754249T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Paints Or Removers (AREA)
DK95936651T 1994-11-11 1995-11-09 Anvendelse af en forbindelse DK0754249T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9422762A GB9422762D0 (en) 1994-11-11 1994-11-11 Use of a compound
PCT/GB1995/002633 WO1996015290A1 (en) 1994-11-11 1995-11-09 Use of a compound

Publications (1)

Publication Number Publication Date
DK0754249T3 true DK0754249T3 (da) 1999-11-08

Family

ID=10764227

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95936651T DK0754249T3 (da) 1994-11-11 1995-11-09 Anvendelse af en forbindelse

Country Status (9)

Country Link
US (1) US5738914A (da)
EP (1) EP0754249B1 (da)
AT (1) ATE180289T1 (da)
AU (1) AU3850795A (da)
DE (1) DE69509769T2 (da)
DK (1) DK0754249T3 (da)
ES (1) ES2133824T3 (da)
GB (1) GB9422762D0 (da)
WO (1) WO1996015290A1 (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569443A (en) * 1994-11-18 1996-10-29 The Dow Chemical Company Method for removing hydrogen sulfide from a gas using polyamino disuccinic acid
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
CA2230275A1 (en) * 1995-08-30 1997-03-06 David A. Wilson Polyamino monosuccinic acid derivative degradable chelants, uses and compositions thereof
GB2333707A (en) * 1998-01-31 1999-08-04 Procter & Gamble Metal ion pesticide containing complexing agent
GB2333772A (en) * 1998-01-31 1999-08-04 Procter & Gamble Complexing agents (eg ethylenediamine disuccinic acid) for use in selectively complexing copper, iron, zinc, nickel and cobalt in the presence of calcium
CN101933404B (zh) * 2008-01-09 2015-07-08 护照系统公司 针对将电感用于生成具有局部旋度的电场的加速器的诊断方法和装置
US20140242264A1 (en) * 2011-10-05 2014-08-28 Atotech Deutschland Gmbh Formaldehyde-free electroless copper plating solution
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
MY173728A (en) * 2013-09-25 2020-02-18 Atotech Deutschland Gmbh Method for depositing a copper seed layer onto a barrier layer
EP3960898A1 (en) * 2020-08-31 2022-03-02 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on a substrate
WO2023114337A1 (en) * 2021-12-14 2023-06-22 Earth Science Laboratories, Inc. Method to coat metals onto surfaces

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158635A (en) * 1959-03-18 1964-11-24 Stauffer Chemical Co Bis-adduction products and methods of preparing same
DE3411980A1 (de) * 1984-03-28 1985-10-10 Schering AG, Berlin und Bergkamen, 1000 Berlin Waessriges, stabiles bad zur chemischen abscheidung von kobalt-phosphor-nickel-phosphor- und kobalt-nickel-phosphor-legierungen
US4704233A (en) * 1986-11-10 1987-11-03 The Procter & Gamble Company Detergent compositions containing ethylenediamine-N,N'-disuccinic acid
JP3084119B2 (ja) * 1992-02-25 2000-09-04 コニカ株式会社 ハロゲン化銀写真感光材料の処理方法
GB2293020B (en) * 1993-05-20 1997-08-27 Dow Chemical Co Succinic acid derivative degradable chelants, uses and compositions thereof
US5569443A (en) * 1994-11-18 1996-10-29 The Dow Chemical Company Method for removing hydrogen sulfide from a gas using polyamino disuccinic acid
GB9322648D0 (en) * 1993-11-03 1993-12-22 Ass Octel Process for the production of s.s.e.d.d.s

Also Published As

Publication number Publication date
DE69509769T2 (de) 1999-11-18
DE69509769D1 (de) 1999-06-24
AU3850795A (en) 1996-06-06
US5738914A (en) 1998-04-14
ES2133824T3 (es) 1999-09-16
EP0754249B1 (en) 1999-05-19
WO1996015290A1 (en) 1996-05-23
EP0754249A1 (en) 1997-01-22
ATE180289T1 (de) 1999-06-15
GB9422762D0 (en) 1995-01-04

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