DK0841167T3 - Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling..... - Google Patents

Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling.....

Info

Publication number
DK0841167T3
DK0841167T3 DK97119648T DK97119648T DK0841167T3 DK 0841167 T3 DK0841167 T3 DK 0841167T3 DK 97119648 T DK97119648 T DK 97119648T DK 97119648 T DK97119648 T DK 97119648T DK 0841167 T3 DK0841167 T3 DK 0841167T3
Authority
DK
Denmark
Prior art keywords
making
hole
substrate
silicon substrate
silicon
Prior art date
Application number
DK97119648T
Other languages
English (en)
Inventor
Masahiro Takizawa
Takayuki Yagi
Junichi Kobayashi
Yasushi Kawasumi
Genzo Momma
Kenji Makino
Kei Fujita
Yasushi Matsuno
Yukihiro Hayakawa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of DK0841167T3 publication Critical patent/DK0841167T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Pressure Sensors (AREA)
  • Weting (AREA)
  • Micromachines (AREA)
DK97119648T 1996-11-11 1997-11-10 Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling..... DK0841167T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29864396 1996-11-11
JP29864296 1996-11-11

Publications (1)

Publication Number Publication Date
DK0841167T3 true DK0841167T3 (da) 2005-01-24

Family

ID=26561605

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97119648T DK0841167T3 (da) 1996-11-11 1997-11-10 Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling.....

Country Status (3)

Country Link
EP (1) EP0841167B1 (da)
DE (1) DE69730667T2 (da)
DK (1) DK0841167T3 (da)

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US6336714B1 (en) 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6273557B1 (en) 1998-03-02 2001-08-14 Hewlett-Packard Company Micromachined ink feed channels for an inkjet printhead
US6379571B1 (en) 1998-06-11 2002-04-30 Canon Kabushiki Kaisha Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus
RU2144472C1 (ru) * 1998-11-03 2000-01-20 Самсунг Электроникс Ко., Лтд. Способ образования толстопленочного слоя в микроинжекционном устройстве
RU2151066C1 (ru) * 1998-11-03 2000-06-20 Самсунг Электроникс Ко., Лтд. Узел пластины сопла микроинжектора и способ его изготовления
RU2144470C1 (ru) * 1998-11-03 2000-01-20 Самсунг Электроникс Ко., Лтд. Микроинжектор и способ его изготовления (варианты)
RU2144471C1 (ru) * 1998-11-03 2000-01-20 Самсунг Электроникс Ко., Лтд. Способ сборки микроинжектора и устройство для осуществления способа
JP4690556B2 (ja) * 2000-07-21 2011-06-01 大日本印刷株式会社 微細パターン形成装置と微細ノズルの製造方法
IT1320599B1 (it) 2000-08-23 2003-12-10 Olivetti Lexikon Spa Testina di stampa monolitica con scanalatura autoallineata e relativoprocesso di fabbricazione.
US6675476B2 (en) 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
US6419346B1 (en) * 2001-01-25 2002-07-16 Hewlett-Packard Company Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6517735B2 (en) 2001-03-15 2003-02-11 Hewlett-Packard Company Ink feed trench etch technique for a fully integrated thermal inkjet printhead
US6818138B2 (en) 2001-06-22 2004-11-16 Hewlett-Packard Development Company, L.P. Slotted substrate and slotting process
DE60222969T2 (de) 2001-08-10 2008-07-24 Canon K.K. Verfahren zur Herstellung eines Flüssigkeitsausstosskopfes, Substrat für einen Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren
ITTO20011019A1 (it) * 2001-10-25 2003-04-28 Olivetti I Jet Procedimento perfezionato per la costruzione di un condotto di alimentazione per una testina di stampa a getto di inchiostro.
US7105097B2 (en) 2002-01-31 2006-09-12 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6880926B2 (en) 2002-10-31 2005-04-19 Hewlett-Packard Development Company, L.P. Circulation through compound slots
CN100355573C (zh) * 2002-12-27 2007-12-19 佳能株式会社 用于制造喷墨记录头的基础件
US6883903B2 (en) 2003-01-21 2005-04-26 Martha A. Truninger Flextensional transducer and method of forming flextensional transducer
US6821450B2 (en) 2003-01-21 2004-11-23 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
KR100480791B1 (ko) 2003-06-05 2005-04-06 삼성전자주식회사 일체형 잉크젯 프린트헤드 및 그 제조방법
JP2005035281A (ja) 2003-06-23 2005-02-10 Canon Inc 液体吐出ヘッドの製造方法
US7429335B2 (en) 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
DE102005046156B3 (de) * 2005-09-27 2007-05-31 Siemens Ag Vorrichtung mit Funktionselement und Verfahren zum Herstellen der Vorrichtung
JP4144640B2 (ja) * 2006-10-13 2008-09-03 オムロン株式会社 振動センサの製造方法
DE102007031549B4 (de) 2007-07-06 2021-07-08 Robert Bosch Gmbh Vorrichtung aus einkristallinem Silizium und Verfahren zur Herstellung einer Vorrichtung aus einkristallinem Silizium
WO2009067123A1 (en) * 2007-11-24 2009-05-28 Hewlett-Packard Development Company, L.P. Inkjet-printing device printhead die having edge protection layer for heating resistor
US9136160B2 (en) 2012-06-29 2015-09-15 Institute of Microelectronics, Chinese Academy of Sciences Solid hole array and method for forming the same
CN103510088B (zh) * 2012-06-29 2015-11-11 中国科学院微电子研究所 固态孔阵及其制作方法
CN103281661B (zh) * 2013-05-09 2019-02-05 上海集成电路研发中心有限公司 一种mems麦克风结构及其制造方法
JP2023108679A (ja) * 2022-01-26 2023-08-07 キヤノン株式会社 記録素子基板及びその製造方法
CN120315166B (zh) * 2025-06-17 2025-08-22 中科院南京天文仪器有限公司 基于双层电极协同刻蚀的mems变形镜及其制备方法

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US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
JP3343875B2 (ja) 1995-06-30 2002-11-11 キヤノン株式会社 インクジェットヘッドの製造方法

Also Published As

Publication number Publication date
EP0841167B1 (en) 2004-09-15
DE69730667D1 (de) 2004-10-21
DE69730667T2 (de) 2005-09-22
EP0841167A2 (en) 1998-05-13
EP0841167A3 (en) 2000-03-08

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