DK0854204T3 - Fremgangsmåde og indretning til fremstilling af en gasblanding omfattende en bæregas, en oxiderende gas og e salin - Google Patents

Fremgangsmåde og indretning til fremstilling af en gasblanding omfattende en bæregas, en oxiderende gas og e salin

Info

Publication number
DK0854204T3
DK0854204T3 DK98400035T DK98400035T DK0854204T3 DK 0854204 T3 DK0854204 T3 DK 0854204T3 DK 98400035 T DK98400035 T DK 98400035T DK 98400035 T DK98400035 T DK 98400035T DK 0854204 T3 DK0854204 T3 DK 0854204T3
Authority
DK
Denmark
Prior art keywords
gas
mixture
silane
carrier gas
saline
Prior art date
Application number
DK98400035T
Other languages
English (en)
Inventor
Alain Villermet
Panayotis Cocolios
Michel Inizan
Francois Coeuret
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Application granted granted Critical
Publication of DK0854204T3 publication Critical patent/DK0854204T3/da

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J12/00Chemical processes in general for reacting gaseous media with gaseous media; Apparatus specially adapted therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45512Premixing before introduction in the reaction chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/10Mixing gases with gases
    • B01F23/19Mixing systems, i.e. flow charts or diagrams; Arrangements, e.g. comprising controlling means
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/04Hydrides of silicon
    • C01B33/043Monosilane
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • C23C16/402Silicon dioxide
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561Gas plumbing upstream of the reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Silicon Compounds (AREA)
  • Catalysts (AREA)
  • Ceramic Products (AREA)
  • Treating Waste Gases (AREA)
  • Coating Apparatus (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Formation Of Insulating Films (AREA)
DK98400035T 1997-01-15 1998-01-09 Fremgangsmåde og indretning til fremstilling af en gasblanding omfattende en bæregas, en oxiderende gas og e salin DK0854204T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9700344A FR2758318B1 (fr) 1997-01-15 1997-01-15 Procede et installation d'elaboration d'un melange gazeux comportant un gaz porteur, un gaz oxydant et un silane

Publications (1)

Publication Number Publication Date
DK0854204T3 true DK0854204T3 (da) 2001-09-24

Family

ID=9502611

Family Applications (1)

Application Number Title Priority Date Filing Date
DK98400035T DK0854204T3 (da) 1997-01-15 1998-01-09 Fremgangsmåde og indretning til fremstilling af en gasblanding omfattende en bæregas, en oxiderende gas og e salin

Country Status (12)

Country Link
US (2) US6177134B1 (da)
EP (1) EP0854204B1 (da)
JP (1) JPH11543A (da)
KR (1) KR19980070497A (da)
AT (1) ATE202806T1 (da)
AU (1) AU741149B2 (da)
CA (1) CA2227529A1 (da)
DE (1) DE69801011T2 (da)
DK (1) DK0854204T3 (da)
ES (1) ES2161018T3 (da)
FR (1) FR2758318B1 (da)
TW (1) TW495380B (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2804044B1 (fr) * 2000-01-25 2002-03-29 Air Liquide Procede et dispositif pour l'optimisation de melanges de gaz reactifs
US7054741B2 (en) * 2002-02-11 2006-05-30 Landnet Corporation Land software tool
EP1827646B1 (en) * 2004-11-30 2015-11-04 Phyre Technologies, Inc. System for facilitating transfer of a component from a liquid phase to a fluid phase
CN100422628C (zh) * 2006-07-28 2008-10-01 周玉成 一种标准气体的动态配制系统
CN110841565A (zh) * 2019-11-08 2020-02-28 协鑫高科纳米新材料(徐州)有限公司 一种用于制备气相二氧化硅的反应罐
CN112827320B (zh) * 2020-12-23 2022-09-09 四川天采科技有限责任公司 一种氯基SiC-CVD制程尾气为反应循环气的FTrPSA可调节分离方法
CN120459866B (zh) * 2025-07-14 2025-09-26 合肥先微半导体材料有限公司 一种硅烷混合气复合纳米催化-温敏智能调控体系及高效搅拌工艺
CN120796946B (zh) * 2025-09-11 2025-12-09 湖南联合半导体科技有限公司 一种用于cvd的供气系统及控制方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808035A (en) * 1970-12-09 1974-04-30 M Stelter Deposition of single or multiple layers on substrates from dilute gas sweep to produce optical components, electro-optical components, and the like
US4002512A (en) * 1974-09-16 1977-01-11 Western Electric Company, Inc. Method of forming silicon dioxide
US4045594A (en) * 1975-12-31 1977-08-30 Ibm Corporation Planar insulation of conductive patterns by chemical vapor deposition and sputtering
US4239811A (en) * 1979-08-16 1980-12-16 International Business Machines Corporation Low pressure chemical vapor deposition of silicon dioxide with oxygen enhancement of the chlorosilane-nitrous oxide reaction
DE3585901D1 (de) * 1984-02-13 1992-05-27 Iii Jerome J Schmitt Verfahren und vorrichtung fuer gasstrahlniederschlag von leitfaehigen und dielektrischen duennen festfilmen und so hergestellte erzeugnisse.
US4992306A (en) * 1990-02-01 1991-02-12 Air Products Abd Chemicals, Inc. Deposition of silicon dioxide and silicon oxynitride films using azidosilane sources
JP2626925B2 (ja) * 1990-05-23 1997-07-02 三菱電機株式会社 基板処理装置および基板処理方法
US5040046A (en) * 1990-10-09 1991-08-13 Micron Technology, Inc. Process for forming highly conformal dielectric coatings in the manufacture of integrated circuits and product produced thereby
FR2704558B1 (fr) * 1993-04-29 1995-06-23 Air Liquide Procede et dispositif pour creer un depot d'oxyde de silicium sur un substrat solide en defilement.
US5728224A (en) * 1995-09-13 1998-03-17 Tetra Laval Holdings & Finance S.A. Apparatus and method for manufacturing a packaging material using gaseous phase atmospheric photo chemical vapor deposition to apply a barrier layer to a moving web substrate

Also Published As

Publication number Publication date
EP0854204B1 (fr) 2001-07-04
FR2758318A1 (fr) 1998-07-17
AU741149B2 (en) 2001-11-22
AU5108298A (en) 1998-07-23
ATE202806T1 (de) 2001-07-15
DE69801011D1 (de) 2001-08-09
JPH11543A (ja) 1999-01-06
FR2758318B1 (fr) 1999-02-05
KR19980070497A (ko) 1998-10-26
DE69801011T2 (de) 2002-03-21
TW495380B (en) 2002-07-21
CA2227529A1 (fr) 1998-07-15
EP0854204A1 (fr) 1998-07-22
US20010000030A1 (en) 2001-03-15
ES2161018T3 (es) 2001-11-16
US6177134B1 (en) 2001-01-23

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