DK0868474T3 - Silicone-elastomer med en høj termisk ledningsevne - Google Patents

Silicone-elastomer med en høj termisk ledningsevne

Info

Publication number
DK0868474T3
DK0868474T3 DK96943158T DK96943158T DK0868474T3 DK 0868474 T3 DK0868474 T3 DK 0868474T3 DK 96943158 T DK96943158 T DK 96943158T DK 96943158 T DK96943158 T DK 96943158T DK 0868474 T3 DK0868474 T3 DK 0868474T3
Authority
DK
Denmark
Prior art keywords
thermal conductivity
filler
high thermal
silicone elastomer
optionally
Prior art date
Application number
DK96943158T
Other languages
English (en)
Inventor
Bernard Dalbe
Yves Giraud
Original Assignee
Rhodia Chimie Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhodia Chimie Sa filed Critical Rhodia Chimie Sa
Application granted granted Critical
Publication of DK0868474T3 publication Critical patent/DK0868474T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Laminated Bodies (AREA)
DK96943158T 1995-12-22 1996-12-20 Silicone-elastomer med en høj termisk ledningsevne DK0868474T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9515776A FR2742763B1 (fr) 1995-12-22 1995-12-22 Elastomere silicone a haute conductibilite thermique
PCT/FR1996/002042 WO1997023555A1 (fr) 1995-12-22 1996-12-20 Elastomere silicone a haute conductibilite thermique

Publications (1)

Publication Number Publication Date
DK0868474T3 true DK0868474T3 (da) 2002-12-30

Family

ID=9486180

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96943158T DK0868474T3 (da) 1995-12-22 1996-12-20 Silicone-elastomer med en høj termisk ledningsevne

Country Status (13)

Country Link
US (1) US6284829B1 (da)
EP (1) EP0868474B1 (da)
CN (1) CN1136258C (da)
AT (1) ATE226606T1 (da)
CA (1) CA2238886C (da)
DE (1) DE69624499T2 (da)
DK (1) DK0868474T3 (da)
ES (1) ES2181931T3 (da)
FR (1) FR2742763B1 (da)
MX (1) MX9804859A (da)
PT (1) PT868474E (da)
TW (1) TW341583B (da)
WO (1) WO1997023555A1 (da)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003214014A1 (en) * 2002-02-28 2003-09-09 Siemens Aktiengesellschaft Highly loaded casting resin system
US20030168731A1 (en) * 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
EP1585784A1 (de) * 2003-01-23 2005-10-19 Siemens Aktiengesellschaft Hochgefülltes giessharzsystem
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
JP4219793B2 (ja) * 2003-11-25 2009-02-04 信越化学工業株式会社 放熱用シリコーングリース組成物
US20090188701A1 (en) * 2004-01-08 2009-07-30 Hiroshi Tsuzuki Inorganic powder, resin composition filled with the powder and use thereof
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
EP1874101A4 (en) * 2005-04-19 2009-11-04 Denki Kagaku Kogyo Kk PCB WITH METAL BASE, LED AND LED LIGHT SOURCE UNIT
CN1978582A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 导热膏及使用该导热膏的电子装置
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
JP5410762B2 (ja) * 2006-12-28 2014-02-05 東レ・ダウコーニング株式会社 加熱硬化性シリコーンゴム組成物
US7736470B2 (en) * 2007-01-25 2010-06-15 Exxonmobil Research And Engineering Company Coker feed method and apparatus
DE102007019942A1 (de) 2007-04-27 2008-11-06 Continental Aktiengesellschaft Kautschukmischung mit verbesserter Rückprallelastizität
CN102648501A (zh) * 2009-12-04 2012-08-22 Abb研究有限公司 高压电涌避雷器
CN102234427B (zh) * 2010-04-29 2013-01-30 比亚迪股份有限公司 一种硅橡胶组合物及硅橡胶的制备方法
WO2015034821A1 (en) * 2013-09-03 2015-03-12 Dow Corning Corporation Additive for a silicone encapsulant
CN106164206B (zh) * 2014-03-27 2019-12-10 3M创新有限公司 填充的包含聚二有机硅氧烷的组合物及其使用方法
KR102480589B1 (ko) 2014-06-19 2022-12-22 잉크론 오이 실록산 폴리머 조성물의 제조 방법
KR102394963B1 (ko) 2017-02-08 2022-05-04 엘켐 실리콘즈 유에스에이 코포레이션 열 관리가 개선된 이차 배터리 팩
JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックＩｐマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
JP7311609B2 (ja) * 2018-12-29 2023-07-19 ダウ グローバル テクノロジーズ エルエルシー Ｍｇｏフィラーを含有する熱伝導性組成物および当該組成物が使用される方法およびデバイス
CN110776745A (zh) * 2019-10-09 2020-02-11 苏州欣天新精密机械有限公司 一种热界面材料的制备方法
WO2021109051A1 (en) * 2019-12-05 2021-06-10 Dow Silicones Corporation Highly thermally conductive flowable silicone composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1602372A (en) * 1977-05-18 1981-11-11 Hotfoil Ltd Electrically conductive rubber composition
JPS5822055B2 (ja) * 1979-06-15 1983-05-06 昭和電工株式会社 高分子物質用配合剤
US4450282A (en) * 1981-07-29 1984-05-22 General Electric Company Catalyst for a process for producing silicones
US4505955A (en) * 1981-07-30 1985-03-19 Dow Corning Corporation Mineral particles bound with silicone elastomeric emulsion
US4518655A (en) * 1983-11-25 1985-05-21 Xerox Corporation Fusing member for electrostatographic copiers
GB8724958D0 (en) * 1987-10-24 1987-11-25 Dow Corning Sa Filled compositions & additives
US5202362A (en) * 1991-09-09 1993-04-13 Intech Specialties Co., Inc. Syringeable ear plug molding putty composition
TW250486B (da) * 1992-08-24 1995-07-01 Gen Electric
US5319040A (en) * 1993-03-12 1994-06-07 General Electric Company Method for making substantially silanol-free silicone resin powder, product and use

Also Published As

Publication number Publication date
EP0868474A1 (fr) 1998-10-07
MX9804859A (es) 1998-10-31
DE69624499T2 (de) 2003-09-04
TW341583B (en) 1998-10-01
FR2742763A1 (fr) 1997-06-27
WO1997023555A1 (fr) 1997-07-03
PT868474E (pt) 2003-03-31
FR2742763B1 (fr) 1998-03-06
CA2238886A1 (fr) 1997-07-03
ES2181931T3 (es) 2003-03-01
CN1136258C (zh) 2004-01-28
CN1205721A (zh) 1999-01-20
ATE226606T1 (de) 2002-11-15
US6284829B1 (en) 2001-09-04
DE69624499D1 (de) 2002-11-28
CA2238886C (fr) 2002-09-17
EP0868474B1 (fr) 2002-10-23

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