DK1005089T3 - Elektronisk effektindretning - Google Patents

Elektronisk effektindretning

Info

Publication number
DK1005089T3
DK1005089T3 DK99402889T DK99402889T DK1005089T3 DK 1005089 T3 DK1005089 T3 DK 1005089T3 DK 99402889 T DK99402889 T DK 99402889T DK 99402889 T DK99402889 T DK 99402889T DK 1005089 T3 DK1005089 T3 DK 1005089T3
Authority
DK
Denmark
Prior art keywords
conducting
circuits
bar
layout
contacts
Prior art date
Application number
DK99402889T
Other languages
English (en)
Inventor
Michel Mermet-Guyennet
Original Assignee
Alstom Holdings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom Holdings filed Critical Alstom Holdings
Application granted granted Critical
Publication of DK1005089T3 publication Critical patent/DK1005089T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Inverter Devices (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Power Conversion In General (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Electronic Switches (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Noodles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Bipolar Transistors (AREA)
DK99402889T 1998-11-27 1999-11-22 Elektronisk effektindretning DK1005089T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9815157A FR2786655B1 (fr) 1998-11-27 1998-11-27 Dispositif electronique de puissance

Publications (1)

Publication Number Publication Date
DK1005089T3 true DK1005089T3 (da) 2008-05-05

Family

ID=9533443

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99402889T DK1005089T3 (da) 1998-11-27 1999-11-22 Elektronisk effektindretning

Country Status (13)

Country Link
US (1) US6278179B1 (da)
EP (1) EP1005089B1 (da)
JP (1) JP2000164798A (da)
KR (1) KR100578441B1 (da)
CN (1) CN1187821C (da)
AT (1) ATE381781T1 (da)
AU (1) AU764576B2 (da)
CA (1) CA2290801C (da)
DE (1) DE69937781T2 (da)
DK (1) DK1005089T3 (da)
ES (1) ES2299235T3 (da)
FR (1) FR2786655B1 (da)
PT (1) PT1005089E (da)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
JP2002026251A (ja) * 2000-07-11 2002-01-25 Toshiba Corp 半導体装置
JP2002324875A (ja) * 2001-04-26 2002-11-08 Fuji Photo Film Co Ltd 半導体パッケージ基台および半導体パッケージ
JP3809346B2 (ja) * 2001-06-15 2006-08-16 トヨタ自動車株式会社 スイッチング回路
FR2834829B1 (fr) * 2002-01-17 2005-04-29 Alstom Convertisseur matriciel pour la transformation d'energie electrique
DE10202095A1 (de) * 2002-01-21 2003-07-24 Siemens Ag Elektrisches Gerät
EP2009676B8 (en) * 2002-05-08 2012-11-21 Phoseon Technology, Inc. A semiconductor materials inspection system
US6680532B1 (en) * 2002-10-07 2004-01-20 Lsi Logic Corporation Multi chip module
US7042086B2 (en) 2002-10-16 2006-05-09 Nissan Motor Co., Ltd. Stacked semiconductor module and assembling method of the same
JP2005094842A (ja) * 2003-09-12 2005-04-07 Toshiba Corp インバータ装置及びその製造方法
JP4491244B2 (ja) * 2004-01-07 2010-06-30 三菱電機株式会社 電力半導体装置
US7210304B2 (en) * 2005-02-09 2007-05-01 General Motors Corporation Cooling arrangements for integrated electric motor-inverters
JP4478049B2 (ja) * 2005-03-15 2010-06-09 三菱電機株式会社 半導体装置
JP2008218688A (ja) * 2007-03-05 2008-09-18 Denso Corp 半導体装置
JP4580036B1 (ja) * 2009-06-12 2010-11-10 株式会社神戸製鋼所 バスバーおよびコネクタ
CN101944835B (zh) * 2009-07-03 2013-08-28 王小云 高功率大电流输出的模块电源
JP5242629B2 (ja) * 2010-05-10 2013-07-24 株式会社東芝 電力用半導体素子
CN102264200B (zh) * 2011-07-01 2014-03-26 江苏宏微科技有限公司 智能功率模块
US8987777B2 (en) * 2011-07-11 2015-03-24 International Rectifier Corporation Stacked half-bridge power module
CN102435428A (zh) * 2011-09-30 2012-05-02 广州高澜节能技术股份有限公司 一种模拟igbt模块发热的测试模块
US8752875B1 (en) 2011-12-22 2014-06-17 Michael J. Gerhardt Electronic device holding system
CN202799522U (zh) * 2012-07-28 2013-03-13 中山大洋电机制造有限公司 一种电机控制器结构
US9673162B2 (en) * 2012-09-13 2017-06-06 Nxp Usa, Inc. High power semiconductor package subsystems
JP6102297B2 (ja) * 2013-02-06 2017-03-29 富士電機株式会社 半導体装置
US9825437B2 (en) 2014-06-04 2017-11-21 Hamilton Sundstrand Corporation Three-dimensional power distribution interconnect structure
US9532448B1 (en) * 2016-03-03 2016-12-27 Ford Global Technologies, Llc Power electronics modules
FR3060845B1 (fr) * 2016-12-19 2019-05-24 Institut Vedecom Circuits electroniques de puissance equipes de bus barres formant dissipateurs thermiques et procede d’integration
GB2563186A (en) * 2017-01-30 2018-12-12 Yasa Motors Ltd Semiconductor arrangement
GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement
DE102017109515B4 (de) 2017-05-04 2024-10-02 Schaeffler Technologies AG & Co. KG Halbleiteranordnung und Verfahren zu deren Herstellung
CN114600238A (zh) * 2020-11-02 2022-06-07 丹尼克斯半导体有限公司 高功率密度3d半导体模块封装
DE102021206935B4 (de) 2021-07-01 2024-01-25 Vitesco Technologies Germany Gmbh Leistungshalbbrückenmodul, Leistungsinverter, Verfahren zur Herstellung eines Leistungshalbbrückenmoduls

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019946A (en) * 1988-09-27 1991-05-28 General Electric Company High density interconnect with high volumetric efficiency
DE4403996A1 (de) * 1994-02-09 1995-08-10 Bosch Gmbh Robert Gleichrichteranordnung für einen Drehstromgenerator
US5532512A (en) * 1994-10-03 1996-07-02 General Electric Company Direct stacked and flip chip power semiconductor device structures
DE59713027D1 (de) * 1996-09-30 2010-03-25 Infineon Technologies Ag Mikroelektronisches bauteil in sandwich-bauweise

Also Published As

Publication number Publication date
JP2000164798A (ja) 2000-06-16
AU5960999A (en) 2000-06-01
FR2786655B1 (fr) 2001-11-23
EP1005089A1 (fr) 2000-05-31
KR100578441B1 (ko) 2006-05-11
DE69937781T2 (de) 2008-12-04
EP1005089B1 (fr) 2007-12-19
CN1255749A (zh) 2000-06-07
US6278179B1 (en) 2001-08-21
DE69937781D1 (de) 2008-01-31
KR20000035704A (ko) 2000-06-26
ATE381781T1 (de) 2008-01-15
PT1005089E (pt) 2008-03-27
CA2290801C (fr) 2006-11-14
AU764576B2 (en) 2003-08-21
ES2299235T3 (es) 2008-05-16
CN1187821C (zh) 2005-02-02
FR2786655A1 (fr) 2000-06-02
CA2290801A1 (fr) 2000-05-27

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