DK1115545T3 - Indretning og fremgangsmåde til overførsel af mikrostrukturer - Google Patents

Indretning og fremgangsmåde til overførsel af mikrostrukturer

Info

Publication number
DK1115545T3
DK1115545T3 DK00920712T DK00920712T DK1115545T3 DK 1115545 T3 DK1115545 T3 DK 1115545T3 DK 00920712 T DK00920712 T DK 00920712T DK 00920712 T DK00920712 T DK 00920712T DK 1115545 T3 DK1115545 T3 DK 1115545T3
Authority
DK
Denmark
Prior art keywords
tool
substrate
measuring
relation
supports
Prior art date
Application number
DK00920712T
Other languages
English (en)
Inventor
Frank Reuther
Alf Springer
Lutz Mueller
Original Assignee
Jenoptik Jena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena Gmbh filed Critical Jenoptik Jena Gmbh
Application granted granted Critical
Publication of DK1115545T3 publication Critical patent/DK1115545T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Surface Treatment Of Glass (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DK00920712T 1999-05-27 2000-04-15 Indretning og fremgangsmåde til overførsel af mikrostrukturer DK1115545T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19925175A DE19925175C1 (de) 1999-05-27 1999-05-27 Einrichtung und Verfahren zur Übertragung von Mikrostrukturen
PCT/EP2000/003438 WO2000073035A1 (de) 1999-05-27 2000-04-15 Einrichtung und verfahren zur übertragung von mikrostrukturen

Publications (1)

Publication Number Publication Date
DK1115545T3 true DK1115545T3 (da) 2002-11-11

Family

ID=7909945

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00920712T DK1115545T3 (da) 1999-05-27 2000-04-15 Indretning og fremgangsmåde til overførsel af mikrostrukturer

Country Status (10)

Country Link
US (1) US6699425B1 (da)
EP (1) EP1115545B1 (da)
JP (1) JP4054534B2 (da)
KR (1) KR100406104B1 (da)
AT (1) ATE220606T1 (da)
DE (2) DE19925175C1 (da)
DK (1) DK1115545T3 (da)
ES (1) ES2179815T3 (da)
TW (1) TW476700B (da)
WO (1) WO2000073035A1 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10233462B4 (de) * 2002-07-24 2009-01-22 Forschungszentrum Karlsruhe Gmbh Vorrichtung zum Prägen und zur Entformung von Strukturkörpern
DE10323365A1 (de) * 2003-05-21 2004-12-09 Robert Bürkle GmbH Vorrichtung zur Herstellung geprägter Substrate
DE10356427B4 (de) * 2003-11-30 2017-03-09 Dieffenbacher Maschinenfabrik Gmbh, Zaisenhausen Verfahren zum deckungsgleichen Ablegen von aus Dekorfolien und Trägerplatten bestehenden Presspaketen
DE102004002014A1 (de) * 2004-01-14 2005-08-11 Pepperl + Fuchs Gmbh Winklige Wandlereinheit und Verfahren zu deren Herstellung sowie winkliges Schaltgerät und Vorrichtung zum Nachweis von Objekten
JP4700996B2 (ja) * 2005-04-19 2011-06-15 東芝機械株式会社 転写装置
US7648354B2 (en) * 2005-04-28 2010-01-19 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
JP4729338B2 (ja) * 2005-05-10 2011-07-20 東芝機械株式会社 転写装置
JP4701008B2 (ja) * 2005-05-25 2011-06-15 東芝機械株式会社 ジンバル機構を備えた転写装置
JP6450790B2 (ja) * 2017-03-02 2019-01-09 ファナック株式会社 表示システムおよび表示方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH664030A5 (de) * 1984-07-06 1988-01-29 Landis & Gyr Ag Verfahren zur erzeugung eines makroskopischen flaechenmusters mit einer mikroskopischen struktur, insbesondere einer beugungsoptisch wirksamen struktur.
DE4205944A1 (de) * 1992-02-24 1993-08-26 Schneider Klaus Verfahren zur einstellung der gegenseitigen lage eines films und einer leiterplatte sowie vorrichtung zur durchfuehrung des verfahrens
US5337151A (en) * 1992-07-28 1994-08-09 Optical Radiation Corporation Double-sided circuit board exposure machine and method with optical registration and material variation compensation
FR2703558B1 (fr) * 1993-03-31 1995-06-30 Automa Tech Sa Installation d'exposition à la lumière d'une plaque de circuit imprimé double face à travers les clichés.
FR2748887B1 (fr) * 1996-05-15 1998-08-21 Automa Tech Sa Installation d'exposition a la lumiere d'une plaque de circuit imprime double face a travers des cliches
DE19648844C1 (de) 1996-11-26 1997-09-18 Jenoptik Jena Gmbh Einrichtung und Verfahren zur Abformung mikrosystemtechnischer Strukturen

Also Published As

Publication number Publication date
KR100406104B1 (ko) 2003-11-14
TW476700B (en) 2002-02-21
DE19925175C1 (de) 2000-05-25
WO2000073035A1 (de) 2000-12-07
US6699425B1 (en) 2004-03-02
JP2003500253A (ja) 2003-01-07
ES2179815T3 (es) 2003-02-01
DE50000283D1 (de) 2002-08-22
EP1115545B1 (de) 2002-07-17
KR20010072056A (ko) 2001-07-31
EP1115545A1 (de) 2001-07-18
JP4054534B2 (ja) 2008-02-27
ATE220606T1 (de) 2002-08-15

Similar Documents

Publication Publication Date Title
PT1100649E (pt) Processo e dispositivo para maqinar pecas por via mecanica e para montar/desmontar conjuntos funcionais
WO2005011947A3 (en) Image processing method and system for microfluidic devices
MXPA04001378A (es) Ejecucion de aplicacion habilitada por pruebas.
WO2004011984A3 (en) Retainer, exposure apparatus, and semiconductor device fabrication method
SE0100367D0 (sv) Method and device for passive alignment
ATE320023T1 (de) Kamerasystem
FI20000444L (fi) Menetelmä siirretyn datan määrän tarkastamiseksi
ATE296465T1 (de) System und verfahren zur kommunikation zwischen einer mobilen datenverarbeitungsvorrichtung und einer stationären datenverarbeitungsvorrichtung
BRPI0413949A (pt) aparelho e sistema para a manipulação de entidades celulares
NO20013052L (no) Styremetode for anvendelse med et boresystem
EP1074517A3 (en) Scribing apparatus
DK0842411T3 (da) Apparat til parallel aligment af makromolekyler og anvendelse
TW200719095A (en) Exposure apparatus, exposure method and device manufacturing method
SG139665A1 (en) Lithographic apparatus with planar motor driven support
SG170060A1 (en) Exposure apparatus, exposure method, and device production method
ES2179815T3 (es) Dispositivo y procedimiento para la transferencia de microestructuras.
DE10196856T1 (de) System zum Kommunizieren mit einer synchronen Vorrichtung
TW331017B (en) Manufacturing and checking method of semiconductor substrate
BR0014585B1 (pt) ferramenta de interior de poÇo, sistema de posicionamento em interior de poÇo para utilizaÇço num conduto de poÇo, sistema para verificaÇço de posicionamento em poÇo, aparelho para encaminhamento de uma ferramenta de poÇo para uma localizaÇço desejada, mÉtodo para determinaÇço da posiÇço de uma ferramenta de interior de poÇo dentro de um conduto de poÇo, mÉtodo de provisço de retorno de informaÇço para a superfÍcie terrestre, e mÉtodo para colocaÇço seletivamente em operaÇço de uma chaveta numa ferramenta de poÇo.
SG132679A1 (en) Exposure apparatus, exposure method, and device fabricating method
DE60304857D1 (de) Ausrichtungs- und versetzungsentfernungseinrichtung, -system und verfahren
CA2198139A1 (en) Embeddable mounting device and method
DE60133108D1 (de) Steuerung einer basisstation in einem telekommunikationssystem
SE9900170D0 (sv) Improved laser writer
ATE430363T1 (de) Klemmvorrichtung eines laufwerks ausgestattet mit einem kommunikationsmittel