DK124440B - Fremgangsmåde til fremstilling af metallisk ledende flader på legemer, især elektriske byggeelementer med ledertræk, i hvilke der findes fordybninger, og apparat til udøvelse af fremgangsmåden. - Google Patents

Fremgangsmåde til fremstilling af metallisk ledende flader på legemer, især elektriske byggeelementer med ledertræk, i hvilke der findes fordybninger, og apparat til udøvelse af fremgangsmåden.

Info

Publication number
DK124440B
DK124440B DK359965AA DK359965A DK124440B DK 124440 B DK124440 B DK 124440B DK 359965A A DK359965A A DK 359965AA DK 359965 A DK359965 A DK 359965A DK 124440 B DK124440 B DK 124440B
Authority
DK
Denmark
Prior art keywords
recesses
bodies
carrying
present
building elements
Prior art date
Application number
DK359965AA
Other languages
English (en)
Inventor
J Polichette
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK124440B publication Critical patent/DK124440B/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DK359965AA 1964-07-15 1965-07-14 Fremgangsmåde til fremstilling af metallisk ledende flader på legemer, især elektriske byggeelementer med ledertræk, i hvilke der findes fordybninger, og apparat til udøvelse af fremgangsmåden. DK124440B (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US382849A US3301175A (en) 1964-07-15 1964-07-15 Method and apparatus for printing on electrical conductor devices

Publications (1)

Publication Number Publication Date
DK124440B true DK124440B (da) 1972-10-16

Family

ID=23510649

Family Applications (1)

Application Number Title Priority Date Filing Date
DK359965AA DK124440B (da) 1964-07-15 1965-07-14 Fremgangsmåde til fremstilling af metallisk ledende flader på legemer, især elektriske byggeelementer med ledertræk, i hvilke der findes fordybninger, og apparat til udøvelse af fremgangsmåden.

Country Status (3)

Country Link
US (1) US3301175A (da)
DK (1) DK124440B (da)
SE (1) SE321017B (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604391A (en) * 1969-05-16 1971-09-14 Western Electric Co Apparatus for applying ink to holes
US4383495A (en) * 1980-06-02 1983-05-17 Western Electric Company, Inc. Apparatus for coating surfaces of a substrate
US4301192A (en) * 1980-06-02 1981-11-17 Western Electric Co., Inc. Method for coating thru holes in a printed circuit substrate
DE3145584C2 (de) * 1981-11-17 1984-03-08 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum Durchkontaktieren einer Leiterplatte
US7036220B2 (en) * 2003-12-18 2006-05-02 The Regents Of The University Of California Pin-deposition of conductive inks for microelectrodes and contact via filling
JP6142831B2 (ja) * 2014-03-27 2017-06-07 ソニー株式会社 実装用基板及びその製造方法、並びに、部品実装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US451978A (en) * 1891-05-12 Machine for printing on glass
US729699A (en) * 1902-07-12 1903-06-02 Frank Test Marking-stamp.
US1773887A (en) * 1929-01-17 1930-08-26 Oxford Varnish Corp Method of producing printing plates
US1993806A (en) * 1932-08-17 1935-03-12 Markem Machine Co Method of making a printed impression on leather or similar material having a mottled surface
US2493953A (en) * 1943-06-26 1950-01-10 Homer Laughlin China Company Potteryware decorating machine
US2748696A (en) * 1951-06-13 1956-06-05 Murray Lilian Printing or decoration of ceramic or other ware
US3108537A (en) * 1960-08-11 1963-10-29 Robert B Way Coating machine
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor
US3158503A (en) * 1962-05-11 1964-11-24 Young Res Lab Ltd Metallizing holes

Also Published As

Publication number Publication date
US3301175A (en) 1967-01-31
SE321017B (da) 1970-02-23

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