DK141411C - - Google Patents
Info
- Publication number
- DK141411C DK141411C DK53967A DK53967A DK141411C DK 141411 C DK141411 C DK 141411C DK 53967 A DK53967 A DK 53967A DK 53967 A DK53967 A DK 53967A DK 141411 C DK141411 C DK 141411C
- Authority
- DK
- Denmark
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52386366A | 1966-02-01 | 1966-02-01 | |
| US52390266A | 1966-02-01 | 1966-02-01 | |
| US52386366 | 1966-02-01 | ||
| US52390266 | 1966-02-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DK141411B DK141411B (da) | 1980-03-10 |
| DK141411C true DK141411C (da) | 1980-09-08 |
Family
ID=27061291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK53967A DK141411B (da) | 1966-02-01 | 1967-01-31 | Bad til afsætning af metalovertræk uden ydre strømtilførsel. |
Country Status (8)
| Country | Link |
|---|---|
| AT (1) | AT289498B (da) |
| CH (1) | CH490509A (da) |
| DE (1) | DE1621309C2 (da) |
| DK (1) | DK141411B (da) |
| ES (1) | ES336275A1 (da) |
| FR (1) | FR1509789A (da) |
| NL (1) | NL166727C (da) |
| SE (1) | SE384880B (da) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE441530B (sv) * | 1980-12-09 | 1985-10-14 | Ericsson Telefon Ab L M | Sett och bad for att utfora stromlos forkoppring |
| IT1157006B (it) * | 1982-03-09 | 1987-02-11 | Alfachimici Spa | Miscela stabilizzante per un bagno di rame chimico |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3119709A (en) * | 1956-09-28 | 1964-01-28 | Atkinson Lab Inc | Material and method for electroless deposition of metal |
| US2884344A (en) * | 1957-10-07 | 1959-04-28 | Reynolds Metals Co | Nickel plating |
-
1967
- 1967-01-30 CH CH135567A patent/CH490509A/de not_active IP Right Cessation
- 1967-01-30 AT AT86567A patent/AT289498B/de not_active IP Right Cessation
- 1967-01-31 DK DK53967A patent/DK141411B/da not_active IP Right Cessation
- 1967-01-31 SE SE138267A patent/SE384880B/xx unknown
- 1967-01-31 DE DE19671621309 patent/DE1621309C2/de not_active Expired
- 1967-01-31 ES ES0336275A patent/ES336275A1/es not_active Expired
- 1967-02-01 NL NL6701526A patent/NL166727C/xx not_active IP Right Cessation
- 1967-02-01 FR FR93313A patent/FR1509789A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AT289498B (de) | 1971-04-26 |
| DE1621309C2 (de) | 1981-04-16 |
| SE384880B (sv) | 1976-05-24 |
| NL166727C (nl) | 1981-09-15 |
| FR1509789A (fr) | 1968-01-12 |
| ES336275A1 (es) | 1967-12-16 |
| DE1621309A1 (de) | 1971-06-03 |
| NL6701526A (da) | 1967-08-02 |
| NL166727B (nl) | 1981-04-15 |
| DE1621309B2 (de) | 1972-10-12 |
| CH490509A (de) | 1970-05-15 |
| DK141411B (da) | 1980-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PBP | Patent lapsed |