DK1471124T3 - Politursammensætning - Google Patents

Politursammensætning

Info

Publication number
DK1471124T3
DK1471124T3 DK04007862T DK04007862T DK1471124T3 DK 1471124 T3 DK1471124 T3 DK 1471124T3 DK 04007862 T DK04007862 T DK 04007862T DK 04007862 T DK04007862 T DK 04007862T DK 1471124 T3 DK1471124 T3 DK 1471124T3
Authority
DK
Denmark
Prior art keywords
polishing composition
polishing
composition
Prior art date
Application number
DK04007862T
Other languages
English (en)
Inventor
Tatsuhito Mutoh
Hirohito Kitano
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Application granted granted Critical
Publication of DK1471124T3 publication Critical patent/DK1471124T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DK04007862T 2003-03-31 2004-03-31 Politursammensætning DK1471124T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003097247A JP4219722B2 (ja) 2003-03-31 2003-03-31 研磨用組成物

Publications (1)

Publication Number Publication Date
DK1471124T3 true DK1471124T3 (da) 2007-03-19

Family

ID=32959554

Family Applications (1)

Application Number Title Priority Date Filing Date
DK04007862T DK1471124T3 (da) 2003-03-31 2004-03-31 Politursammensætning

Country Status (5)

Country Link
US (1) US7211121B2 (da)
EP (1) EP1471124B1 (da)
JP (1) JP4219722B2 (da)
DE (1) DE602004003091T2 (da)
DK (1) DK1471124T3 (da)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7241324B2 (en) * 2004-04-13 2007-07-10 Universal Photonics Llc Method of producing abrasive tools
JP4667025B2 (ja) * 2004-12-03 2011-04-06 日本ミクロコーティング株式会社 研磨スラリー及び方法
US7655057B2 (en) * 2005-08-31 2010-02-02 Fujimi Incorporated Polishing composition and polishing method
JP2007063440A (ja) * 2005-08-31 2007-03-15 Fujimi Inc 研磨用組成物及び研磨方法
DE102006061891A1 (de) 2006-12-28 2008-07-03 Basf Se Zusammensetzung zum Polieren von Oberflächen aus Siliziumdioxid
JP5570685B2 (ja) * 2007-03-16 2014-08-13 花王株式会社 ハードディスク基板用研磨液組成物
JP2009155469A (ja) * 2007-12-26 2009-07-16 Kao Corp 研磨液組成物
WO2012102144A1 (ja) * 2011-01-26 2012-08-02 株式会社 フジミインコーポレーテッド 研磨用組成物、それを用いた研磨方法及び基板の製造方法
CN102585706B (zh) * 2012-01-09 2013-11-20 清华大学 酸性化学机械抛光组合物
US9388330B2 (en) * 2012-12-17 2016-07-12 Fuji Engineering Co., Ltd. Bag containing blasting material
EP2974829B1 (en) * 2013-03-12 2019-06-19 Kyushu University, National University Corporation Polishing pad and polishing method
JP6148932B2 (ja) * 2013-08-20 2017-06-14 花王株式会社 磁気ディスク基板用研磨液組成物
EP3049215B1 (en) 2013-09-25 2021-04-14 3M Innovative Properties Company Composite ceramic abrasive polishing solution
CN109054747A (zh) * 2018-09-13 2018-12-21 深圳市佳欣纳米科技有限公司 一种含有氧化硅和金刚石的不锈钢研磨液及其制备方法
US11198797B2 (en) * 2019-01-24 2021-12-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates
CN115353808B (zh) * 2022-07-13 2024-01-23 锦矽半导体(上海)有限公司 一种镍镀层用抛光液
JP2024070725A (ja) * 2022-11-11 2024-05-23 東邦化学工業株式会社 粘性調整剤

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489389A (en) * 1977-12-27 1979-07-16 Fujimi Kenmazai Kougiyou Kk Composition for polishing of moldings in synthetic resin
DE68927116T2 (de) * 1988-01-19 1997-02-06 Fujimi Inc Poliermasse
JPH0214280A (ja) * 1988-07-01 1990-01-18 Showa Denko Kk プラスチック研磨用組成物
JP3582017B2 (ja) 1993-06-25 2004-10-27 株式会社フジミインコーポレーテッド 研磨用組成物およびプラスチック研磨用組成物
SG83711A1 (en) * 1998-04-23 2001-10-16 Tokyo Magnetic Printing Free abrasive slurry compositions
JP2000183002A (ja) * 1998-12-10 2000-06-30 Okamoto Machine Tool Works Ltd ウエハの研磨終点検出方法および研磨終点検出装置
US6332831B1 (en) * 2000-04-06 2001-12-25 Fujimi America Inc. Polishing composition and method for producing a memory hard disk
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
JP4009986B2 (ja) 2000-11-29 2007-11-21 株式会社フジミインコーポレーテッド 研磨用組成物、およびそれを用いてメモリーハードディスクを研磨する研磨方法

Also Published As

Publication number Publication date
US7211121B2 (en) 2007-05-01
US20040187393A1 (en) 2004-09-30
DE602004003091D1 (de) 2006-12-21
JP4219722B2 (ja) 2009-02-04
DE602004003091T2 (de) 2007-05-03
EP1471124B1 (en) 2006-11-08
JP2004300347A (ja) 2004-10-28
EP1471124A1 (en) 2004-10-27

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