DK1476519T3 - Fremgangsmåde til kemisk-mekanisk polering af metalsubstrater - Google Patents

Fremgangsmåde til kemisk-mekanisk polering af metalsubstrater

Info

Publication number
DK1476519T3
DK1476519T3 DK03739621.5T DK03739621T DK1476519T3 DK 1476519 T3 DK1476519 T3 DK 1476519T3 DK 03739621 T DK03739621 T DK 03739621T DK 1476519 T3 DK1476519 T3 DK 1476519T3
Authority
DK
Denmark
Prior art keywords
chemical
mechanical polishing
metal substrates
composition
microelectronics
Prior art date
Application number
DK03739621.5T
Other languages
English (en)
Inventor
Eric Jacquinot
Didier Bouvet
Patrice Beaud
Original Assignee
Az Electronic Materials Usa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Materials Usa filed Critical Az Electronic Materials Usa
Application granted granted Critical
Publication of DK1476519T3 publication Critical patent/DK1476519T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
DK03739621.5T 2002-02-13 2003-02-12 Fremgangsmåde til kemisk-mekanisk polering af metalsubstrater DK1476519T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0201790A FR2835844B1 (fr) 2002-02-13 2002-02-13 Procede de polissage mecano-chimique de substrats metalliques
PCT/IB2003/000535 WO2003068881A1 (en) 2002-02-13 2003-02-12 Process for chemical-mechanical polishing of metal substrates

Publications (1)

Publication Number Publication Date
DK1476519T3 true DK1476519T3 (da) 2010-06-07

Family

ID=27620173

Family Applications (1)

Application Number Title Priority Date Filing Date
DK03739621.5T DK1476519T3 (da) 2002-02-13 2003-02-12 Fremgangsmåde til kemisk-mekanisk polering af metalsubstrater

Country Status (13)

Country Link
US (1) US7077727B2 (da)
EP (1) EP1476519B1 (da)
JP (1) JP2005518089A (da)
KR (1) KR101030733B1 (da)
CN (1) CN1326212C (da)
AT (1) ATE464361T1 (da)
AU (1) AU2003245744A1 (da)
DE (1) DE60332092D1 (da)
DK (1) DK1476519T3 (da)
FR (1) FR2835844B1 (da)
MY (1) MY135387A (da)
TW (1) TWI271796B (da)
WO (1) WO2003068881A1 (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268667A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
US7300876B2 (en) * 2004-12-14 2007-11-27 Sandisk 3D Llc Method for cleaning slurry particles from a surface polished by chemical mechanical polishing
KR100770571B1 (ko) * 2006-06-05 2007-10-26 테크노세미켐 주식회사 텅스텐의 화학적 기계적 연마슬러리 조성물
CN100425405C (zh) * 2006-08-03 2008-10-15 南京航空航天大学 冷冻纳米磨料抛光垫及其制备方法
US20080096385A1 (en) * 2006-09-27 2008-04-24 Hynix Semiconductor Inc. Slurry composition for forming tungsten pattern and method for manufacturing semiconductor device using the same
KR100948814B1 (ko) * 2006-09-27 2010-03-24 테크노세미켐 주식회사 텅스텐 배선 형성용 슬러리 조성물 및 이를 이용한 반도체소자의 제조 방법
JP5097616B2 (ja) * 2008-05-13 2012-12-12 株式会社オハラ リチウムイオン伝導性ガラスセラミックス体の製造方法
US8865013B2 (en) * 2011-08-15 2014-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing tungsten
KR101419295B1 (ko) * 2012-03-30 2014-07-14 니타 하스 인코포레이티드 연마 조성물
CN103692327A (zh) * 2013-11-29 2014-04-02 广东鸿泰科技股份有限公司 压铸模具散热筋条的抛光方法
CN103753356A (zh) * 2014-01-21 2014-04-30 曼盛包装（上海）有限公司 一种透明pmma注射成型合模线的抛光消除方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340370A (en) * 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
FR2754937B1 (fr) * 1996-10-23 1999-01-15 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux isolants a base de derives du silicium ou de silicium
US6309560B1 (en) * 1996-12-09 2001-10-30 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US5993685A (en) * 1997-04-02 1999-11-30 Advanced Technology Materials Planarization composition for removing metal films
US6479374B1 (en) * 1998-04-01 2002-11-12 Asahi Kasei Kabushiki Kaisha Method of manufacturing interconnection structural body
US6355075B1 (en) * 2000-02-11 2002-03-12 Fujimi Incorporated Polishing composition
US6409781B1 (en) * 2000-05-01 2002-06-25 Advanced Technology Materials, Inc. Polishing slurries for copper and associated materials
US6692546B2 (en) * 2001-08-14 2004-02-17 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for metal and associated materials and method of using same
JP6022684B2 (ja) * 2012-07-13 2016-11-09 サウジ アラビアン オイル カンパニー 炭化水素流体中の塩を検出するための装置、方法、およびシステム

Also Published As

Publication number Publication date
WO2003068881A1 (en) 2003-08-21
US20050085166A1 (en) 2005-04-21
TWI271796B (en) 2007-01-21
FR2835844A1 (fr) 2003-08-15
KR20040089631A (ko) 2004-10-21
JP2005518089A (ja) 2005-06-16
CN1326212C (zh) 2007-07-11
ATE464361T1 (de) 2010-04-15
EP1476519B1 (en) 2010-04-14
EP1476519A1 (en) 2004-11-17
MY135387A (en) 2008-04-30
TW200400553A (en) 2004-01-01
FR2835844B1 (fr) 2006-12-15
US7077727B2 (en) 2006-07-18
KR101030733B1 (ko) 2011-04-26
DE60332092D1 (de) 2010-05-27
CN1633486A (zh) 2005-06-29
AU2003245744A1 (en) 2003-09-04

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