DK1609180T3 - Elektriske forbindelser i substrater - Google Patents

Elektriske forbindelser i substrater

Info

Publication number
DK1609180T3
DK1609180T3 DK04722492.8T DK04722492T DK1609180T3 DK 1609180 T3 DK1609180 T3 DK 1609180T3 DK 04722492 T DK04722492 T DK 04722492T DK 1609180 T3 DK1609180 T3 DK 1609180T3
Authority
DK
Denmark
Prior art keywords
substrates
electrical connections
connections
electrical
Prior art date
Application number
DK04722492.8T
Other languages
English (en)
Inventor
Edvard Kaelvesten
Thorbjoern Ebefors
Pelle Rangsten
Tommy Huhtaoja
Niklas Svedin
Original Assignee
Silex Microsystems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silex Microsystems Ab filed Critical Silex Microsystems Ab
Application granted granted Critical
Publication of DK1609180T3 publication Critical patent/DK1609180T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H10W20/211—Through-semiconductor vias, e.g. TSVs
    • H10W20/217—Through-semiconductor vias, e.g. TSVs comprising ring-shaped isolation structures outside of the via holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DK04722492.8T 2003-03-21 2004-03-22 Elektriske forbindelser i substrater DK1609180T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0300784A SE526366C3 (sv) 2003-03-21 2003-03-21 Elektriska anslutningar i substrat
PCT/SE2004/000439 WO2004084300A1 (en) 2003-03-21 2004-03-22 Electrical connections in substrates

Publications (1)

Publication Number Publication Date
DK1609180T3 true DK1609180T3 (da) 2013-06-24

Family

ID=20290745

Family Applications (1)

Application Number Title Priority Date Filing Date
DK04722492.8T DK1609180T3 (da) 2003-03-21 2004-03-22 Elektriske forbindelser i substrater

Country Status (9)

Country Link
US (1) US7560802B2 (da)
EP (1) EP1609180B1 (da)
JP (1) JP4944605B2 (da)
KR (1) KR101123002B1 (da)
CN (1) CN1791975B (da)
CA (1) CA2519893C (da)
DK (1) DK1609180T3 (da)
SE (1) SE526366C3 (da)
WO (1) WO2004084300A1 (da)

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Also Published As

Publication number Publication date
JP2006521022A (ja) 2006-09-14
HK1084236A1 (en) 2006-07-21
CN1791975B (zh) 2012-05-09
US7560802B2 (en) 2009-07-14
CA2519893C (en) 2013-03-12
WO2004084300A1 (en) 2004-09-30
SE526366C3 (sv) 2005-10-26
CA2519893A1 (en) 2004-09-30
SE0300784L (sv) 2004-09-22
SE0300784D0 (sv) 2003-03-21
KR20060003333A (ko) 2006-01-10
CN1791975A (zh) 2006-06-21
US20070020926A1 (en) 2007-01-25
EP1609180A1 (en) 2005-12-28
SE526366C2 (sv) 2005-08-30
JP4944605B2 (ja) 2012-06-06
EP1609180B1 (en) 2013-04-17
KR101123002B1 (ko) 2012-03-16

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