DK163465C - Kontaktering af en paa et substrat optaget mikroboelgekobling - Google Patents

Kontaktering af en paa et substrat optaget mikroboelgekobling

Info

Publication number
DK163465C
DK163465C DK559685A DK559685A DK163465C DK 163465 C DK163465 C DK 163465C DK 559685 A DK559685 A DK 559685A DK 559685 A DK559685 A DK 559685A DK 163465 C DK163465 C DK 163465C
Authority
DK
Denmark
Prior art keywords
substrate
microwave
contacting
metal frame
substrates
Prior art date
Application number
DK559685A
Other languages
English (en)
Other versions
DK559685D0 (da
DK163465B (da
DK559685A (da
Inventor
Wolfgang Schiller
Original Assignee
Ant Nachrichtentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ant Nachrichtentech filed Critical Ant Nachrichtentech
Publication of DK559685D0 publication Critical patent/DK559685D0/da
Publication of DK559685A publication Critical patent/DK559685A/da
Publication of DK163465B publication Critical patent/DK163465B/da
Application granted granted Critical
Publication of DK163465C publication Critical patent/DK163465C/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H10W44/212—Coaxial feed-throughs in substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DK559685A 1984-12-04 1985-12-03 Kontaktering af en paa et substrat optaget mikroboelgekobling DK163465C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3444076 1984-12-04
DE19843444076 DE3444076A1 (de) 1984-12-04 1984-12-04 Kontaktierung einer auf einem substrat angeordneten mikrowellenschaltung

Publications (4)

Publication Number Publication Date
DK559685D0 DK559685D0 (da) 1985-12-03
DK559685A DK559685A (da) 1986-06-05
DK163465B DK163465B (da) 1992-03-02
DK163465C true DK163465C (da) 1992-07-20

Family

ID=6251787

Family Applications (1)

Application Number Title Priority Date Filing Date
DK559685A DK163465C (da) 1984-12-04 1985-12-03 Kontaktering af en paa et substrat optaget mikroboelgekobling

Country Status (4)

Country Link
EP (1) EP0183916B1 (da)
AT (1) ATE42431T1 (da)
DE (2) DE3444076A1 (da)
DK (1) DK163465C (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402088A (en) * 1992-12-03 1995-03-28 Ail Systems, Inc. Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2456367A1 (de) * 1971-05-10 1976-08-12 Siemens Ag Traegerplatte mit einer gedruckten schaltung
US4042952A (en) * 1976-06-09 1977-08-16 Motorola, Inc. R. F. power transistor device with controlled common lead inductance
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4326180A (en) * 1979-11-05 1982-04-20 Microphase Corporation Microwave backdiode microcircuits and method of making

Also Published As

Publication number Publication date
DK559685D0 (da) 1985-12-03
EP0183916B1 (de) 1989-04-19
DE3569638D1 (en) 1989-05-24
DK163465B (da) 1992-03-02
DE3444076A1 (de) 1986-06-05
DK559685A (da) 1986-06-05
ATE42431T1 (de) 1989-05-15
EP0183916A1 (de) 1986-06-11

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Legal Events

Date Code Title Description
PBP Patent lapsed