DK163885A - Emballage til halvlederskiver - Google Patents

Emballage til halvlederskiver Download PDF

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Publication number
DK163885A
DK163885A DK163885A DK163885A DK163885A DK 163885 A DK163885 A DK 163885A DK 163885 A DK163885 A DK 163885A DK 163885 A DK163885 A DK 163885A DK 163885 A DK163885 A DK 163885A
Authority
DK
Denmark
Prior art keywords
leaders
packaging
semi
Prior art date
Application number
DK163885A
Other languages
English (en)
Other versions
DK163885D0 (da
Inventor
Juergen Voss
Otto Dombkowski
Walter Kudlich
Jan Stodulka
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Publication of DK163885D0 publication Critical patent/DK163885D0/da
Publication of DK163885A publication Critical patent/DK163885A/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
DK163885A 1984-04-12 1985-04-11 Emballage til halvlederskiver DK163885A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843413837 DE3413837A1 (de) 1984-04-12 1984-04-12 Verpackung fuer halbleiterscheiben

Publications (2)

Publication Number Publication Date
DK163885D0 DK163885D0 (da) 1985-04-11
DK163885A true DK163885A (da) 1985-10-13

Family

ID=6233411

Family Applications (1)

Application Number Title Priority Date Filing Date
DK163885A DK163885A (da) 1984-04-12 1985-04-11 Emballage til halvlederskiver

Country Status (5)

Country Link
US (1) US4555024A (da)
EP (1) EP0159416A3 (da)
JP (1) JPS60217973A (da)
DE (1) DE3413837A1 (da)
DK (1) DK163885A (da)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8501716U1 (de) * 1985-01-24 1986-05-22 Bramlage Gmbh, 2842 Lohne Schuhcremedose
IT1181778B (it) * 1985-05-07 1987-09-30 Dynamit Nobel Silicon Spa Contenitore per l'immagazzinamento ed il trasporto di dischetti (fette) di silicio
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
US4767002A (en) * 1986-01-14 1988-08-30 W. R. Grace & Co. Multiple circuit board carrier/shipper
US4721207A (en) * 1986-04-28 1988-01-26 Tensho Electric Industrial Co., Ltd. Hard disk container
US4684021A (en) * 1986-06-23 1987-08-04 Fluoroware, Inc. Bottom loading wafer carrier box
US4747488A (en) * 1986-12-01 1988-05-31 Shoji Kikuchi Hard disk container
US4750506A (en) * 1986-12-24 1988-06-14 Olexa Stephanie A Apparatus for processing a slab gel
US4779724A (en) * 1987-03-23 1988-10-25 Benz William G Support structure for annular magnetic recording disks
US4773537A (en) * 1987-06-22 1988-09-27 Tensho Electric Industrial Co., Ltd. Hard disk container
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US4874083A (en) * 1988-03-01 1989-10-17 Packaging Corporation Of America Serving tray and cover therefor
US4880116A (en) * 1988-03-04 1989-11-14 Fluoroware, Inc. Robotic accessible wafer shipper assembly
US5253755A (en) * 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container
KR930700975A (ko) * 1991-04-11 1993-03-16 플루오로웨어, 아이엔시. 폴리프로필렌 웨이퍼 캐리어
US5273159A (en) * 1992-05-26 1993-12-28 Empak, Inc. Wafer suspension box
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5265725A (en) * 1992-07-20 1993-11-30 Curtis Manufacturing Company, Inc. Multiple media storage container and system
US5348151A (en) * 1993-12-20 1994-09-20 Empak, Inc. Low profile disk carrier
US5472086A (en) * 1994-03-11 1995-12-05 Holliday; James E. Enclosed sealable purgible semiconductor wafer holder
US5476176A (en) * 1994-05-23 1995-12-19 Empak, Inc. Reinforced semiconductor wafer holder
JP3269631B2 (ja) * 1994-07-08 2002-03-25 信越半導体株式会社 半導体結晶収納容器
US5816410A (en) * 1994-07-15 1998-10-06 Fluoroware, Inc. Wafer cushions for wafer shipper
US5586658A (en) * 1995-06-06 1996-12-24 Fluoroware, Inc. Wafer cushions for wafer shipper
USD368802S (en) 1994-10-13 1996-04-16 Gallagher Gary M 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
USD376688S (en) 1994-12-20 1996-12-24 Empak, Inc. Semiconductor wafer cassette transport box
US5803269A (en) * 1995-10-13 1998-09-08 Empak, Inc. 300mm shipping container
KR100428828B1 (ko) * 1995-10-13 2005-04-20 엠팍 인코포레이티드 300㎜적재컨테이너
USD378873S (en) * 1995-10-13 1997-04-22 Empak, Inc. 300 mm microenvironment pod with door on side
USD387903S (en) * 1995-10-13 1997-12-23 Empak, Inc. Shipping container
USD383898S (en) * 1995-10-13 1997-09-23 Empak, Inc. Combination shipping and transport cassette
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
USD379431S (en) * 1996-03-13 1997-05-27 Tenneco Packaging Dome lid for a container
US6736268B2 (en) * 1997-07-11 2004-05-18 Entegris, Inc. Transport module
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
US6267245B1 (en) 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
US5975308A (en) * 1998-10-28 1999-11-02 United Microelectronics Corp. Wafer container for storing integrated circuit wafers
US5992638A (en) * 1998-11-11 1999-11-30 Empak, Inc. Advanced wafer shipper
US6257401B1 (en) 1999-05-14 2001-07-10 Pactiv Corporation Vented container with handles and embossment
USD508819S1 (en) 1999-05-14 2005-08-30 Pactiv Corporation Cover for a container
USD443205S1 (en) 1999-05-14 2001-06-05 Tenneco Packaging Inc. Bottom for a container
USD432914S (en) * 1999-05-27 2000-10-31 Pactiv Corporation Bottom for a container
USD433334S (en) * 1999-05-27 2000-11-07 Pactiv Corporation Cover for a container
USD444382S1 (en) 1999-10-06 2001-07-03 Pactiv Corporation Cover for a container
JP2001298076A (ja) * 2000-04-12 2001-10-26 Sony Corp 基板搬送コンテナ
US6669253B2 (en) * 2000-12-18 2003-12-30 David W. Benzing Wafer boat and boat holder
US6951284B2 (en) * 2001-11-14 2005-10-04 Entegris, Inc. Wafer carrier with wafer retaining system
US20060042998A1 (en) * 2004-08-24 2006-03-02 Haggard Clifton C Cushion for packing disks such as semiconductor wafers
EP2081223A4 (en) * 2006-11-07 2011-09-07 Shinetsu Polymer Co SUBSTRATE CONTAINER
TWI465375B (zh) 2010-06-02 2014-12-21 家登精密工業股份有限公司 一種配置有彈性件模組之晶圓盒
KR20160033910A (ko) * 2014-09-19 2016-03-29 삼성전자주식회사 리테이너 및 이를 포함하는 웨이퍼 캐리어

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043451A (en) * 1976-03-18 1977-08-23 Fluoroware, Inc. Shipping container for silicone semiconductor wafers
US4061228A (en) * 1976-12-20 1977-12-06 Fluoroware, Inc. Shipping container for substrates
DE2702464C2 (de) * 1977-01-21 1981-10-15 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verpackung von Halbleiterscheiben
US4450960A (en) * 1982-08-30 1984-05-29 Empak Inc. Package

Also Published As

Publication number Publication date
US4555024A (en) 1985-11-26
EP0159416A3 (de) 1988-07-27
DE3413837A1 (de) 1985-10-17
DK163885D0 (da) 1985-04-11
JPS60217973A (ja) 1985-10-31
EP0159416A2 (de) 1985-10-30

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