DK1661207T3 - Fleksibel konform antenne - Google Patents

Fleksibel konform antenne

Info

Publication number
DK1661207T3
DK1661207T3 DK04778731T DK04778731T DK1661207T3 DK 1661207 T3 DK1661207 T3 DK 1661207T3 DK 04778731 T DK04778731 T DK 04778731T DK 04778731 T DK04778731 T DK 04778731T DK 1661207 T3 DK1661207 T3 DK 1661207T3
Authority
DK
Denmark
Prior art keywords
electrical communication
transition
wave guide
caged
flexible compliant
Prior art date
Application number
DK04778731T
Other languages
Danish (da)
English (en)
Inventor
Stephen R Kerner
Clifton Quan
Raquel Z Rokosky
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of DK1661207T3 publication Critical patent/DK1661207T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093—Monolithic arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Connection Structure (AREA)
  • Details Of Aerials (AREA)
  • Waveguides (AREA)
  • Transceivers (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
DK04778731T 2003-09-03 2004-07-22 Fleksibel konform antenne DK1661207T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/654,121 US6992629B2 (en) 2003-09-03 2003-09-03 Embedded RF vertical interconnect for flexible conformal antenna
PCT/US2004/023358 WO2005025001A1 (en) 2003-09-03 2004-07-22 Embedded rf vertical interconnect for flexible conformal antenna

Publications (1)

Publication Number Publication Date
DK1661207T3 true DK1661207T3 (da) 2007-09-24

Family

ID=34218016

Family Applications (1)

Application Number Title Priority Date Filing Date
DK04778731T DK1661207T3 (da) 2003-09-03 2004-07-22 Fleksibel konform antenne

Country Status (12)

Country Link
US (1) US6992629B2 (de)
EP (1) EP1661207B1 (de)
JP (1) JP4571638B2 (de)
KR (1) KR100733103B1 (de)
AT (1) ATE371965T1 (de)
AU (1) AU2004303071B2 (de)
CA (2) CA2525620C (de)
DE (1) DE602004008653T2 (de)
DK (1) DK1661207T3 (de)
ES (1) ES2290766T3 (de)
NO (1) NO20061449L (de)
WO (1) WO2005025001A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098853B2 (en) * 2004-07-21 2006-08-29 Raytheon Company Conformal channel monopole array antenna
US9395718B1 (en) 2005-06-03 2016-07-19 Sciperio, Inc. Optimization of unique antenna and RF systems for specific substrates
EP1784063A1 (de) * 2005-11-08 2007-05-09 Alcatel Lucent Leiterplatte mit darauf montierten mikroelektronischen Komponenten und Verfahren zur Herstellung einer solchen Leiterplatte
US20070210959A1 (en) * 2006-03-07 2007-09-13 Massachusetts Institute Of Technology Multi-beam tile array module for phased array systems
US7671696B1 (en) * 2006-09-21 2010-03-02 Raytheon Company Radio frequency interconnect circuits and techniques
US8279131B2 (en) * 2006-09-21 2012-10-02 Raytheon Company Panel array
US9019166B2 (en) 2009-06-15 2015-04-28 Raytheon Company Active electronically scanned array (AESA) card
US9172145B2 (en) 2006-09-21 2015-10-27 Raytheon Company Transmit/receive daughter card with integral circulator
US7869225B2 (en) * 2007-04-30 2011-01-11 Freescale Semiconductor, Inc. Shielding structures for signal paths in electronic devices
US7631414B2 (en) * 2007-08-13 2009-12-15 Raytheon Company Methods for producing large flat panel and conformal active array antennas
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
FR2930374B1 (fr) * 2008-04-18 2011-08-26 Thales Sa Circulateur radiofrequence a base de mems.
FR2936610B1 (fr) * 2008-09-30 2011-11-25 Thales Sa Module d'emission et de reception de signaux hyperfrequences en bande x sur circuit multicouche et antenne active
US7990237B2 (en) * 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
US7965235B2 (en) * 2009-02-24 2011-06-21 Raytheon Company Multi-channel thinned TR module architecture
US7876263B2 (en) * 2009-02-24 2011-01-25 Raytheon Company Asymmetrically thinned active array TR module and antenna architecture
US8538071B2 (en) * 2009-03-18 2013-09-17 Raytheon Company System and method for target separation of closely spaced targets in automatic target recognition
IL197906A (en) * 2009-04-05 2014-09-30 Elta Systems Ltd Antenna arrays and method for creating them
US20110024160A1 (en) * 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
US20110031246A1 (en) * 2009-08-07 2011-02-10 Massey Jr Raymond C Tamper-Resistant Storage Container
US8127432B2 (en) 2009-11-17 2012-03-06 Raytheon Company Process for fabricating an origami formed antenna radiating structure
US9072164B2 (en) * 2009-11-17 2015-06-30 Raytheon Company Process for fabricating a three dimensional molded feed structure
US8362856B2 (en) * 2009-11-17 2013-01-29 Raytheon Company RF transition with 3-dimensional molded RF structure
US8043464B2 (en) * 2009-11-17 2011-10-25 Raytheon Company Systems and methods for assembling lightweight RF antenna structures
US8537059B2 (en) * 2009-11-20 2013-09-17 Raytheon Company Cooling system for panel array antenna
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
RU2488220C1 (ru) * 2011-12-28 2013-07-20 Аслан Юсуфович Хуако Приемопередатчик
CN105359267B (zh) * 2013-07-03 2018-06-05 罗森伯格高频技术有限及两合公司 包括具有至少部分被电介质层包围的多个金属芯的互连件的互连系统
US10109920B2 (en) 2015-09-09 2018-10-23 The Johns Hopkins University Metasurface antenna
KR102384505B1 (ko) * 2016-01-12 2022-04-08 삼성전자주식회사 칩 간 무선 통신을 제공하기 위한 방법 및 장치
DE102016007052A1 (de) 2016-06-06 2017-12-07 Kathrein-Werke Kg Leiterplattenanordnung zur Signalversorgung eines Strahlers
CN111226348B (zh) * 2017-10-17 2022-03-11 康普技术有限责任公司 用于具有多层基板的微波和毫米波通信系统的垂直过渡
US12051850B2 (en) 2019-04-25 2024-07-30 Lg Electronics Inc. Electronic device having connector
DE102019110840A1 (de) * 2019-04-26 2020-10-29 Infineon Technologies Ag Rf-vorrichtungen mit konformen antennen und verfahren zu deren herstellung
EP3836301B1 (de) * 2019-12-09 2024-01-24 NXP USA, Inc. Multipolarisierte antennengruppe
CN111586965B (zh) * 2020-05-25 2022-03-22 上海航天电子通讯设备研究所 基于lcp基材的高功率共形组件制备方法及共形组件
CN111640682B (zh) * 2020-05-31 2022-07-08 西南电子技术研究所（中国电子科技集团公司第十研究所） 分离器件金丝键合过渡结构
TWI749580B (zh) * 2020-06-08 2021-12-11 星河半導體股份有限公司 多通道天線晶片測試系統及方法
US12439517B2 (en) * 2021-09-27 2025-10-07 Chengdu Boe Optoelectronics Technology Co., Ltd. Circuit board structure and display device
WO2024036138A1 (en) 2022-08-10 2024-02-15 Menlo Microsystems, Inc. High frequency differential single pole multiple throw switch module

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS636884Y2 (de) * 1981-01-16 1988-02-27
US5416453A (en) * 1989-09-29 1995-05-16 Hughes Aircraft Company Coaxial-to-microstrip orthogonal launchers having troughline convertors
FR2681946A1 (fr) 1991-09-27 1993-04-02 Thomson Csf Dispositif pour tests hyperfrequences a large bande realises in situ.
JPH06268414A (ja) * 1993-03-12 1994-09-22 Nec Corp マイクロストリップ線路型サーキュレータ
JP2912158B2 (ja) * 1994-05-17 1999-06-28 日本電気アイシーマイコンシステム株式会社 信号線切替回路
JPH08250912A (ja) * 1995-03-14 1996-09-27 Japan Radio Co Ltd ストリップラインの垂直給電部
US5570068A (en) * 1995-05-26 1996-10-29 Hughes Aircraft Company Coaxial-to-coplanar-waveguide transmission line connector using integrated slabline transition
US5668509A (en) * 1996-03-25 1997-09-16 Hughes Electronics Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies
US6127978A (en) * 1997-03-28 2000-10-03 Honda Giken Kogyo Kabushiki Kaisha Planar antenna module
JP3635873B2 (ja) * 1997-06-26 2005-04-06 三菱電機株式会社 ストリップライン給電装置
JP3149831B2 (ja) 1997-11-07 2001-03-26 日本電気株式会社 高周波集積回路およびその製造方法
US6154176A (en) * 1998-08-07 2000-11-28 Sarnoff Corporation Antennas formed using multilayer ceramic substrates
US6356245B2 (en) 1999-04-01 2002-03-12 Space Systems/Loral, Inc. Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same
US6236287B1 (en) * 1999-05-12 2001-05-22 Raytheon Company Wideband shielded coaxial to microstrip orthogonal launcher using distributed discontinuities
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
JP2001144511A (ja) * 1999-11-17 2001-05-25 Mitsubishi Electric Corp 平面型導波路の接続用変換器
US6683570B2 (en) * 2001-03-29 2004-01-27 Tyco Electronics Corporation Compact multi-band antenna
WO2002096166A1 (en) * 2001-05-18 2002-11-28 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates

Also Published As

Publication number Publication date
US20050046510A1 (en) 2005-03-03
KR100733103B1 (ko) 2007-06-28
KR20060083200A (ko) 2006-07-20
WO2005025001A8 (en) 2005-10-27
NO20061449L (no) 2006-03-30
WO2005025001A1 (en) 2005-03-17
CA2525620A1 (en) 2005-03-17
US6992629B2 (en) 2006-01-31
JP4571638B2 (ja) 2010-10-27
CA2525620C (en) 2011-02-08
CA2729740A1 (en) 2005-03-17
ES2290766T3 (es) 2008-02-16
EP1661207A1 (de) 2006-05-31
AU2004303071A1 (en) 2005-03-17
CA2729740C (en) 2013-04-02
DE602004008653D1 (de) 2007-10-11
EP1661207B1 (de) 2007-08-29
ATE371965T1 (de) 2007-09-15
AU2004303071B2 (en) 2008-02-28
JP2007504749A (ja) 2007-03-01
DE602004008653T2 (de) 2008-06-05

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