DK178014B1 - Construction element with at least one electronic component - Google Patents

Construction element with at least one electronic component Download PDF

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Publication number
DK178014B1
DK178014B1 DK201470011A DKPA201470011A DK178014B1 DK 178014 B1 DK178014 B1 DK 178014B1 DK 201470011 A DK201470011 A DK 201470011A DK PA201470011 A DKPA201470011 A DK PA201470011A DK 178014 B1 DK178014 B1 DK 178014B1
Authority
DK
Denmark
Prior art keywords
layer
electrically conductive
electronic component
electrically conducting
controller
Prior art date
Application number
DK201470011A
Other languages
English (en)
Inventor
Lars Frederiksen
Original Assignee
Led Ibond Holding Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DK201470011A priority Critical patent/DK178014B1/da
Application filed by Led Ibond Holding Aps filed Critical Led Ibond Holding Aps
Priority to PCT/DK2015/050001 priority patent/WO2015104024A1/en
Priority to CN201580004029.XA priority patent/CN105899873B/zh
Priority to EP15700004.3A priority patent/EP3094923B1/en
Priority to JP2016563243A priority patent/JP6356264B2/ja
Priority to DK15700004.3T priority patent/DK3094923T3/da
Priority to CN201711402960.0A priority patent/CN108105595B/zh
Priority to US15/110,605 priority patent/US9874339B2/en
Priority to SG11201605586VA priority patent/SG11201605586VA/en
Priority to EP19164880.7A priority patent/EP3553375B1/en
Priority to BR112016016028-2A priority patent/BR112016016028B1/pt
Priority to RU2016130791A priority patent/RU2664952C2/ru
Priority to US14/593,565 priority patent/US9587812B2/en
Application granted granted Critical
Publication of DK178014B1 publication Critical patent/DK178014B1/da

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00Structural combinations of lighting devices with other articles, not otherwise provided for
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/04Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/0025Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/006General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2121/00Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2121/008Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00 for simulation of a starry sky or firmament
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

The present invention relates to a construction element e.g. for use as a ceiling panel. In particular the present invention relates to a construction element comprising: a sandwich structure comprising an electrically insulating layer and at least two electrically conducting layers, which comprises an electrically conducting front layer and an electrically conducting rear layer which are spaced apart by an electrically insulating layer, a circuit board carrying an electronic component and being positioned between the electronic component and the electrically conducting rear layer, the electronic component comprising a first and a second electrical terminal, wherein the first electrical terminal is in electrical connection with the electrically conducting front layer, and the second electrical terminal is in electrical connection with the electrically conducting rear layer. The invention further relates to a related method.
BACKGROUND OF THE INVENTION
Attaching and electrically connecting electronic components such as light emitting diodes (LEDs) to sandwich construction panels is known in the art, and is used to create construction panels with light emitting elements.
One such example is known from EP 2 485 342 disclosing a construction panel having a sandwich structure comprising an electrically conducting front plate and an electrically conducting rear plate which are spaced apart by an electrically insulating layer, and at least one light emitter positioned in an aperture in the electrically conducting front plate.
It is also known to control LEDs in e.g. Christmas lights, dance floors etc.
It is an object of the invention to provide a simple solution to controlling electronic components such as LEDs, to a lower cost and reduced amount of cabling compared to prior art solutions.
This is achieved with a controller comprised by the construction element adapted for communication of data signals via at least one of the electrically conducting layers.
DESCRIPTION OF THE INVENTION
In a first aspect, the present invention relates to a construction element, the construction element comprising: a sandwich structure comprising an electrically insulating layer and at least two electrically conducting layers, which comprises: an electrically conducting front layer and an electrically conducting rear layer which are spaced apart by an electrically insulating layer, a circuit board carrying an electronic component and being positioned between the electronic component and the electrically conducting rear layer, the electronic component comprising a first and a second electrical terminal, wherein the first electrical terminal is in electrical connection with the electrically conducting front layer, and the second electrical terminal is in electrical connection with the electrically conducting rear layer, wherein the construction element comprises a controller adapted for communication of data signals via at least one of the electrically conducting layers.
By transmitting data signals via at least one of the electrically conducting layers, it is not necessary to have a large circuit board, where the electronic components are attached to in order to facilitate the data communication. Instead a much cheaper electrically conducting layer such as an aluminum plate may be used. This is particularly advantageous over large distances or a greater area such as a ceiling or a tunnel. Examples of electronic components are LEDs, transistors, controllers, chip on boards (COB) or fans.
In the context of the present invention, the term "light emitting diode" or LED is to be understood as a LED comprising one or more light emitters. For example a RGB LED comprises a red, a green and a blue light emitter.
The data is not necessarily transmitted via the electrically conducting front layer and/or the electrically conducting rear layer, but may be transmitted via a third layer positioned preferably between the electrically conducting front layer and the electrically conducting rear layer, but may also be positioned on either side of the respective layers.
The construction element of the present invention may be adapted to be used in the construction of a building; a ship; an airplane; a vehicle such as a car or a truck; lamps or the like.
The term "sandwich structure" is to be understood as a composite composed of a lightweight core (the electrically insulating layer) to which two or more outer layers (the electrically conducting front and rear layers) are fastened e.g. by means of an adhesive.
The term "construction element" is to be understood as an element not only for use in a construction such as a building, where it may be used as a ceiling or wall panel, but it may also be used in a lamp or lighting system.
The term "electrical terminal" is to be understood a point or element for entry of power and/or data.
In the present invention, the terms "electrically conducting front layer" and "electrically conducting rear layer" shall not be seen as limiting. Accordingly, the electrically conducting rear layer may be used as a front layer and vice versa.
The density of the core may be lower or higher than the density of the outer layers. The core may be thicker or thinner than each or both of the outer layers. The core may be thinner than each or both of the outer layers.
The construction element may comprise two or more electronic components (e.g. LEDs).
The electrically conducting front and rear layers may be made from the same materials or of different electrically conducting materials. The electrically conducting materials may be one or more of titanium, aluminum, cobber, steel, stainless steel, silver, gold, graphite, brass, silicon and conducting polymer or a composite material.
The thickness of each of the electrically conducting layers may be up to 50 millimeters, such as up to 40 millimeters, such as up to 30 millimeters, such as up to 20 millimeters, such as up to 10 millimeters, such as up to 5 millimeters, such as up to 1 millimeter, such as 0.1-50 millimeters, such as 0.4 to 1 millimeters.
The electrically conducting front and/or rear layer may be divided into one or more separate zones such that different electrical potentials may be defined.
The electrically insulating material may comprise a foamed material (open and/or closed celled) and/or a reinforced material such as a fiber glass material. The electrically insulating layer may be made of a polymer material such as amorphous plastic materials (e.g. polyvinylchloride, polycarbonate and polystyrene) or crystalline plastic materials (e.g. Nylon, polyethylene and polypropylene), or wood.
The electrically insulating material may define a honeycomb structure.
The construction element may be a construction panel. A construction panel is a construction element that may be used as a ceiling and/or a wall and/or a floor and/or a shelf and/or a top and/or other part of a construction. The construction panel may be used as an outer surface of the building or an inner surface of a room or space, such as an elevator.
As an example, the construction panel may be used as a ceiling panel in a building. Such a ceiling panel may be a panel which is attached or secured to a grid-like structure suspended from the ceiling. Alternatively, the ceiling may form a larger surface. The ceiling panel may be directly fastened to a surface such as a ceiling or a wall.
In an embodiment the data signals are transmitted via the electrically conducting front layer and/or the electrically conducting rear layer by means of Direct Current Power Line Communication (DC PLC). Thus there is no separate layer for data communication, but instead the data is transmitted on the same layer as the power to the electrical component. This dispenses with the need for separate wiring for data transfer.
The construction element may further comprise a third conducting layer, preferably positioned between the electrically conducting front layer and the electrically conducting rear layer, where the third conducting layer is adapted to transmit the data signals. By adding a third layer the data transfer is separated from the power transfer. Thereby any glitch or noise over the power line does not disturb the data transfer. Additionally more layers may be added to the structure such that the electrically conducting front or rear layer are not necessarily the outermost layers. Further layers may also be added between the electrically conducting front or rear layer.
The electronic component may be a light emitting diode, LED, preferably a Surface Mount Diode, SMD and/or a Red, Green, Blue, RGB, light emitting diode. The construction element is particularly suitable for SMD's although other electronic components may be used in this construction element as well.
The controller may be adapted to control one or more of color of emitted light, color combination of emitted light from two or more light emitters, invisible light frequencies and/or light intensity. For example it may be able to dim the light change and/or the color combination of and RGB diode. It may also be able to read output from a sensor and in turn control the elec- tronic component based on the output.
The construction element may comprise at least a first and a second electronic component, the first electronic component being connected to a first controller and the second electronic component being connected to a second controller, wherein the first controller is adapted to receive data from the second controller and the second controller is adapted to send data to the first controller. Consequently the controller associated with a first electronic component may be able to control the output of a second electronic component. Each of the electronic components may be assigned a name such that the controller associated with the individual electronic component is able to communicate and send instructions to other controllers and/or electronic components. Additionally the electronic components in a construction element may be part of a network such that electronic components of one or more construction elements may be controlled by a central computer. If it is not required to control the individual electronic components in a construction element but only to control the electronic components the same way, only one controller is required for the whole construction element.
The construction element may further comprise a light processing layer on top of the electrically conducting front layer, preferably a polymer panel or film, such as an opallized acrylic panel/film, a clear acrylic pan-el/film, an acrylic prismatic panel/film, a transparent or semitransparent colored panel/film, and/or an acrylic lens panel. The panel or film is used for protecting the electronic component e.g. from water and/or scatter and/or diffuse and/or focus light emitted from the electronic component or LED. This is advantageous for example when the construction element is an outdoor lamp or lighting system or the construction element is a ceiling panel where a particular kind of light is desired for different applications such as lighting for office work, hall way lighting, operating room lighting etc.
The electrically conducting front layer may also be covered by a wooden surface, which allows for the LED to extend through the wooden material. Alternatively, the wooden material may define transparent or semitransparent areas arranged to allow the light emitted by the light emitter to be emitted there through.
The electronic component may be positioned in a recess in the construction element, making it possible to attaching an additional layer e.g. with glue to the electrically conducting front layer. This is also a way of making the construction element watertight.
The construction element may further comprise: a conducting retainer element positioned at least partly inside the recess along the circumference of the recess in contact with the electrically conducting front layer, and/or a resilient conducting element, such as a wave spring or spring washer, positioned, preferably in press, between the conducting retainer element and the circuit board such that an electrical connection is established between the electrically conducting front layer and the circuit board. These two elements thus have several functions. Namely to lead the power and/or data to the electronic component from the electrically conducting front layer, to make sure that the circuit board is kept in place, and to compensate for thermal stress during operation of the construction element and/or electronic component. Alternatively the circuit board may be kept in place by other attachment means such as glue and the power may be supplied via different power supplying means.
The cross sectional diameter of the recess accommodating the electronic component is preferably in the interval of 1-20 cm, more preferably 1-3 cm, most preferably in the interval of 1-2 cm.
The controller may be positioned in the recess for example on the circuit board. In case of a RGB diode, where it may be relevant to control the individual light emitters, the controller is positioned inside the case or lens that surrounds the light emitters. Were several electronic components in a construction element are to be controlled centrally, the controller may be positioned in its own recess somewhere in the construction panel.
The electronic component or the controller are not necessarily positioned in a recess, but may be protruding from the construction element.
The electrically conducting front layer may function as a cathode and the electrically conducting rear layer may function as an anode or vice versa.
According to a second aspect a method of transmitting data to an electronic component comprised by a construction element comprises the steps of: providing a sandwich structure comprising an electrically insulating layer and at least two electrically conducting layers, which comprises an electrically conducting front layer and an electrically conducting rear layer which are spaced apart by an electrically insulating layer, providing a circuit board between an electronic component and the electrically conducting rear layer, positioning the electronic component on the circuit board, providing the electronic component with a first and a second electrical terminal, connecting the first electrical terminal with the electrically conducting front layer, connecting the second electrical terminal with the electrically conducting rear layer, providing a controller, and communicating data signals to and/or from the controller via at least one of the electrically conducting layers.
In the following, the invention will be described in further detail with reference to the drawings in which:
Fig. 1 is a cross sectional view of a first embodiment of the invention,
Fig. 2 is a view of the first embodiment of the invention, as seen from above,
Fig. 3 is a view of the second embodiment of the invention, as seen from above,
Fig. 4 is a cross sectional view of a third embodiment of the invention,
Fig. 5 is a view of the third embodiment of the invention, as seen from above.
Fig. 1 and 2 shows a part of a construction element 100 comprising a sandwich structure. The construction element could be for example a construction panel, such as a ceiling panel. The sandwich structure is in this embodiment comprising an electrically insulating layer 11 e.g. polyethylene positioned between an electrically conducting front layer 12 and an electrically conducting rear layer 13. The electrically conducting front layer 12 and the electrically conducting rear layer 13 are made of e.g. aluminum, but may be made electrically conducting by the use of other conducting materials. The sandwich structure is provided with a recess 15, in this case cylindrical recess, through the electrically conducting front layer 12 and the electrically insulating layer 11. The recess 15 comprises a bottom 16 constituted by the electrically conducting rear layer 13 and wall(s) constituted by the electrically insulating layer 11 and the electrically conducting front layer 12. The recess 15 may be other shapes such as box shaped or triangular. Inside the recess a printed circuit board (PCB) 2 is provided. The PCB 2 is the same shape and size as the bottom of the recess 15. It may also be smaller or a different shape. A surface mount diode (SMD) 3 alternatively another kind of LED is attached to the PCB 2. The SMD 3 comprises a first and a second electrical terminal (not shown), functioning as the cathode and anode, respectively.
The first electrical terminal is in a first electrical connection 6a with the electrically conducting front layer 12, and the second electrical terminal is in second electrical connection 6b with the electrically conducting rear layer 13.
The first electrical connection 6a to the electrically conducting front layer 12 is formed from the first electrical terminal via a, preferably printed, conductor 6a on the PCB 2 extending to a supply circuit in the form of a cobber ring at the circumference of the PCB 2. The supply circuit is in contact with a resilient electrically conducting element in the form of a wave spring 4 positioned along the circumference of the recess 15. Thus the contact between the SMD 3 and the PCB 2 is established through a hole in the wave spring 4. The spring is preferably made of a suitable metal e.g. iron or an aluminum alloy. The wave spring is in press between the PCB 2 and an electrically conducting retainer element in the form of an electrically conducting retainer ring 5, extending along the circumference of the recess and between the electrically conducting front layer 12 and the wave spring 4. The wave spring 4 is waved along the edge such that the edge of the wave spring 4 alternately is in contact with the electrically conducting element 5 and the PCB 2. The electrically conducting retainer ring 5 thus establishes an electrical contact to the electrically conducting front layer 12. The wave spring 4 and the electrically conducting retainer ring 5 thus keep the PCB 2 in place.
Alternatively the wave spring may be dispensed with such that the electrically conducting retainer ring 5 is in direct contact with the supply circuit on the PCB 2. As a further alternative the electrically conducting front layer 12 may extend over the electrically conducting retainer ring 5 such that the electrically conducting front layer 12 keeps the electrically conducting retainer ring 5 in place.
Instead of using a wave spring, a spring washer, a disc spring or a coil spring may be used.
The second electrical connection 6b to the electrically conducting rear layer 13 is formed from the second electrical terminal via a, preferably printed, conductor on the PCB 2 extending to a controller 8 mounted on the PCB 2. From the controller 8 a conductor extends a hole 23 in the PCB 2. From the circumference of the hole 23 a electrically conducting pipe extends to the electrically conducting rear layer 13. Instead of an electrically conducting pipe other means of forming an electrical connection may be used, such as a cable or a rod. Power to the SMD 3 is thus supplied via the controller 8.
In case more LEDs or SMDs are present, preferably positioned in each their recess 15, they may each be provided with a controller. Alternatively, the controller positioned in the recess may control several LEDS or SMDs in the same construction element or in several construction elements that for example form a false ceiling. The controller may in turn be connected to a network or computer, from which it may receive instructions.
The construction element 100 is furthermore provided with a heat sink in the form of cobber threads 7 extending between the SMD 3 and the electrically conducting rear layer 13 through the PCB 2. Other heat conducting materials may be used as well.
Additionally as all the components/elements in the recess may be flush with the surface of the electrically conducting front layer 12, i.e. there are no protruding parts extending beyond the surface of electrically conducting front layer 12, an additional light processing layer in the form of an acrylic plate 10 is provided on top of the electrically conducting front layer 12. The light processing layer 10 may be dispensed with. The light processing layer may be used for protecting the electronic component from water and/or Ultra Violet (UV) light and/or scatter and/or diffuse and/or focus light emitted from the light emitting diode.
Further attachment means may be used to keep the individual elements in place, such as an adhesive or paste that may be electrically conducting. Also an optical lens may be attached as the light processing layer 10 or be incorporated therein.
Fig. 3shows a second embodiment. What differs from the features mentioned under figs. 1 and 2 is that a controller is mounted separately from the individual SMD 3 but still forms a part of the construction element. The controller may e.g. be connected to the construction element via a cable being connected to the front and/or rear electrically conducting layers or be mounted in a recess.
Instead of the electrical connection 6b goes via the controller, the SMD 3 is connected directly to the electrically conducting rear layer 13 via the conductor printed on the circuit board to a hole 22 from which a pipe extends to the electrically conducting rear layer 13 as shown in fig. 1.
As more SMDs or LEDS may be mounted in the construction element, only one controller is required control all of them. The controller is able to control features of the SMD or electrical component such as color of emitted light, color combination of emitted light from two or more light emitting diodes, invisible light frequencies and/or light intensity. The controller may transmit data via one or more of the electrically conducting layers 12, 13 through direct current power line communication (DC PLC) or via a third layer as shown in fig 4.
Fig. 4 shows a third embodiment of a part of a construction element 300. What differs from the above embodiments is that a data transmission layer 14 has been positioned between the electrically conducting front layer 12 and electrically conducting rear layer 13. Here the data is not transmitted via the electrically conducting front layer 12 and/or the electrically conducting rear layer 13, but is instead separated from the power supply.
Thus an electrical connection 6b is established to the electrically conducting rear layer 13 through a hole in the data transmission layer 14. A data connection 6c is established to the data transmission layer 14 from the PCB 2.
The heat sink 7 extends through a hole in the data transmission layer 14 to the electrically conducting rear layer 13 as well.
Fig 5. shows a fourth embodiment 400 of the recess 15 as seen from above. It may be combined with the embodiments 100, 200 and/or 300 and contains several of the same features as explained under the previous embodiments. The LED is in this embodiment comprises a Red light emitter 31, a Green light emitter 32 and a Blue light emitter 33, and a controller 8 inside the LED. This means that the controller 8 may be used to mix light emitted from the three light emitters 31,32,33. The controller makes is possible to control/change/mix the color of the light, dim the light etc. The controller 8 inside the diode is in turn connected to a controller or computer positioned elsewhere, e.g. in the construction element. The controller 8 is connected to a data connection point 25 on the PCB via data connection 6c.
Like numbers are used for the same features throughout the appli cation.
In general, the features of the embodiments shown and described may be combined freely and no feature should be seen as essential unless stated in the claims.

Claims (9)

1. Konstruktionselement (100) omfattende: en sandwichstruktur omfattende et elektrisk isolerende lag (11) og mindst to elektrisk ledende lag (12,13), hvilken omfatter et elektrisk ledende forsidelag (12) og et elektrisk ledende bagsidelag (13), hvilke er anbragt i indbyrdes afstand ved et elektrisk isolerende lag (11), en kredsløbsplade (2), som bærer en elektronisk komponent (3), og som er anbragt mellem den elektroniske komponent (3) og det elektrisk ledende bagsidelag (13) hvilken elektronisk komponent (3) omfatter en første og en anden elektrisk terminal, hvor den første elektriske terminal er i elektrisk forbindelse (6a) med det elektrisk ledende forsidelag (12), og den anden elektriske terminal er i elektrisk forbindelse (6b) med det elektrisk ledende bagsidelag (13), kendetegnet ved, at den elektroniske komponent (3) er en lysemitterende diode, LED, fortrinsvis en overflademonteret diode (EN: Surface Mount Diode), SMD, og konstruktionselementet (100) omfatter en controller (8) tilpasset til kommunikation af datasignaler via mindst ét af de elektrisk ledende lag (12,13).
2. Konstruktionselement (100) ifølge krav 1, hvor konstruktionselementet (100) er et konstruktionspanel.
3. Konstruktionselement (100) ifølge et hvilket som helst af de foregående krav, hvor datasignalerne transmitteres via det elektrisk ledende forsidelag (12) og/eller det elektrisk ledende bagsidelag (13) ved hjælp af jævn-strøms-Power Line Communication.
4. Konstruktionselement (100) ifølge et hvilket som helst af de foregående krav, yderligere omfattende et tredje ledende lag (14), fortrinsvis anbragt mellem det elektrisk ledende forsidelag (12) og det elektrisk ledende bagsidelag (13), hvor det tredje ledende lag (14) er tilpasset til at transmittere datasignalerne.
5. Konstruktionselement (100) ifølge krav 1, hvor controlleren (8) er tilpasset til at kontrollere én eller flere af farve af emitteret lys, farvekombination af emitteret lys fra to eller flere lysemittere, frekvens af usynligt lys og/eller lysintensitet.
6. Konstruktionselement (100) ifølge et hvilket som helst af de foregående krav, hvor konstruktionselementet (100) omfatter mindst en første og en anden elektronisk komponent, hvilken første elektronisk komponent er forbundet til en første controller, og hvilken anden elektronisk komponent er forbundet til en anden controller, hvor den første controller er tilpasset til at modtage data fra den anden controller, og hvilken anden controller er tilpasset til at sende data til den første controller.
7. Konstruktionselement (100) ifølge et hvilket som helst af de foregående krav, hvor konstruktionselementet (100) yderligere omfatter et lysbearbejdende lag (10) oven på det elektrisk ledende forsidelag (12), fortrinsvis et vandtæt polymerpanel eller -film, såsom et opaliseret acrylpanel/-film, et klart acrylpanel/-film, et prismatisk acrylpanel/-film, et gennemsigtigt eller halvgennemsigtigt farvet panel/film og/eller et acryllinsepanel.
8. Konstruktionselement (100) ifølge et hvilket som helst af de foregående krav, hvor den elektronisk komponent (3) er anbragt i en fordybning (15) i konstruktionselementet (100), hvilket konstruktionselement (100) omfatter: et ledende pakningselement (5) anbragt mindst delvist inde i fordybningen (15) langs omkredsen af fordybningen (15) i kontakt med det elektrisk ledende forsidelag (12) og/eller et elastisk ledende element, såsom en fjederskive (4), anbragt presset mellem det ledende pakningselement (5) og kredsløbspladen (2), således at en elektrisk forbindelse etableres mellem det elektrisk ledende forsidelag (12) og kredsløbspladen (2).
9. Fremgangsmåde til transmission af data til en elektronisk komponent (3) omfattet af et konstruktionselement (100) omfattende trinnene: tilvejebringelse af en sandwichstruktur omfattende et elektrisk isolerende lag (11) og mindst to elektrisk ledende lag (12,13), hvilket omfatter et elektrisk ledende forsidelag (12) og et elektrisk ledende bagsidelag (13), hvilke er anbragt i indbyrdes afstand ved et elektrisk isolerende lag (11), tilvejebringelse af en kredsløbsplade (2) mellem en elektronisk komponent (3) og det elektrisk ledende bagsidelag (13), anbringelse af den elektronisk komponent (3) på kredsløbspladen (2), tilvejebringelse den elektronisk komponent (3) med en første og en anden elektrisk terminal, at bringe den første elektriske terminal i forbindelse med det elektrisk ledende forsidelag (12), at bringe den anden elektrisk terminal i forbindelse med det elektrisk ledende bagsidelag (13), kendetegnet ved, at tilvejebringelse af den elektroniske komponent (3) i form af en lysemitterende diode, LED, fortrinsvis en overflademonteret diode, SMD, og tilvejebringelse af en controller (8), og kommunikation af datasignaler til og/eller fra controlleren via mindst ét af de elektrisk ledende lag (12,13).
DK201470011A 2014-01-10 2014-01-10 Construction element with at least one electronic component DK178014B1 (en)

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JP2016563243A JP6356264B2 (ja) 2014-01-10 2015-01-08 少なくとも1つの電子部品を備えた構成部材、及び、これに関連した方法
DK15700004.3T DK3094923T3 (da) 2014-01-10 2015-01-08 Konstruktionselement med mindst én elektronisk komponent og tilhørende fremgangsmåde
CN201711402960.0A CN108105595B (zh) 2014-01-10 2015-01-08 具有至少一个电子元件的结构构件及相关方法
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CN201580004029.XA CN105899873B (zh) 2014-01-10 2015-01-08 具有至少一个电子元件的结构构件及相关方法
EP19164880.7A EP3553375B1 (en) 2014-01-10 2015-01-08 Construction element with at least one electronic component and associated method
BR112016016028-2A BR112016016028B1 (pt) 2014-01-10 2015-01-08 Elemento de construção com pelo menos um componente eletrônico e método associado
RU2016130791A RU2664952C2 (ru) 2014-01-10 2015-01-08 Конструкционный элемент с по меньшей мере одним электронным компонентом и связанный с ним способ
US15/110,605 US9874339B2 (en) 2014-01-10 2015-01-08 Construction element with at least one electronic component and associated method
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JP6356264B2 (ja) 2018-07-11
US9587812B2 (en) 2017-03-07
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CN108105595B (zh) 2020-12-25
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US9874339B2 (en) 2018-01-23
RU2664952C2 (ru) 2018-08-23
DK3094923T3 (da) 2022-02-07
CN108105595A (zh) 2018-06-01
CN105899873A (zh) 2016-08-24
EP3094923B1 (en) 2021-11-10
CN105899873B (zh) 2018-01-16

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