DK1920472T3 - Fremgangsmåde til påföring af et metallisk dæklag på en höjtemperatursuperleder - Google Patents

Fremgangsmåde til påföring af et metallisk dæklag på en höjtemperatursuperleder

Info

Publication number
DK1920472T3
DK1920472T3 DK07726174T DK07726174T DK1920472T3 DK 1920472 T3 DK1920472 T3 DK 1920472T3 DK 07726174 T DK07726174 T DK 07726174T DK 07726174 T DK07726174 T DK 07726174T DK 1920472 T3 DK1920472 T3 DK 1920472T3
Authority
DK
Denmark
Prior art keywords
salt solution
temperature superconductor
metal salt
solution
metal
Prior art date
Application number
DK07726174T
Other languages
English (en)
Inventor
Michael Baecker
Original Assignee
Zenergy Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zenergy Power Gmbh filed Critical Zenergy Power Gmbh
Application granted granted Critical
Publication of DK1920472T3 publication Critical patent/DK1920472T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0801—Manufacture or treatment of filaments or composite wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/83—Element shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/85—Superconducting active materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DK07726174T 2006-06-29 2007-06-28 Fremgangsmåde til påföring af et metallisk dæklag på en höjtemperatursuperleder DK1920472T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006029947A DE102006029947B4 (de) 2006-06-29 2006-06-29 Verfahren zum Aufbringen einer metallischen Deckschicht auf einen Hochtemperatursupraleiter
PCT/EP2007/005747 WO2008000485A1 (de) 2006-06-29 2007-06-28 Verfahren zum aufbringen einer metallischen deckschicht auf einen hochtemperatursupraleiter

Publications (1)

Publication Number Publication Date
DK1920472T3 true DK1920472T3 (da) 2009-10-12

Family

ID=38456526

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07726174T DK1920472T3 (da) 2006-06-29 2007-06-28 Fremgangsmåde til påföring af et metallisk dæklag på en höjtemperatursuperleder

Country Status (9)

Country Link
US (1) US8389444B2 (da)
EP (1) EP1920472B1 (da)
JP (1) JP5476120B2 (da)
KR (1) KR101175828B1 (da)
CN (1) CN101421860A (da)
AT (1) ATE438931T1 (da)
DE (2) DE102006029947B4 (da)
DK (1) DK1920472T3 (da)
WO (1) WO2008000485A1 (da)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007024166B4 (de) 2007-05-24 2011-01-05 Zenergy Power Gmbh Verfahren zum Bearbeiten eines Metallsubstrats und Verwendung dessen für einen Hochtemperatur-Supraleiter
US8809237B2 (en) * 2008-02-19 2014-08-19 Superpower, Inc. Method of forming an HTS article
KR101322815B1 (ko) * 2011-06-08 2013-10-28 케이조인스(주) 전기 도금을 이용한 ｒｅｂｃｏ 박막형 초전도체의 은 안정화제층 형성 방법
US10453590B2 (en) 2012-06-01 2019-10-22 University Of Houston System Superconductor and method for superconductor manufacturing
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
RU2606959C1 (ru) * 2013-02-15 2017-01-10 Фудзикура Лтд. Оксидный сверхпроводящий провод
US10020807B2 (en) * 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
CN106795392B (zh) 2014-08-18 2020-09-08 洛德公司 弹性体的低温粘接方法
DK3275023T3 (da) * 2015-03-26 2019-07-15 Basf Se Fremgangsmåde til fremstilling af ledninger af højtemperatur-superledere
CN104953022A (zh) * 2015-05-15 2015-09-30 富通集团（天津）超导技术应用有限公司 超导线材的制备方法
CN104916772A (zh) * 2015-05-15 2015-09-16 富通集团（天津）超导技术应用有限公司 一种超导线材的制备方法
CN111357126A (zh) 2017-11-28 2020-06-30 巴斯夫欧洲公司 接合超导带
WO2019206758A1 (en) 2018-04-25 2019-10-31 Basf Se Apparatus for quality control of a superconducting tape
WO2020064505A1 (en) 2018-09-24 2020-04-02 Basf Se Process for producing highly oriented metal tapes
WO2020212194A1 (en) 2019-04-17 2020-10-22 Basf Se Sealed superconductor tape
DE102019219615A1 (de) * 2019-12-13 2021-06-17 Heraeus Deutschland GmbH & Co. KG Herstellungsverfahren für Edelmetall-Elektroden

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US2971944A (en) * 1958-10-20 1961-02-14 Union Carbide Corp Maleimide polymers
US3035944A (en) * 1960-08-05 1962-05-22 Ben C Sher Electrical component preparation utilizing a pre-acid treatment followed by chemical metal deposition
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
DE2856885C2 (de) * 1978-12-30 1981-02-12 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Verfahren zur Herstellung eines flexiblen Supraleiters, bestehend aus einer C-Faser mit einer dünnen Schicht einer Niobverbindung der allgemeinen Formel NbC χ Ny und einer äußeren hochleitfähigen Metallschicht
US5147851A (en) * 1988-11-02 1992-09-15 Hitachi Chemical Company Ltd. Superconducting thick film circuit board, production thereof, thick film superconductor and production thereof
NO304746B1 (no) * 1989-05-04 1999-02-08 Ad Tech Holdings Ltd Gjenstand som motstÕr mikrobiologisk vekst bestÕende av et ikke-ledende subtrat som er belagt med et trat som er belagt medfremgangsmate for a avsette
FR2652822B1 (fr) * 1989-10-11 1993-06-11 Onera (Off Nat Aerospatiale) Bain a l'hydrazine pour le depot chimique de platine et/ou de palladium, et procede de fabrication d'un tel bain.
US5132278A (en) * 1990-05-11 1992-07-21 Advanced Technology Materials, Inc. Superconducting composite article, and method of making the same
JP3355832B2 (ja) * 1994-12-08 2002-12-09 三菱マテリアル株式会社 回路パターンの形成方法及びそのペースト
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WO2001053007A1 (en) * 2000-01-21 2001-07-26 Midwest Research Institute Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles
DE10048844A1 (de) 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
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JP2005276465A (ja) * 2004-03-23 2005-10-06 Sumitomo Electric Ind Ltd 超電導線材

Also Published As

Publication number Publication date
KR20080097988A (ko) 2008-11-06
WO2008000485A1 (de) 2008-01-03
EP1920472B1 (de) 2009-08-05
DE102006029947B4 (de) 2013-01-17
DE102006029947A1 (de) 2008-01-03
DE502007001238D1 (de) 2009-09-17
ATE438931T1 (de) 2009-08-15
KR101175828B1 (ko) 2012-08-24
EP1920472A1 (de) 2008-05-14
US8389444B2 (en) 2013-03-05
JP2009541957A (ja) 2009-11-26
CN101421860A (zh) 2009-04-29
US20090088326A1 (en) 2009-04-02
JP5476120B2 (ja) 2014-04-23

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