DK1920646T3 - Indretning til undersögelse af arbejdsemner - Google Patents

Indretning til undersögelse af arbejdsemner

Info

Publication number
DK1920646T3
DK1920646T3 DK06760826T DK06760826T DK1920646T3 DK 1920646 T3 DK1920646 T3 DK 1920646T3 DK 06760826 T DK06760826 T DK 06760826T DK 06760826 T DK06760826 T DK 06760826T DK 1920646 T3 DK1920646 T3 DK 1920646T3
Authority
DK
Denmark
Prior art keywords
measuring head
workpiece
camera
carried out
relates
Prior art date
Application number
DK06760826T
Other languages
Danish (da)
English (en)
Inventor
Manfred Schmidbauer
Michael Kretschmer
Gerold Staudinger
Original Assignee
Midas Private Equity Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Midas Private Equity Gmbh filed Critical Midas Private Equity Gmbh
Application granted granted Critical
Publication of DK1920646T3 publication Critical patent/DK1920646T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/0202—Control of the test
    • G01N2203/021—Treatment of the signal; Calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0296—Welds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Lifting Devices For Agricultural Implements (AREA)
DK06760826T 2005-08-16 2006-08-16 Indretning til undersögelse af arbejdsemner DK1920646T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0137405A AT502410B1 (de) 2005-08-16 2005-08-16 Vorrichtung zur prüfung von werkstücken
PCT/AT2006/000341 WO2007019596A2 (fr) 2005-08-16 2006-08-16 Dispositif pour verifier des pieces

Publications (1)

Publication Number Publication Date
DK1920646T3 true DK1920646T3 (da) 2009-08-03

Family

ID=37757915

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06760826T DK1920646T3 (da) 2005-08-16 2006-08-16 Indretning til undersögelse af arbejdsemner

Country Status (8)

Country Link
US (1) US20090207243A1 (fr)
EP (1) EP1920646B1 (fr)
KR (1) KR20080054387A (fr)
CN (1) CN101283637A (fr)
AT (2) AT502410B1 (fr)
DE (1) DE502006003345D1 (fr)
DK (1) DK1920646T3 (fr)
WO (1) WO2007019596A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8923602B2 (en) * 2008-07-22 2014-12-30 Comau, Inc. Automated guidance and recognition system and method of the same
DE102016118617B4 (de) * 2016-09-30 2019-02-28 Carl Zeiss Industrielle Messtechnik Gmbh Messsystem
CN116879320A (zh) * 2023-07-04 2023-10-13 河南众驰富联精工科技有限公司 一种电路板测量装置及其载具模组旋转坐标标定方法
CN118424893B (zh) * 2024-07-02 2024-09-24 中南大学 一种隧道围岩破坏实时监测的真三轴实验装置及实验方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794800A (en) * 1987-10-01 1989-01-03 General Dynamics Corporation Wire sensing and measurement apparatus
DE19915052A1 (de) * 1999-04-01 2000-10-05 Siemens Ag Einrichtung zur Inspektion einer dreidimensionalen Oberflächenstruktur sowie Verfahren zur Kalibrierung einer derartigen Einrichtung
DE10119662C2 (de) * 2001-04-20 2003-04-10 Loh Optikmaschinen Ag Verfahren zur Randbearbeitung von optischen Linsen
US6828801B1 (en) * 2001-10-26 2004-12-07 Welch Allyn, Inc. Capacitive sensor
ATE344445T1 (de) * 2002-02-01 2006-11-15 F & K Delvotec Bondtech Gmbh Testvorrichtung zur ausführung eines pulltests
US7067763B2 (en) * 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US7656425B2 (en) * 2006-03-31 2010-02-02 Mitutoyo Corporation Robust field of view distortion calibration
US20090196527A1 (en) * 2008-02-01 2009-08-06 Hiwin Mikrosystem Corp. Calibration method of image planar coordinate system for high-precision image measurement system

Also Published As

Publication number Publication date
AT502410B1 (de) 2007-03-15
ATE427647T1 (de) 2009-04-15
WO2007019596A3 (fr) 2007-06-21
DE502006003345D1 (de) 2009-05-14
CN101283637A (zh) 2008-10-08
US20090207243A1 (en) 2009-08-20
WO2007019596A2 (fr) 2007-02-22
EP1920646A2 (fr) 2008-05-14
EP1920646B1 (fr) 2009-04-01
KR20080054387A (ko) 2008-06-17
AT502410A4 (de) 2007-03-15

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