DK2011166T3 - Piezoaktuator med flerlagsindkapsling og fremgangsmåde til fremstilling deraf - Google Patents

Piezoaktuator med flerlagsindkapsling og fremgangsmåde til fremstilling deraf

Info

Publication number
DK2011166T3
DK2011166T3 DK07728434.7T DK07728434T DK2011166T3 DK 2011166 T3 DK2011166 T3 DK 2011166T3 DK 07728434 T DK07728434 T DK 07728434T DK 2011166 T3 DK2011166 T3 DK 2011166T3
Authority
DK
Denmark
Prior art keywords
piezo actuator
multilayer encapsulation
making
electrically insulating
elastic layer
Prior art date
Application number
DK07728434.7T
Other languages
English (en)
Inventor
Oliver Hennig
Jens Dahl Jensen
Christoph Hamann
Guenter Lugert
Randolf Mock
Carsten Schuh
Joerg Zapf
Heiner Bayer
Hellmut Freudenberg
Axel Ganster
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK2011166T3 publication Critical patent/DK2011166T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuel-Injection Apparatus (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
DK07728434.7T 2006-04-26 2007-04-24 Piezoaktuator med flerlagsindkapsling og fremgangsmåde til fremstilling deraf DK2011166T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006019489A DE102006019489B4 (de) 2006-04-26 2006-04-26 Piezoaktor mit Mehrschicht-Verkapselung und Verfahren zu seiner Herstellung
PCT/EP2007/053978 WO2007122227A2 (de) 2006-04-26 2007-04-24 Piezoaktor mit mehrschicht-verkapselung und verfahren zu seiner herstellung

Publications (1)

Publication Number Publication Date
DK2011166T3 true DK2011166T3 (da) 2011-04-11

Family

ID=38371002

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07728434.7T DK2011166T3 (da) 2006-04-26 2007-04-24 Piezoaktuator med flerlagsindkapsling og fremgangsmåde til fremstilling deraf

Country Status (8)

Country Link
US (1) US7851978B2 (da)
EP (1) EP2011166B1 (da)
JP (1) JP5021722B2 (da)
CN (1) CN101432901A (da)
AT (1) ATE494637T1 (da)
DE (2) DE102006019489B4 (da)
DK (1) DK2011166T3 (da)
WO (1) WO2007122227A2 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019900A1 (de) * 2006-04-28 2007-11-08 Siemens Ag Piezoaktor mit Gradient-Verkapselungsschicht und Verfahren zu seiner Herstellung
DE102007037553A1 (de) * 2007-08-09 2009-02-12 Robert Bosch Gmbh Piezoelektrisches Aktormodul
DE102010022911B4 (de) * 2010-06-07 2017-01-19 Continental Automotive Gmbh Verfahren zum Herstellen eines Piezoaktors und Piezoaktor
US8940559B2 (en) 2011-11-04 2015-01-27 Hewlett-Packard Development Company, L.P. Method of fabricating an integrated orifice plate and cap structure
CA2880977C (en) 2012-09-14 2020-11-03 Nobuhiro Watanabe Conjugated polymer, and electron donating organic material, material for photovoltaic device and photovoltaic device using the conjugated polymer
US9680445B2 (en) * 2014-10-31 2017-06-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Packaged device including cavity package with elastic layer within molding compound
DE102017120210A1 (de) * 2017-09-01 2019-03-07 Technische Universität Darmstadt Verfahren zur Herstellung eines Schichtenabfolgenelements sowie Schichtenabfolgenelement für die Herstellung eines dielektrischen Elastomerwandlers
JP7083481B2 (ja) * 2017-12-22 2022-06-13 国立研究開発法人宇宙航空研究開発機構 多層断熱材、宇宙機、損傷診断装置、及び被検出物の検出方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243166A (ja) * 1985-04-18 1986-10-29 Matsushita Electric Ind Co Ltd 硬質膜およびその製造方法
JPH0666483B2 (ja) * 1987-11-24 1994-08-24 日本電気株式会社 電歪効果素子
JPH0399902A (ja) * 1989-09-12 1991-04-25 Bridgestone Corp 浮上式車両用重荷重ラジアルタイヤ
US5372848A (en) 1992-12-24 1994-12-13 International Business Machines Corporation Process for creating organic polymeric substrate with copper
DE19753930A1 (de) * 1997-12-05 1999-06-10 Ceramtec Ag Verfahren zur Anbringung von Außenelektroden an Festkörperaktoren
WO2001048834A2 (de) * 1999-12-23 2001-07-05 Siemens Aktiengesellschaft Piezoelektrisches element
WO2005087979A2 (en) 2004-03-11 2005-09-22 Frontcoat Technologies Aps A method and a device for deposition of a metal layer on a non-conducting surface of a substrate
JP2009527118A (ja) 2006-02-14 2009-07-23 デルファイ・テクノロジーズ・インコーポレーテッド 圧電装置のバリヤ被覆
GB0604467D0 (en) 2006-03-06 2006-04-12 Delphi Tech Inc Ionic barrier coatings

Also Published As

Publication number Publication date
JP5021722B2 (ja) 2012-09-12
US20090302713A1 (en) 2009-12-10
DE102006019489B4 (de) 2008-03-13
CN101432901A (zh) 2009-05-13
US7851978B2 (en) 2010-12-14
DE502007006189D1 (de) 2011-02-17
WO2007122227A3 (de) 2007-12-13
EP2011166B1 (de) 2011-01-05
DE102006019489A1 (de) 2007-10-31
ATE494637T1 (de) 2011-01-15
JP2009535010A (ja) 2009-09-24
WO2007122227A2 (de) 2007-11-01
EP2011166A2 (de) 2009-01-07

Similar Documents

Publication Publication Date Title
DE502007006189D1 (de) Piezoaktor mit mehrschicht-verkapselung und verfahren zu seiner herstellung
TW200726336A (en) Ceramic substrate, electronic device, and manufacturing method of ceramic substrate
PL2195885T3 (pl) Elektryczny element stykowy i sposób jego wytwarzania
DE502007000284D1 (de) Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen
TW200640326A (en) Wiring board and method of manufacturing the same
EA201390096A1 (ru) Стекло с электрическим присоединительным элементом
MX2015006369A (es) Cristal con elemento de conexion electrica y puente de conexion.
TR201910764T4 (tr) Elektrikli kontaklama bileşimleri, elektrikli kontaklama bileşimlerinin üretimine yönelik yöntem.
DE502007002406D1 (de) Leiterplatte mit zusätzlichen funktionalen elementen sowie herstellverfahren und anwendung
TW200615501A (en) Thermal interface incorporating nanotubes
TW200735428A (en) Electronic element, current control device, arithmetic device, and display device
DK2013920T3 (da) Piezoaktuator med gradientindkapslingslag og fremgangsmåde til dens fremstilling
TW200746276A (en) Method for bonding a semiconductor substrate to a metal substrate
TW200711194A (en) Organic based device and method for manufacture thereof
TW200603230A (en) Circuit device and manufacturing method of the same
TW201130093A (en) Substrate for mounting element, and method for manufacturing the substrate
WO2009033728A3 (en) Sensor matrix with semiconductor components
ATE516692T1 (de) Isoliertes metallsubstrat mit einem metallenen implantat
DE502006001588D1 (de) Leistungshalbleitermodul mit Isolationszwischenlage und Verfahren zu seiner Herstellung
TW200737409A (en) Semiconductor device and process for producing the same
GB2466163A (en) Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure
JP2007299900A5 (da)
TW200702189A (en) Method of manufacturing multi-layered substrate
TW200802756A (en) Embedded metal heat sink for semiconductor device and method for manufacturing the same
TW200718304A (en) Improved electrodes, inner layers, capacitors, electronic devices and methods of making thereof