DK2143139T3 - Køledåse til komponenter eller kredsløb - Google Patents
Køledåse til komponenter eller kredsløb Download PDFInfo
- Publication number
- DK2143139T3 DK2143139T3 DK08736309.9T DK08736309T DK2143139T3 DK 2143139 T3 DK2143139 T3 DK 2143139T3 DK 08736309 T DK08736309 T DK 08736309T DK 2143139 T3 DK2143139 T3 DK 2143139T3
- Authority
- DK
- Denmark
- Prior art keywords
- circuits
- components
- refrigerator box
- refrigerator
- box
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D27/00—Lighting arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007020170 | 2007-04-26 | ||
| PCT/EP2008/054641 WO2008132056A1 (de) | 2007-04-26 | 2008-04-17 | Kühldose für bauelemente oder schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK2143139T3 true DK2143139T3 (da) | 2019-09-23 |
Family
ID=39590489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK08736309.9T DK2143139T3 (da) | 2007-04-26 | 2008-04-17 | Køledåse til komponenter eller kredsløb |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US8630092B2 (da) |
| EP (2) | EP2535928A3 (da) |
| JP (2) | JP2010526427A (da) |
| KR (2) | KR20100017414A (da) |
| CN (1) | CN101689537B (da) |
| AU (1) | AU2008244383B2 (da) |
| DE (1) | DE102008001230A1 (da) |
| DK (1) | DK2143139T3 (da) |
| HU (1) | HUE046347T2 (da) |
| SI (1) | SI2143139T1 (da) |
| WO (1) | WO2008132056A1 (da) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010524698A (ja) * | 2007-04-24 | 2010-07-22 | セラムテック アクチエンゲゼルシャフト | 少なくとも1つの非プレート状の構成要素を備えた複合体を製造する方法 |
| EP2535928A3 (de) * | 2007-04-26 | 2014-08-20 | CeramTec GmbH | Kühldose für Bauelemente oder Schaltungen |
| DE102009036122B4 (de) * | 2009-08-05 | 2011-07-21 | BJB GmbH & Co. KG, 59755 | Lampensockel und Lampenfassung |
| CN103547850A (zh) * | 2011-03-29 | 2014-01-29 | 陶瓷技术有限责任公司 | 具有陶瓷冷却器和led的浇注灯体 |
| JP5447433B2 (ja) * | 2011-05-13 | 2014-03-19 | 株式会社安川電機 | 電子機器および電子機器が設けられた電力変換装置 |
| CN102270690A (zh) * | 2011-07-28 | 2011-12-07 | 容云 | 太阳能利用装置 |
| CN102270679A (zh) * | 2011-07-28 | 2011-12-07 | 容云 | 支撑件、支撑组件及太阳能光伏集光器与led发光装置 |
| WO2013061409A1 (ja) * | 2011-10-25 | 2013-05-02 | 富士通株式会社 | 水冷装置、水冷装置を有する電子機器、及び水冷方法 |
| JP5714119B2 (ja) * | 2011-10-28 | 2015-05-07 | 京セラ株式会社 | 流路部材、これを用いた熱交換器および半導体装置ならびに半導体製造装置 |
| US9255741B2 (en) * | 2012-01-26 | 2016-02-09 | Lear Corporation | Cooled electric assembly |
| CN102748624A (zh) * | 2012-06-28 | 2012-10-24 | 王干 | 一种长度可调拔插式led灯管装置 |
| KR101375956B1 (ko) * | 2012-07-05 | 2014-03-18 | 엘에스산전 주식회사 | 자동차용 전장부품 박스 |
| DE102012106244B4 (de) * | 2012-07-11 | 2020-02-20 | Rogers Germany Gmbh | Metall-Keramik-Substrat |
| JP6094015B2 (ja) * | 2013-04-12 | 2017-03-15 | ホシデン株式会社 | 端子ボックス |
| WO2014177616A1 (en) * | 2013-05-02 | 2014-11-06 | Koninklijke Philips N.V. | Cooling device for cooling a laser arrangement and laser system comprising cooling devices |
| JP6164304B2 (ja) * | 2013-11-28 | 2017-07-19 | 富士電機株式会社 | 半導体モジュール用冷却器の製造方法、半導体モジュール用冷却器、半導体モジュール及び電気駆動車両 |
| CN103672515B (zh) * | 2013-12-10 | 2016-02-03 | 林英强 | 一种高效散热的led灯泡 |
| CN103672516B (zh) * | 2013-12-11 | 2016-08-17 | 佛山市大明照明电器有限公司 | 一种led灯及控制系统 |
| FR3015178B1 (fr) * | 2013-12-13 | 2016-01-01 | Sagemcom Broadband Sas | Equipement electronique a double refroidissement |
| CN103672520B (zh) * | 2013-12-18 | 2016-01-13 | 宁波市柯玛士电器实业有限公司 | 一种led感应灯 |
| CN103672521B (zh) * | 2013-12-20 | 2016-09-14 | 陈琦 | 一种双向调配光模组 |
| CN103672522B (zh) * | 2013-12-23 | 2015-11-25 | 天津中环电子照明科技有限公司 | 智能镜面led平板灯 |
| CN103672523B (zh) * | 2013-12-23 | 2015-12-30 | 天津中环电子照明科技有限公司 | 带应急功能的led面包灯 |
| CN203827682U (zh) * | 2014-04-24 | 2014-09-10 | 中兴通讯股份有限公司 | 一种移动通信终端 |
| KR20170087502A (ko) * | 2014-11-24 | 2017-07-28 | 세람테크 게엠베하 | 전기-이동성의 분야에서의 열 관리 |
| DE102015106552B4 (de) * | 2015-04-28 | 2022-06-30 | Infineon Technologies Ag | Elektronisches Modul mit Fluid-Kühlkanal und Verfahren zum Herstellen desselben |
| DE102015107489B4 (de) * | 2015-05-12 | 2020-07-02 | Infineon Technologies Ag | Verfahren zur Reduzierung des Schichtwiderstands in einer elektronischen Vorrichtung |
| FR3046022B1 (fr) * | 2015-12-17 | 2019-06-28 | Valeo Siemens Eautomotive France Sas | Circuit de refroidissement et dispositif electrique comprenant le circuit de refroidissement |
| EP3206468B1 (de) | 2016-02-15 | 2018-12-26 | Siemens Aktiengesellschaft | Umrichter mit gleichspannungszwischenkreis |
| DE102017003854A1 (de) * | 2017-04-20 | 2018-10-25 | Leopold Kostal Gmbh & Co. Kg | Gehäuse für ein elektrisches oder elektronisches Gerät |
| CN109413932A (zh) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | 散热结构及其制作方法 |
| EP3929976B1 (en) * | 2019-03-22 | 2025-05-07 | Resonac Corporation | Cooling structure |
| CN112444098A (zh) * | 2020-10-08 | 2021-03-05 | 中山市光大光学仪器有限公司 | 一种冷却台及其急速冷却方法 |
| CN114699874B (zh) * | 2020-12-16 | 2023-04-07 | 上海协微环境科技有限公司 | 一种反应副产品收集系统及方法 |
| DE102021109617A1 (de) | 2021-04-16 | 2022-10-20 | Bayerische Motoren Werke Aktiengesellschaft | Kühlvorrichtung und Verfahren zum Herstellen einer Kühlvorrichtung |
| CN114964473A (zh) * | 2022-05-20 | 2022-08-30 | 东风汽车集团股份有限公司 | 一种用于振动传感器的热隔离装置 |
| DE102023134373A1 (de) * | 2023-12-07 | 2025-06-12 | Valeo Eautomotive Germany Gmbh | Kühlsystem für einen Wechselrichter |
| CN119133125B (zh) * | 2024-11-15 | 2025-06-10 | 福建臻璟新材料科技有限公司 | 一种高温共烧氮化铝陶瓷板及其制备工艺 |
| CN119521597B (zh) * | 2025-01-20 | 2025-04-01 | 曙光数据基础设施创新技术(北京)股份有限公司 | 一种液冷中心分布式液冷机柜 |
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| DE3604074A1 (de) * | 1986-02-08 | 1987-08-13 | Bosch Gmbh Robert | Zuendschaltgeraet |
| DE3709200A1 (de) * | 1987-03-20 | 1988-09-29 | Heraeus Gmbh W C | Elektronisches bauteil |
| US5001299A (en) * | 1989-04-17 | 1991-03-19 | Explosive Fabricators, Inc. | Explosively formed electronic packages |
| DE9110268U1 (de) | 1991-02-23 | 1991-11-07 | ABB Patent GmbH, 6800 Mannheim | Anordnung mit flüssigkeitsgekühltem, elektrischem Leistungswiderstand |
| DE9201158U1 (de) * | 1992-01-31 | 1992-03-26 | ABB Patent GmbH, 6800 Mannheim | Flüssigkeitskühldose aus zwei Keramikdosenhälften |
| DE29514012U1 (de) | 1994-08-03 | 1995-11-02 | ANCeram GmbH & Co KG, 95463 Bindlach | Halbzeug aus einer Aluminiumnitridkeramik als Träger mit einer auf mindestens einer seiner Flächen aufgebrachten Leitschicht |
| JPH08139480A (ja) * | 1994-11-08 | 1996-05-31 | Mitsubishi Materials Corp | ヒートパイプ構造を有する放熱性セラミック基板 |
| US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
| DE19527674C2 (de) | 1995-07-31 | 2000-11-02 | Anceram Gmbh & Co Kg | Kühleinrichtung |
| DE19643717A1 (de) | 1996-10-23 | 1998-04-30 | Asea Brown Boveri | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul |
| US6136128A (en) * | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
| AU2001253818A1 (en) * | 2000-02-14 | 2001-08-20 | Christina Alvarez | Security module system, apparatus and process |
| EP1225633A1 (de) * | 2001-01-22 | 2002-07-24 | ABB Schweiz AG | Heat sink for cooling a power semiconductor device and method of manufacturing such a heat sink |
| JP3773797B2 (ja) * | 2001-03-02 | 2006-05-10 | 三洋電機株式会社 | コールドプレートの連結構造及び連結方法 |
| JP3556175B2 (ja) * | 2001-03-09 | 2004-08-18 | 株式会社日立製作所 | 半導体モジュール及び電力変換装置 |
| JP2002329938A (ja) * | 2001-04-27 | 2002-11-15 | Kyocera Corp | セラミック回路基板 |
| DE10334354B4 (de) * | 2002-07-25 | 2016-12-22 | Gva Leistungselektronik Gmbh | Anordnung, enthaltend einen Flüssigkeitskühler und ein Leistungshalbleiter-Element |
| JP2004116871A (ja) * | 2002-09-25 | 2004-04-15 | Sony Corp | 熱輸送体および熱輸送体を有する電子機器 |
| JP4325263B2 (ja) * | 2003-04-21 | 2009-09-02 | ソニー株式会社 | 回路装置及び電子機器 |
| CN1810068A (zh) * | 2003-06-19 | 2006-07-26 | 波零公司 | 印刷电路板的emi吸收屏蔽 |
| JP4543279B2 (ja) * | 2004-03-31 | 2010-09-15 | Dowaメタルテック株式会社 | アルミニウム接合部材の製造方法 |
| US6989991B2 (en) * | 2004-05-18 | 2006-01-24 | Raytheon Company | Thermal management system and method for electronic equipment mounted on coldplates |
| JP4549759B2 (ja) * | 2004-07-08 | 2010-09-22 | 富士通株式会社 | 冷却モジュール |
| JP2006066464A (ja) * | 2004-08-24 | 2006-03-09 | Toyota Industries Corp | 半導体装置 |
| US7168152B1 (en) * | 2004-10-18 | 2007-01-30 | Lockheed Martin Corporation | Method for making an integrated active antenna element |
| JP4710460B2 (ja) * | 2005-07-20 | 2011-06-29 | 株式会社村田製作所 | セラミック多層基板、その製造方法、およびパワー半導体モジュール |
| US7551439B2 (en) * | 2006-03-28 | 2009-06-23 | Delphi Technologies, Inc. | Fluid cooled electronic assembly |
| US8157001B2 (en) * | 2006-03-30 | 2012-04-17 | Cooligy Inc. | Integrated liquid to air conduction module |
| US8004860B2 (en) * | 2006-08-29 | 2011-08-23 | Texas Instruments Incorporated | Radiofrequency and electromagnetic interference shielding |
| JP5112101B2 (ja) * | 2007-02-15 | 2013-01-09 | 株式会社東芝 | 半導体パッケージ |
| EP2535928A3 (de) * | 2007-04-26 | 2014-08-20 | CeramTec GmbH | Kühldose für Bauelemente oder Schaltungen |
| US8031485B2 (en) * | 2007-09-07 | 2011-10-04 | Autosplice, Inc. | Electronic shielding apparatus and methods |
| US7916484B2 (en) * | 2007-11-14 | 2011-03-29 | Wen-Long Chyn | Heat sink having enhanced heat dissipation capacity |
| US7974099B2 (en) * | 2007-11-19 | 2011-07-05 | Nexxus Lighting, Inc. | Apparatus and methods for thermal management of light emitting diodes |
| CN101681907B (zh) * | 2007-11-30 | 2012-11-07 | 松下电器产业株式会社 | 散热结构体基板和使用其的模块及散热结构体基板的制造方法 |
| US7817428B2 (en) * | 2008-06-27 | 2010-10-19 | Greer Jr David Randall | Enclosure with integrated heat wick |
| US8081467B2 (en) * | 2008-08-20 | 2011-12-20 | Sri Hermetics Inc. | Electronics package including heat sink in the housing and related methods |
| US9196588B2 (en) * | 2011-11-04 | 2015-11-24 | Invensas Corporation | EMI shield |
-
2008
- 2008-04-17 EP EP12184416.1A patent/EP2535928A3/de not_active Withdrawn
- 2008-04-17 AU AU2008244383A patent/AU2008244383B2/en not_active Ceased
- 2008-04-17 US US12/596,849 patent/US8630092B2/en not_active Expired - Fee Related
- 2008-04-17 KR KR1020097024729A patent/KR20100017414A/ko not_active Ceased
- 2008-04-17 JP JP2010504636A patent/JP2010526427A/ja active Pending
- 2008-04-17 EP EP08736309.9A patent/EP2143139B1/de active Active
- 2008-04-17 DK DK08736309.9T patent/DK2143139T3/da active
- 2008-04-17 WO PCT/EP2008/054641 patent/WO2008132056A1/de not_active Ceased
- 2008-04-17 SI SI200832089T patent/SI2143139T1/sl unknown
- 2008-04-17 HU HUE08736309A patent/HUE046347T2/hu unknown
- 2008-04-17 KR KR1020157005361A patent/KR20150036793A/ko not_active Ceased
- 2008-04-17 DE DE102008001230A patent/DE102008001230A1/de not_active Ceased
- 2008-04-17 CN CN2008800219187A patent/CN101689537B/zh active Active
-
2013
- 2013-12-06 US US14/098,850 patent/US20140104811A1/en not_active Abandoned
-
2014
- 2014-05-26 JP JP2014108235A patent/JP2014160873A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU2008244383B2 (en) | 2013-05-30 |
| CN101689537A (zh) | 2010-03-31 |
| EP2535928A2 (de) | 2012-12-19 |
| EP2535928A3 (de) | 2014-08-20 |
| SI2143139T1 (sl) | 2019-11-29 |
| JP2010526427A (ja) | 2010-07-29 |
| EP2143139A1 (de) | 2010-01-13 |
| DE102008001230A1 (de) | 2008-10-30 |
| JP2014160873A (ja) | 2014-09-04 |
| US20140104811A1 (en) | 2014-04-17 |
| HUE046347T2 (hu) | 2020-02-28 |
| US20100163210A1 (en) | 2010-07-01 |
| AU2008244383A1 (en) | 2008-11-06 |
| CN101689537B (zh) | 2013-08-21 |
| KR20150036793A (ko) | 2015-04-07 |
| EP2143139B1 (de) | 2019-06-19 |
| KR20100017414A (ko) | 2010-02-16 |
| US8630092B2 (en) | 2014-01-14 |
| WO2008132056A1 (de) | 2008-11-06 |
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