DK2148367T3 - Effekthalvledermodul - Google Patents

Effekthalvledermodul

Info

Publication number
DK2148367T3
DK2148367T3 DK09008701.6T DK09008701T DK2148367T3 DK 2148367 T3 DK2148367 T3 DK 2148367T3 DK 09008701 T DK09008701 T DK 09008701T DK 2148367 T3 DK2148367 T3 DK 2148367T3
Authority
DK
Denmark
Prior art keywords
contact element
power semiconductor
semiconductor module
housing
contact
Prior art date
Application number
DK09008701.6T
Other languages
English (en)
Inventor
Markus Knebel
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK2148367T3 publication Critical patent/DK2148367T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H10W72/07333—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/737—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Bipolar Transistors (AREA)
DK09008701.6T 2008-07-24 2009-07-03 Effekthalvledermodul DK2148367T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008034468A DE102008034468B4 (de) 2008-07-24 2008-07-24 Leistungshalbleitermodul

Publications (1)

Publication Number Publication Date
DK2148367T3 true DK2148367T3 (da) 2011-07-11

Family

ID=41056971

Family Applications (1)

Application Number Title Priority Date Filing Date
DK09008701.6T DK2148367T3 (da) 2008-07-24 2009-07-03 Effekthalvledermodul

Country Status (7)

Country Link
EP (1) EP2148367B1 (da)
JP (1) JP2010034558A (da)
KR (1) KR101580327B1 (da)
CN (1) CN101651123B (da)
AT (1) ATE503272T1 (da)
DE (2) DE102008034468B4 (da)
DK (1) DK2148367T3 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013200526B4 (de) * 2013-01-16 2019-11-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939570A (en) * 1988-07-25 1990-07-03 International Business Machines, Corp. High power, pluggable tape automated bonding package
JP3740116B2 (ja) * 2002-11-11 2006-02-01 三菱電機株式会社 モールド樹脂封止型パワー半導体装置及びその製造方法
DE10355925B4 (de) * 2003-11-29 2006-07-06 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Verfahren seiner Herstellung
DE102004056111A1 (de) * 2004-11-19 2006-06-01 Siemens Ag Halbleiterschaltmodul
EP1825511B1 (de) * 2004-12-17 2011-11-23 Siemens Aktiengesellschaft Halbleiterschaltmodul
DE102006013078B4 (de) * 2006-03-22 2008-01-03 Semikron Elektronik Gmbh & Co. Kg Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung
DE102006027482B3 (de) * 2006-06-14 2007-08-16 Semikron Elektronik Gmbh & Co. Kg Gehauste Halbleiterschaltungsanordnung mit Kontakteinrichtung

Also Published As

Publication number Publication date
ATE503272T1 (de) 2011-04-15
DE102008034468A1 (de) 2010-02-11
EP2148367B1 (de) 2011-03-23
KR20100011947A (ko) 2010-02-03
CN101651123B (zh) 2013-11-13
DE502009000476D1 (de) 2011-05-05
DE102008034468B4 (de) 2013-03-14
JP2010034558A (ja) 2010-02-12
KR101580327B1 (ko) 2015-12-24
CN101651123A (zh) 2010-02-17
EP2148367A1 (de) 2010-01-27

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