DK2248401T3 - Fremgangsmåde til fremstilling af printkort med udstyrede komponenter - Google Patents

Fremgangsmåde til fremstilling af printkort med udstyrede komponenter

Info

Publication number
DK2248401T3
DK2248401T3 DK08872793.8T DK08872793T DK2248401T3 DK 2248401 T3 DK2248401 T3 DK 2248401T3 DK 08872793 T DK08872793 T DK 08872793T DK 2248401 T3 DK2248401 T3 DK 2248401T3
Authority
DK
Denmark
Prior art keywords
printed circuit
circuit boards
manufacturing printed
equipped components
components
Prior art date
Application number
DK08872793.8T
Other languages
English (en)
Inventor
Michael Bisges
Original Assignee
Reinhausen Maschf Scheubeck
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reinhausen Maschf Scheubeck filed Critical Reinhausen Maschf Scheubeck
Application granted granted Critical
Publication of DK2248401T3 publication Critical patent/DK2248401T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Details Of Aerials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DK08872793.8T 2008-02-26 2008-12-10 Fremgangsmåde til fremstilling af printkort med udstyrede komponenter DK2248401T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810011248 DE102008011248A1 (de) 2008-02-26 2008-02-26 Verfahren zur Herstellung von Leiterplatten mit bestückten Bauelementen
PCT/EP2008/010452 WO2009106114A2 (de) 2008-02-26 2008-12-10 Verfahren zur herstellung von leiterplatten mit bestückten bauelementen

Publications (1)

Publication Number Publication Date
DK2248401T3 true DK2248401T3 (da) 2012-10-08

Family

ID=40550569

Family Applications (1)

Application Number Title Priority Date Filing Date
DK08872793.8T DK2248401T3 (da) 2008-02-26 2008-12-10 Fremgangsmåde til fremstilling af printkort med udstyrede komponenter

Country Status (4)

Country Link
EP (1) EP2248401B1 (da)
DE (1) DE102008011248A1 (da)
DK (1) DK2248401T3 (da)
WO (1) WO2009106114A2 (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012102806A1 (de) 2012-03-30 2013-10-02 Balluff Gmbh Elektrisches Gerät und Verfahren zur Herstellung einer Spuleneinrichtung
DE102014217186A1 (de) 2014-08-28 2016-03-03 Continental Automotive Gmbh Verfahren zum Herstellen eines Schaltungsträgers und Schaltungsträger für elektronische Bauelemente

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
DE19807086A1 (de) * 1998-02-20 1999-08-26 Fraunhofer Ges Forschung Verfahren zum Beschichten von Oberflächen eines Substrates, Vorrichtung zur Durchführung des Verfahrens, Schichtsystem sowie beschichtetes Substrat
US6304232B1 (en) * 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
DE102004047357A1 (de) * 2004-09-29 2006-04-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung
US20060109130A1 (en) 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
WO2006104792A1 (en) 2005-03-28 2006-10-05 Avery Dennison Corporation Method for making rfid device antennas

Also Published As

Publication number Publication date
WO2009106114A2 (de) 2009-09-03
DE102008011248A1 (de) 2009-09-03
EP2248401B1 (de) 2012-06-27
WO2009106114A3 (de) 2009-11-05
EP2248401A2 (de) 2010-11-10

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