DK2267082T3 - Varmeledende harpikssammensætning - Google Patents
Varmeledende harpikssammensætningInfo
- Publication number
- DK2267082T3 DK2267082T3 DK09742667.0T DK09742667T DK2267082T3 DK 2267082 T3 DK2267082 T3 DK 2267082T3 DK 09742667 T DK09742667 T DK 09742667T DK 2267082 T3 DK2267082 T3 DK 2267082T3
- Authority
- DK
- Denmark
- Prior art keywords
- resin composition
- heat conducting
- conducting resin
- heat
- composition
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008122512 | 2008-05-08 | ||
| JP2008122511 | 2008-05-08 | ||
| PCT/JP2009/050376 WO2009136508A1 (ja) | 2008-05-08 | 2009-01-14 | 熱伝導性樹脂組成物 |
| PCT/JP2009/057931 WO2009136542A1 (ja) | 2008-05-08 | 2009-04-21 | 熱伝導性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK2267082T3 true DK2267082T3 (da) | 2012-10-08 |
Family
ID=41264565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK09742667.0T DK2267082T3 (da) | 2008-05-08 | 2009-04-21 | Varmeledende harpikssammensætning |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8324313B2 (da) |
| EP (1) | EP2267082B1 (da) |
| JP (1) | JP4514164B2 (da) |
| KR (1) | KR101555396B1 (da) |
| CN (1) | CN101981130B (da) |
| DK (1) | DK2267082T3 (da) |
| ES (1) | ES2390250T3 (da) |
| WO (2) | WO2009136508A1 (da) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011068757A (ja) * | 2009-09-25 | 2011-04-07 | Konoshima Chemical Co Ltd | 酸化マグネシウム系高耐水性熱伝導フィラー及びその製造方法、樹脂組成物 |
| TWI457241B (zh) * | 2009-11-20 | 2014-10-21 | Panasonic Corp | 預浸體、疊層板、貼金屬箔疊層板、電路基板及搭載ｌｅｄ用電路基板 |
| JP5316397B2 (ja) * | 2009-12-18 | 2013-10-16 | 富士電機株式会社 | 配線基板およびその製造方法ならびに半導体モジュール |
| TWI518034B (zh) * | 2010-04-15 | 2016-01-21 | 新日鐵住金高新材料股份有限公司 | 用以製造球狀氧化鋁粉末之方法 |
| JP2012244058A (ja) * | 2011-05-23 | 2012-12-10 | Du Pont Mitsui Fluorochem Co Ltd | 発光ダイオード用リフレクター及びハウジング |
| CN103842421B (zh) * | 2011-10-14 | 2017-10-13 | 默克专利股份有限公司 | 导热性自支撑片材 |
| WO2013065758A1 (ja) * | 2011-11-02 | 2013-05-10 | 日立化成株式会社 | 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板、プリント配線板及びパワー半導体装置 |
| KR101457016B1 (ko) * | 2011-12-30 | 2014-11-03 | 제일모직주식회사 | 내습성 및 열전도성이 우수한 열가소성 수지 조성물 및 성형품 |
| KR101374818B1 (ko) * | 2012-05-22 | 2014-03-17 | 롯데케미칼 주식회사 | 열가소성 수지 조성물 |
| JP6261287B2 (ja) * | 2013-11-05 | 2018-01-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR20160094385A (ko) | 2013-12-05 | 2016-08-09 | 허니웰 인터내셔날 인코포레이티드 | 조절된 pH를 갖는 주석(II) 메탄술포네이트 용액 |
| EP3020779B1 (en) * | 2013-12-11 | 2018-06-20 | Fuji Polymer Industries Co., Ltd. | Heat-storage composition |
| US10155894B2 (en) | 2014-07-07 | 2018-12-18 | Honeywell International Inc. | Thermal interface material with ion scavenger |
| JP6653795B2 (ja) * | 2014-08-27 | 2020-02-26 | Jnc株式会社 | 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法 |
| CN107250317A (zh) | 2014-12-05 | 2017-10-13 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
| US20170043553A1 (en) * | 2015-01-06 | 2017-02-16 | Fuji Polymer Industries Co., Ltd. | Heat-storage, thermally conductive sheet |
| FR3034771B1 (fr) | 2015-04-13 | 2019-04-19 | Hutchinson | Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation |
| FR3034775B1 (fr) | 2015-04-13 | 2018-09-28 | Hutchinson | Materiau pour le stockage thermique |
| US9828539B2 (en) | 2015-06-30 | 2017-11-28 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| US10155896B2 (en) | 2015-06-30 | 2018-12-18 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| US10692797B2 (en) | 2015-06-30 | 2020-06-23 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| EP3372630B1 (en) * | 2015-11-05 | 2020-09-16 | Momentive Performance Materials Japan LLC | Method for producing thermally-conductive polysiloxane composition |
| US11254849B2 (en) | 2015-11-05 | 2022-02-22 | Momentive Performance Materials Japan Llc | Method for producing a thermally conductive polysiloxane composition |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| MX393621B (es) | 2016-03-08 | 2025-03-24 | Honeywell Int Inc | Material de camibo de fase. |
| EP3458509B1 (en) | 2016-05-16 | 2022-07-06 | Martinswerk GmbH | Alumina products and use thereof in polymer compositions with high thermal conductivity |
| CN105924952A (zh) * | 2016-05-16 | 2016-09-07 | 南通市东方塑胶有限公司 | Led用导热绝缘复合材料及其制备方法 |
| WO2018016565A1 (ja) | 2016-07-22 | 2018-01-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性ポリオルガノシロキサン組成物用表面処理剤 |
| US11118056B2 (en) | 2016-07-22 | 2021-09-14 | Momentive Performance Materials Japan Llc | Thermally conductive polysiloxane composition |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| WO2018080013A1 (ko) * | 2016-10-25 | 2018-05-03 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 제조된 성형품 |
| KR101861482B1 (ko) | 2016-10-25 | 2018-05-28 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 제조된 성형품 |
| CN110719939B (zh) | 2017-05-31 | 2022-02-18 | 迈图高新材料日本合同公司 | 导热性聚硅氧烷组合物 |
| JP6746540B2 (ja) * | 2017-07-24 | 2020-08-26 | 積水化学工業株式会社 | 熱伝導シート |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US20200277473A1 (en) * | 2017-09-20 | 2020-09-03 | Arlanxeo Deutschland Gmbh | Vulcanizable HNBR composition with high thermal conductivity |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| CN107987536A (zh) * | 2018-01-04 | 2018-05-04 | 楼旭娟 | 一种高导热绝缘硅胶片及其制作方法 |
| US11072706B2 (en) * | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| WO2020105215A1 (ja) * | 2018-11-20 | 2020-05-28 | 太陽インキ製造株式会社 | 高耐電圧放熱絶縁性樹脂組成物、およびそれを用いた電子部品 |
| US20220064400A1 (en) * | 2018-12-27 | 2022-03-03 | Sumitomo Chemical Company, Limited | Inorganic powder for heat-dissipating resin composition, heat-dissipating resin composition using same, and methods for producing same |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| WO2021161777A1 (ja) * | 2020-02-13 | 2021-08-19 | Nok株式会社 | オレフィン系ゴム組成物 |
| EP4352147A4 (en) * | 2021-06-08 | 2025-04-23 | Henkel AG & Co. KGaA | THERMALLY CONDUCTIVE COMPOSITION |
| JP7287580B1 (ja) * | 2021-08-27 | 2023-06-06 | 株式会社レゾナック | 熱伝導性組成物 |
| EP4324885B1 (en) | 2022-01-14 | 2025-08-13 | Fuji Polymer Industries Co., Ltd. | Thermally conductive composition, thermally conductive sheet obtained from same, and production method therefor |
| WO2023135857A1 (ja) * | 2022-01-14 | 2023-07-20 | 富士高分子工業株式会社 | 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 |
| KR102714019B1 (ko) | 2022-03-29 | 2024-10-07 | 주식회사 에스엠티 | 고인장강도를 갖는 고열전도성 방열시트 및 이의 제조방법 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58219259A (ja) | 1982-06-14 | 1983-12-20 | Toray Silicone Co Ltd | 熱伝導性シリコ−ンゴム組成物 |
| US4604424A (en) | 1986-01-29 | 1986-08-05 | Dow Corning Corporation | Thermally conductive polyorganosiloxane elastomer composition |
| JPS62251466A (ja) | 1986-04-25 | 1987-11-02 | Mazda Motor Corp | エンジンの燃料噴射装置 |
| DK171188A (da) | 1988-03-28 | 1989-09-29 | Evald A Nyborg A S | Apparat til sekvensvis sammensvejsning af mindst to foliebaner af termoplastisk materiale langs vilkaarligt valgte konturer og til udsvejsning af emner fra en eller flere saadanne foliebaner |
| GB8815222D0 (en) | 1988-06-27 | 1988-08-03 | Unilever Plc | Hard fat substitute for chocolate manufacture |
| GB8815224D0 (en) | 1988-06-27 | 1988-08-03 | Unilever Plc | Bakery-margarine composition |
| JP2704732B2 (ja) | 1988-08-01 | 1998-01-26 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性液状オルガノポリシロキサン組成物 |
| US6096414A (en) * | 1997-11-25 | 2000-08-01 | Parker-Hannifin Corporation | High dielectric strength thermal interface material |
| JP3290127B2 (ja) * | 1998-01-27 | 2002-06-10 | 松下電工株式会社 | 熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート |
| KR100858836B1 (ko) | 2001-05-14 | 2008-09-17 | 다우 코닝 도레이 캄파니 리미티드 | 열전도성 실리콘 조성물 |
| JP4311653B2 (ja) | 2004-03-30 | 2009-08-12 | 株式会社タイカ | 電磁波吸収体 |
| JP2006022130A (ja) | 2004-07-06 | 2006-01-26 | Idemitsu Kosan Co Ltd | 熱伝導性樹脂組成物及びその製造方法 |
| JP4460968B2 (ja) * | 2004-07-27 | 2010-05-12 | 株式会社アドマテックス | 樹脂組成物の製造方法 |
| JP2006111848A (ja) | 2004-09-14 | 2006-04-27 | Idemitsu Kosan Co Ltd | 熱伝導性樹脂組成物 |
| JP4828145B2 (ja) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| JP4828146B2 (ja) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| JP5343335B2 (ja) | 2006-09-29 | 2013-11-13 | 東レ株式会社 | 電子機器用接着剤シート |
-
2009
- 2009-01-14 WO PCT/JP2009/050376 patent/WO2009136508A1/ja not_active Ceased
- 2009-04-21 DK DK09742667.0T patent/DK2267082T3/da active
- 2009-04-21 ES ES09742667T patent/ES2390250T3/es active Active
- 2009-04-21 WO PCT/JP2009/057931 patent/WO2009136542A1/ja not_active Ceased
- 2009-04-21 US US12/920,895 patent/US8324313B2/en active Active
- 2009-04-21 KR KR1020107019405A patent/KR101555396B1/ko active Active
- 2009-04-21 CN CN200980111436.5A patent/CN101981130B/zh active Active
- 2009-04-21 EP EP09742667A patent/EP2267082B1/en active Active
- 2009-04-21 JP JP2010511041A patent/JP4514164B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110015506A (ko) | 2011-02-16 |
| US20110009544A1 (en) | 2011-01-13 |
| EP2267082A1 (en) | 2010-12-29 |
| KR101555396B1 (ko) | 2015-09-23 |
| WO2009136542A1 (ja) | 2009-11-12 |
| US8324313B2 (en) | 2012-12-04 |
| JP4514164B2 (ja) | 2010-07-28 |
| CN101981130B (zh) | 2013-04-17 |
| ES2390250T3 (es) | 2012-11-08 |
| CN101981130A (zh) | 2011-02-23 |
| EP2267082A4 (en) | 2011-04-27 |
| EP2267082B1 (en) | 2012-07-11 |
| WO2009136508A1 (ja) | 2009-11-12 |
| JPWO2009136542A1 (ja) | 2011-09-08 |
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