DK2396139T3 - Metalpasta med co-precursorer - Google Patents

Metalpasta med co-precursorer

Info

Publication number
DK2396139T3
DK2396139T3 DK10751577.7T DK10751577T DK2396139T3 DK 2396139 T3 DK2396139 T3 DK 2396139T3 DK 10751577 T DK10751577 T DK 10751577T DK 2396139 T3 DK2396139 T3 DK 2396139T3
Authority
DK
Denmark
Prior art keywords
pasta
precursors
metal
metal pasta
Prior art date
Application number
DK10751577.7T
Other languages
English (en)
Other versions
DK2396139T4 (da
Inventor
Michael Schäfer
Jian Zeng
Wolfgang Schmitt
Original Assignee
Heraeus Materials Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43384183&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK2396139(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Heraeus Materials Tech Gmbh filed Critical Heraeus Materials Tech Gmbh
Publication of DK2396139T3 publication Critical patent/DK2396139T3/da
Application granted granted Critical
Publication of DK2396139T4 publication Critical patent/DK2396139T4/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/1003—Use of special medium during sintering, e.g. sintering aid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3033—Ni as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DK10751577.7T 2009-09-04 2010-09-03 Metalpasta med co-forstadier DK2396139T4 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009040078A DE102009040078A1 (de) 2009-09-04 2009-09-04 Metallpaste mit CO-Vorläufern
PCT/EP2010/005400 WO2011026624A1 (de) 2009-09-04 2010-09-03 Metallpaste mit co-vorläufern

Publications (2)

Publication Number Publication Date
DK2396139T3 true DK2396139T3 (da) 2014-08-11
DK2396139T4 DK2396139T4 (da) 2017-11-06

Family

ID=43384183

Family Applications (1)

Application Number Title Priority Date Filing Date
DK10751577.7T DK2396139T4 (da) 2009-09-04 2010-09-03 Metalpasta med co-forstadier

Country Status (10)

Country Link
US (1) US8950653B2 (da)
EP (1) EP2396139B2 (da)
JP (1) JP5667191B2 (da)
KR (1) KR101697389B1 (da)
CN (1) CN102791421B (da)
DE (1) DE102009040078A1 (da)
DK (1) DK2396139T4 (da)
HR (1) HRP20140735T1 (da)
SG (1) SG178362A1 (da)
WO (1) WO2011026624A1 (da)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010044326A1 (de) * 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Verwendung von aliphatischen Kohlenwasserstoffen und Paraffinen als Lösemittel in Silbersinterpasten
TWI509631B (zh) 2011-02-25 2015-11-21 漢高智慧財產控股公司 用於電子裝置之可燒結銀薄片黏著劑
DE102011079467A1 (de) 2011-07-20 2013-01-24 Behr Gmbh & Co. Kg Thermoelektrisches Modul, Verfahren zur Herstellung eines thermoelektrischen Moduls und Verwendung eines metallischen Glases oder eines gesinterten Werkstoffes
DE102011079660B4 (de) * 2011-07-22 2023-06-07 Robert Bosch Gmbh Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente, eine Schaltungsanordnung diesen Schichtverbund enthaltend und Verfahren zu dessen Ausbildung
HUE028880T2 (en) * 2011-09-20 2017-01-30 Heraeus Deutschland Gmbh & Co Kg Paste and process for connecting electronic components with a carrier
DE102011083893A1 (de) * 2011-09-30 2013-04-04 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
DE102012206587A1 (de) 2012-04-20 2013-11-07 Technische Universität Berlin Lotmaterial, Verfahren zu dessen Herstellung und seine Verwendung zum drucklosen Fügen metallischer Substrate
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
EP2792642B1 (de) * 2013-04-15 2018-02-21 Heraeus Deutschland GmbH & Co. KG Sinterpaste mit gecoateten Silberoxid auf schwer sinterbare edlen und unedlen Oberflächen
HUE042419T2 (hu) * 2013-05-03 2019-06-28 Heraeus Deutschland Gmbh & Co Kg Részben oxidált fém szemcséket tartalmazó javított szinter-paszta
DE102013208387A1 (de) * 2013-05-07 2014-11-13 Robert Bosch Gmbh Silber-Komposit-Sinterpasten für Niedertemperatur Sinterverbindungen
EP2980051B1 (de) * 2014-08-01 2019-03-13 Heraeus Deutschland GmbH & Co. KG Erzeugung einer Dekorschicht auf keramischen Oberflächen
DE102014115319A1 (de) * 2014-10-21 2016-04-21 Osram Opto Semiconductors Gmbh Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
EP3215288B1 (de) * 2014-11-03 2018-08-29 Heraeus Deutschland GmbH & Co. KG Metallsinterzubereitung und deren verwendung zum verbinden von bauelementen
DE102015102759A1 (de) * 2015-02-26 2016-09-01 Heraeus Deutschland GmbH & Co. KG Leistungselektronik-Modul und Verfahren zur Herstellung eines Leistungselektronik-Moduls
KR102360536B1 (ko) * 2015-03-06 2022-02-08 엔테그리스, 아이엔씨. 고체 공급원 전달을 위한 고-순도 텅스텐 헥사카보닐
JP7519752B2 (ja) 2015-05-08 2024-07-22 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 焼結可能フィルムおよびペーストおよびその使用方法
FR3038534A1 (fr) * 2015-07-10 2017-01-13 Commissariat Energie Atomique Assemblage d'un element avec un substrat isole electriquement et a faible resistance thermique notamment pour des applications haute temperature, ensemble comprenant ledit assemblage et un drain thermique et procede de fabrication
EP3401039A1 (de) 2017-05-12 2018-11-14 Heraeus Deutschland GmbH & Co. KG Verfahren zum verbinden von bauelementen mittels metallpaste
US20200147696A1 (en) 2017-05-12 2020-05-14 Heraeus Deutschland GmbH & Co. KG Method for connecting components by means of a metal paste
TWI784320B (zh) * 2019-09-24 2022-11-21 美商阿爾發金屬化工公司 燒結組成物、其製造和使用方法及其用途
KR102282622B1 (ko) * 2019-10-31 2021-07-28 한국재료연구원 코팅된 마그네슘 분말 및 그 제조방법
DE102019217166A1 (de) * 2019-11-07 2021-05-12 Robert Bosch Gmbh Leistungsmodul-Package
CN112759952A (zh) * 2020-12-25 2021-05-07 浙江苏生元福珠宝有限公司 油性烧结银浆料及其制备方法
DE102021110298A1 (de) * 2021-04-22 2022-10-27 Infineon Technologies Ag Bleifreies lotmaterial, schichtstruktur, verfahren zur herstellung eines lotmaterials und verfahren zur herstellung einer schichtstruktur
EP4249148A1 (en) 2022-03-21 2023-09-27 Nano-Join GmbH Composition for sintering comprising an organic silver precursor and particles of agglomerated silver nanoparticles
WO2023067191A1 (en) 2021-10-21 2023-04-27 Nano-Join Gmbh Composition for sintering comprising an organic silver precursor and particles of agglomerated silver nanoparticles
CN119301702A (zh) * 2022-05-17 2025-01-10 新加坡国立大学 组合物和复合材料

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10183208A (ja) * 1996-12-25 1998-07-14 Sumitomo Metal Mining Co Ltd 銀粉末の製造方法
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
DE19842276A1 (de) * 1998-09-16 2000-03-30 Bosch Gmbh Robert Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung
US6743395B2 (en) * 2000-03-22 2004-06-01 Ebara Corporation Composite metallic ultrafine particles and process for producing the same
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20040245648A1 (en) * 2002-09-18 2004-12-09 Hiroshi Nagasawa Bonding material and bonding method
JP2004178919A (ja) * 2002-11-26 2004-06-24 Bando Chem Ind Ltd 金属コロイド液及びそれより形成した導電性被膜
JP2005175321A (ja) 2003-12-12 2005-06-30 Hitachi Ltd エッチングレジスト前駆体組成物及びそれを用いた配線基板の製造方法、並びに配線基板
CN1961381A (zh) * 2004-02-18 2007-05-09 弗吉尼亚科技知识产权公司 用于连接的纳米级金属糊及其使用方法
EP1825940B1 (en) * 2004-11-29 2012-06-13 DIC Corporation Method for producing surface-treated silver-containing powder
JP4964152B2 (ja) * 2005-03-04 2012-06-27 インクテック カンパニー リミテッド 導電性インク組成物及びこの製造方法
US7766218B2 (en) * 2005-09-21 2010-08-03 Nihon Handa Co., Ltd. Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board
JP4505825B2 (ja) 2006-09-15 2010-07-21 国立大学法人大阪大学 金属ナノ粒子の焼結方法およびその焼結方法を用いた基板上に配線を形成する方法
JP5151150B2 (ja) * 2006-12-28 2013-02-27 株式会社日立製作所 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法
KR101107397B1 (ko) * 2007-07-31 2012-01-19 반도 카가쿠 가부시키가이샤 도전성 잉크 및 이를 사용하여 이루어진 도전성 피막, 도전성 잉크 및 도전성 피막의 제조 방법
DK2042260T3 (da) 2007-09-28 2014-03-17 Heraeus Materials Tech Gmbh Fremgangsmåde og pasta til etablering af kontakt mellem metalflader
DE102007046901A1 (de) * 2007-09-28 2009-04-09 W.C. Heraeus Gmbh Verfahren und Paste zur Kontaktierung von Metallflächen
US8513534B2 (en) * 2008-03-31 2013-08-20 Hitachi, Ltd. Semiconductor device and bonding material
DE102008039828A1 (de) * 2008-08-27 2010-03-04 W.C. Heraeus Gmbh Steuerung der Porosität von Metallpasten für den druckfreien Niedertemperatursinterprozess
JP5246096B2 (ja) * 2009-08-10 2013-07-24 日立電線株式会社 複合金属微粒子材料、金属膜及び金属膜の製造方法、並びにプリント配線板及び電線ケーブル

Also Published As

Publication number Publication date
EP2396139A1 (de) 2011-12-21
CN102791421B (zh) 2015-07-22
CN102791421A (zh) 2012-11-21
HRP20140735T1 (hr) 2014-09-26
KR20120068015A (ko) 2012-06-26
US8950653B2 (en) 2015-02-10
JP5667191B2 (ja) 2015-02-12
EP2396139B2 (de) 2017-08-02
SG178362A1 (en) 2012-04-27
WO2011026624A1 (de) 2011-03-10
EP2396139B1 (de) 2014-05-07
KR101697389B1 (ko) 2017-01-17
DK2396139T4 (da) 2017-11-06
US20120153012A1 (en) 2012-06-21
DE102009040078A1 (de) 2011-03-10
JP2013504149A (ja) 2013-02-04

Similar Documents

Publication Publication Date Title
DK2396139T4 (da) Metalpasta med co-forstadier
DE112010000747A5 (de) Metallkomplexe
DE112010003663A5 (de) Metallkomplexe
DE112010004049A5 (de) Metallkomplexe
DK2462134T3 (da) N1-sulfonyl-5-fluorpyrimidinonderivater
DK2414015T3 (da) Laryngoskopsystem
EP2440486A4 (en) CABLE RETRACTION SYSTEM
BRPI1008827A2 (pt) deisobutenizador
BRPI1014968A2 (pt) subalargador
DE112009005462T8 (de) Lenkungsssteuervorrichtung
FI20090023A0 (fi) Uusi elintarvike
FR2952291B3 (fr) Grill
BRPI1010159A2 (pt) bistuti
FI20095852A0 (fi) Suuntaajalaite
IT1398233B1 (it) Tostapane
FI20095676L (fi) Laitteisto
DK2421388T3 (da) Fødevare-mellemprodukt
FI20095735A0 (fi) Puhdistinrakenne
EP2433056A4 (en) COOKER
DE112010003843T8 (de) Lastansteuervorrichtung
EP2485753A4 (en) VARIANTS OF THE CHAPERONINE IN POSITION 10
FR2946516B1 (fr) Barbecue
FI20095972L (fi) Tulisija
TH93130B (th) หน้าตัดโลหะ
TH93132B (th) หน้าตัดโลหะ