DK3147621T3 - Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger - Google Patents

Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger Download PDF

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Publication number
DK3147621T3
DK3147621T3 DK15186625.8T DK15186625T DK3147621T3 DK 3147621 T3 DK3147621 T3 DK 3147621T3 DK 15186625 T DK15186625 T DK 15186625T DK 3147621 T3 DK3147621 T3 DK 3147621T3
Authority
DK
Denmark
Prior art keywords
cooling
power devices
electronic power
cooling device
electronic
Prior art date
Application number
DK15186625.8T
Other languages
English (en)
Inventor
Bruno Agostini
Francesco Agostini
Daniele Torresin
Mathieu Habert
Original Assignee
Abb Schweiz Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Schweiz Ag filed Critical Abb Schweiz Ag
Application granted granted Critical
Publication of DK3147621T3 publication Critical patent/DK3147621T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0278—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits in the form of stacked distribution plates or perforated plates arranged over end plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK15186625.8T 2015-09-24 2015-09-24 Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger DK3147621T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15186625.8A EP3147621B1 (en) 2015-09-24 2015-09-24 Cooling device and method for cooling at least two power electronic devices

Publications (1)

Publication Number Publication Date
DK3147621T3 true DK3147621T3 (da) 2019-10-21

Family

ID=54199034

Family Applications (1)

Application Number Title Priority Date Filing Date
DK15186625.8T DK3147621T3 (da) 2015-09-24 2015-09-24 Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger

Country Status (4)

Country Link
US (1) US10080315B2 (da)
EP (1) EP3147621B1 (da)
CN (1) CN106971990B (da)
DK (1) DK3147621T3 (da)

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TWD181170S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(1)
TWD181171S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(2)
EP3407693B1 (en) * 2017-05-22 2022-11-09 Pfannenberg GmbH Heat exchanger for cooling an electronic enclosure
EP3723463B1 (en) * 2019-04-10 2023-03-01 ABB Schweiz AG Heat exchanger with integrated two-phase heat spreader
US11051428B2 (en) * 2019-10-31 2021-06-29 Hamilton Sunstrand Corporation Oscillating heat pipe integrated thermal management system for power electronics
EP3823018A1 (de) 2019-11-18 2021-05-19 Siemens Aktiengesellschaft Elektronikmodul mit einer pulsierenden heatpipe
IT201900023076A1 (it) * 2019-12-05 2021-06-05 Provides Metalmeccanica S R L Sistema di raffreddamento per data center
DE102020200110A1 (de) * 2020-01-08 2021-07-08 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlvorrichtung
ES2983758T3 (es) * 2020-11-20 2024-10-24 Nokia Technologies Oy Tubo de calor oscilante
EP4015967A1 (de) * 2020-12-17 2022-06-22 Siemens Aktiengesellschaft Heatpipekühlkörper für einen pulsierenden betrieb und herstellverfahren für einen derartigen heatpipekühlkörper
CN112599888A (zh) * 2021-02-07 2021-04-02 广东省华创热控科技有限公司 基于平板式脉动热管和液冷系统组合的电池热管理系统及温控方法
CN112996358B (zh) * 2021-02-18 2022-04-08 南京航空航天大学 基于脉动热管的楔形扰流相变热沉装置及换热方法
JP7581131B2 (ja) * 2021-06-15 2024-11-12 株式会社日立製作所 移動体用の冷却器、電力変換装置および移動体用の冷却器の製造方法
DE102021115922A1 (de) 2021-06-21 2022-12-22 Bayerische Motoren Werke Aktiengesellschaft Anordnung eines pulsierenden Wärmerohrs zur Kühlung von leistungselektronischen Komponenten in einem Kraftfahrzeug
CN113691268B (zh) * 2021-08-16 2023-03-10 合肥水泥研究设计院有限公司 一种数据传输及接收装置
CN117295284A (zh) * 2022-06-16 2023-12-26 苏州领焓能源科技有限公司 一种高效热管散热装置用管组及加工方法及其装置和应用
TWI819867B (zh) * 2022-10-27 2023-10-21 新加坡商鴻運科股份有限公司 歧管、機櫃及資料中心冷卻系統
TWI866018B (zh) * 2023-01-06 2024-12-11 財團法人工業技術研究院 熱傳遞流體、熱管理裝置及電池熱管理系統

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EP2444770B1 (en) 2010-10-20 2020-02-12 ABB Schweiz AG Heat Exchanger Based on Pulsating Heat Pipe Principle
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Also Published As

Publication number Publication date
CN106971990B (zh) 2021-07-13
CN106971990A (zh) 2017-07-21
EP3147621A1 (en) 2017-03-29
US20170094843A1 (en) 2017-03-30
US10080315B2 (en) 2018-09-18
EP3147621B1 (en) 2019-09-11

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