DK3279953T3 - Vindueselement til en pakke til en optisk indretning, pakke til en optisk indretning, fremgangsmåder til fremstilling heraf - Google Patents

Vindueselement til en pakke til en optisk indretning, pakke til en optisk indretning, fremgangsmåder til fremstilling heraf Download PDF

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Publication number
DK3279953T3
DK3279953T3 DK17183746.1T DK17183746T DK3279953T3 DK 3279953 T3 DK3279953 T3 DK 3279953T3 DK 17183746 T DK17183746 T DK 17183746T DK 3279953 T3 DK3279953 T3 DK 3279953T3
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DK
Denmark
Prior art keywords
package
optical device
manufacturing
methods
same
Prior art date
Application number
DK17183746.1T
Other languages
English (en)
Inventor
Shuhei Ueda
Masaki Takeuchi
Harunobu Matsui
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of DK3279953T3 publication Critical patent/DK3279953T3/da

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/0092—Compositions for glass with special properties for glass with improved high visible transmittance, e.g. extra-clear glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Surface Treatment Of Glass (AREA)
DK17183746.1T 2016-08-03 2017-07-28 Vindueselement til en pakke til en optisk indretning, pakke til en optisk indretning, fremgangsmåder til fremstilling heraf DK3279953T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016152518A JP6623968B2 (ja) 2016-08-03 2016-08-03 光学素子パッケージ用窓材、光学素子パッケージ、それらの製造方法、及び光学素子用パッケージ

Publications (1)

Publication Number Publication Date
DK3279953T3 true DK3279953T3 (da) 2021-07-05

Family

ID=59676953

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17183746.1T DK3279953T3 (da) 2016-08-03 2017-07-28 Vindueselement til en pakke til en optisk indretning, pakke til en optisk indretning, fremgangsmåder til fremstilling heraf

Country Status (7)

Country Link
US (1) US10680139B2 (da)
EP (1) EP3279953B1 (da)
JP (1) JP6623968B2 (da)
KR (1) KR102472367B1 (da)
CN (1) CN107689412B (da)
DK (1) DK3279953T3 (da)
TW (1) TWI752991B (da)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211367401U (zh) * 2017-05-12 2020-08-28 Ａｇｃ株式会社 弯曲基材及支承构件
US20190025128A1 (en) * 2017-07-10 2019-01-24 Brown University Non-contact infrared measurement of surface temperature
US10811581B2 (en) 2018-06-15 2020-10-20 Nichia Corporation Method of manufacturing semiconductor device
EP3599414B1 (en) * 2018-07-23 2024-09-04 Shin-Etsu Chemical Co., Ltd. Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods
JP7506848B2 (ja) * 2019-11-05 2024-06-27 日本電気硝子株式会社 紫外線透過ガラス
JP7563362B2 (ja) 2021-11-10 2024-10-08 信越化学工業株式会社 光学素子用窓材、光学素子パッケージ用リッド、光学素子パッケージ及び光学装置
JP2024102863A (ja) * 2023-01-20 2024-08-01 信越化学工業株式会社 光学素子用窓材、光学素子パッケージ用リッド及び光学素子パッケージ
JP2025116496A (ja) * 2024-01-29 2025-08-08 株式会社エンプラス 発光装置およびその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4032462B2 (ja) * 1996-09-30 2008-01-16 株式会社ニコン 紫外用光学素子
JP2001196644A (ja) 2000-01-11 2001-07-19 Nichia Chem Ind Ltd 光半導体装置及びその製造方法
US6661084B1 (en) * 2000-05-16 2003-12-09 Sandia Corporation Single level microelectronic device package with an integral window
CN1985201A (zh) * 2004-07-15 2007-06-20 旭硝子株式会社 玻璃光波导
JP2006173271A (ja) * 2004-12-14 2006-06-29 Matsushita Electric Ind Co Ltd 半導体発光装置、照明装置、携帯通信機器、及びカメラ
JP4890775B2 (ja) 2005-03-23 2012-03-07 パナソニック株式会社 発光モジュール
KR100810754B1 (ko) * 2006-03-03 2008-03-07 럭스피아(주) 발광 유니트 및 이를 채용한 면발광 조립체
EP2005222A4 (en) * 2006-04-03 2010-07-28 COMPARED TO IMMERSION LIQUIDS SOLVOPHOBE INSERTION SURFACES AND OPTICAL WINDOWS
US8653612B2 (en) * 2006-08-25 2014-02-18 Sanyo Semiconductor Co., Ltd. Semiconductor device
JP4714112B2 (ja) * 2006-08-30 2011-06-29 株式会社東海理化電機製作所 照明装置
CN101511744B (zh) * 2006-09-11 2012-11-14 东曹株式会社 熔融石英玻璃及其制造方法
TWI459040B (zh) * 2008-09-29 2014-11-01 Sumitomo Chemical Co 模具之製造方法及防炫膜之製造方法
JP2011128290A (ja) * 2009-12-16 2011-06-30 Hitachi High-Technologies Corp 光源装置、及びそれを用いたバックライト、露光装置及び露光方法
KR100998473B1 (ko) * 2010-05-20 2010-12-06 전자부품연구원 자외선 발광 다이오드를 이용한 살균 장치
US9240524B2 (en) * 2012-03-05 2016-01-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
KR101516358B1 (ko) * 2012-03-06 2015-05-04 삼성전자주식회사 발광 장치
JP2013187245A (ja) * 2012-03-06 2013-09-19 Stanley Electric Co Ltd 半導体発光装置
EP3001466B1 (en) * 2013-05-23 2019-07-03 LG Innotek Co., Ltd. Light-emitting module
EP3010051B1 (en) * 2013-06-12 2020-01-08 NGK Insulators, Ltd. Window material for ultraviolet-ray-emitting element and method for producing same
MY180533A (en) * 2014-03-17 2020-12-01 Shinetsu Chemical Co Methods for working synthetic quartz glass substrate having a mirror-like surface and method for sensing synthetic quartz glass substrate
EP3038173B1 (en) * 2014-12-23 2019-05-22 LG Innotek Co., Ltd. Light emitting device

Also Published As

Publication number Publication date
TWI752991B (zh) 2022-01-21
US10680139B2 (en) 2020-06-09
JP2018022760A (ja) 2018-02-08
TW201818569A (zh) 2018-05-16
EP3279953A1 (en) 2018-02-07
JP6623968B2 (ja) 2019-12-25
CN107689412A (zh) 2018-02-13
EP3279953B1 (en) 2021-05-12
KR20180015581A (ko) 2018-02-13
CN107689412B (zh) 2022-05-17
US20180040778A1 (en) 2018-02-08
KR102472367B1 (ko) 2022-11-30

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