DK3367703T3 - Høreanordning med en mikrofonstruktur - Google Patents

Høreanordning med en mikrofonstruktur Download PDF

Info

Publication number
DK3367703T3
DK3367703T3 DK18156276.0T DK18156276T DK3367703T3 DK 3367703 T3 DK3367703 T3 DK 3367703T3 DK 18156276 T DK18156276 T DK 18156276T DK 3367703 T3 DK3367703 T3 DK 3367703T3
Authority
DK
Denmark
Prior art keywords
hearing device
microphone structure
microphone
hearing
Prior art date
Application number
DK18156276.0T
Other languages
English (en)
Inventor
Oliver Sundberg
Rasmus Andersson
Martin Larsen
Peter H Weis
Anders Hedelund Nielsen
Søren Wichmann
Peter Spragge
Original Assignee
Oticon As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oticon As filed Critical Oticon As
Application granted granted Critical
Publication of DK3367703T3 publication Critical patent/DK3367703T3/da

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/50—Customised settings for obtaining desired overall acoustical characteristics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/40—Arrangements for obtaining a desired directivity characteristic
    • H04R25/402—Arrangements for obtaining a desired directivity characteristic using contructional means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/65—Housing parts, e.g. shells, tips or moulds, or their manufacture
    • H04R25/652—Ear tips; Ear moulds
    • H04R25/654—Ear wax retarders
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/342—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/43—Signal processing in hearing aids to enhance the speech intelligibility
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
DK18156276.0T 2017-02-27 2018-02-12 Høreanordning med en mikrofonstruktur DK3367703T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP17158156 2017-02-27

Publications (1)

Publication Number Publication Date
DK3367703T3 true DK3367703T3 (da) 2020-07-06

Family

ID=58185418

Family Applications (1)

Application Number Title Priority Date Filing Date
DK18156276.0T DK3367703T3 (da) 2017-02-27 2018-02-12 Høreanordning med en mikrofonstruktur

Country Status (4)

Country Link
US (3) US10506353B2 (da)
EP (1) EP3367703B1 (da)
CN (1) CN108513242B (da)
DK (1) DK3367703T3 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108737916B (zh) * 2017-04-21 2022-03-18 法雷奥汽车内部控制（深圳）有限公司 用于机动车辆的麦克风集成组件
AU2018414045B2 (en) * 2018-03-22 2021-05-06 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Microphone, mobile terminal and electronic device
WO2020016778A2 (en) 2018-07-19 2020-01-23 Cochlear Limited Contaminant-proof microphone assembly
EP3764665B1 (en) * 2019-07-09 2023-06-07 GN Audio A/S A method for manufacturing a hearing device
CN213547840U (zh) * 2019-12-30 2021-06-25 美商楼氏电子有限公司 用于麦克风组件的声音端口适配器
DK4205407T3 (da) 2020-08-26 2024-09-30 Sonion Nederland Bv Mikrofonenhed, der er anbragt på oversiden af modtagerenhedens dyse
CN112235670B (zh) * 2020-08-31 2023-09-12 华润赛美科微电子(深圳)有限公司 麦克风组件及电子设备
CN112954571B (zh) * 2021-03-19 2025-05-06 厦门瑞听听力科技有限公司 助听器麦克风结构和助听器
US12587772B2 (en) 2024-06-11 2026-03-24 Apple Inc. Microphone port for acoustic suppression

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002534933A (ja) * 1999-01-07 2002-10-15 サーノフ コーポレイション プリント回路基板を有する大型ダイアフラムマイクロフォン素子を備えた補聴器
DK1621042T3 (da) * 2003-04-28 2008-05-19 Oticon As Mikrofon, höreapparat med mikrofon og indgangsstruktur til en mikrofon
KR100795306B1 (ko) * 2006-08-21 2008-01-15 권유정 귓속 보청기용 페이스 플레이트의 제조방법
CN107426659A (zh) * 2007-12-27 2017-12-01 Gn瑞声达A/S 具有由印刷电路板形成的壁的听力器械
KR100970197B1 (ko) * 2008-07-11 2010-07-14 주식회사 비에스이 가변 지향성 마이크로폰 조립체 및 그 제조방법
KR101612851B1 (ko) * 2010-02-01 2016-04-18 삼성전자주식회사 초소형 보청기
DK2424275T3 (da) * 2010-08-30 2020-01-20 Oticon As Lytteanordning der er indrettet til at etablere en elektrisk forbindelse til en ekstern anordning ved anvendelse af elektrisk ledende dele af en eller flere komponenter af lytteanordningen
US9544678B2 (en) * 2011-01-12 2017-01-10 Blackberry Limited Printed circuit board with an acoustic channel for a microphone
KR101511946B1 (ko) * 2011-11-17 2015-04-14 인벤센스, 인크. 사운드 파이프를 갖춘 마이크로폰 모듈
WO2013091724A1 (en) * 2011-12-23 2013-06-27 Phonak Ag Tip-plate assembly, hearing device with a tip-plate assembly and method of manufacturing a hearing device with a tip-plate assembly
US9738515B2 (en) * 2012-06-27 2017-08-22 Invensense, Inc. Transducer with enlarged back volume
EP2753100B1 (en) * 2013-01-07 2016-01-06 Oticon A/s Hearing aid component with earwax filter
US20160165334A1 (en) * 2014-12-03 2016-06-09 Knowles Electronics, Llc Hearing device with self-cleaning tubing
DK3065418T3 (da) * 2015-03-05 2020-07-06 Oticon As Mikrofonindgang til høreapparat
DE102015208846B3 (de) * 2015-05-13 2016-08-11 Sivantos Pte. Ltd. Hörgerät

Also Published As

Publication number Publication date
US11044565B2 (en) 2021-06-22
EP3367703A1 (en) 2018-08-29
US10820126B2 (en) 2020-10-27
US20200413207A1 (en) 2020-12-31
US20180249261A1 (en) 2018-08-30
CN108513242A (zh) 2018-09-07
US10506353B2 (en) 2019-12-10
CN108513242B (zh) 2021-07-16
US20200077211A1 (en) 2020-03-05
EP3367703B1 (en) 2020-05-13

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