DK3563650T3 - Køleindretning, omformer med en køleindretning og fremgangsmåde til køling af en omformer - Google Patents

Køleindretning, omformer med en køleindretning og fremgangsmåde til køling af en omformer Download PDF

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Publication number
DK3563650T3
DK3563650T3 DK17804819.5T DK17804819T DK3563650T3 DK 3563650 T3 DK3563650 T3 DK 3563650T3 DK 17804819 T DK17804819 T DK 17804819T DK 3563650 T3 DK3563650 T3 DK 3563650T3
Authority
DK
Denmark
Prior art keywords
converter
cooling
cooling device
Prior art date
Application number
DK17804819.5T
Other languages
English (en)
Inventor
Vladimir Danov
VOLKER MüLLER
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK3563650T3 publication Critical patent/DK3563650T3/da

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
    • F28D5/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation in which the evaporating medium flows in a continuous film or trickles freely over the conduits
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381Thermal management, e.g. evaporation control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936Liquid coolant with phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
DK17804819.5T 2017-02-15 2017-11-07 Køleindretning, omformer med en køleindretning og fremgangsmåde til køling af en omformer DK3563650T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP17156233.3A EP3364735A1 (de) 2017-02-15 2017-02-15 Kühlvorrichtung, umrichter mit einer kühlvorrichtung und verfahren zur kühlung eines umrichters
PCT/EP2017/078393 WO2018149522A1 (de) 2017-02-15 2017-11-07 Kühlvorrichtung, umrichter mit einer kühlvorrichtung und verfahren zur kühlung eines umrichters

Publications (1)

Publication Number Publication Date
DK3563650T3 true DK3563650T3 (da) 2021-03-22

Family

ID=58056985

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17804819.5T DK3563650T3 (da) 2017-02-15 2017-11-07 Køleindretning, omformer med en køleindretning og fremgangsmåde til køling af en omformer

Country Status (6)

Country Link
US (1) US20200053917A1 (da)
EP (2) EP3364735A1 (da)
CN (1) CN110301169B (da)
DK (1) DK3563650T3 (da)
RU (1) RU2718760C1 (da)
WO (1) WO2018149522A1 (da)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019133952A1 (de) * 2019-12-11 2021-06-17 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches System mit einem Gehäuse, einer Kühleinrichtung, einem Leistungshalbleitermodul und einer Kondensatoreinrichtung
US11856687B2 (en) 2021-12-21 2023-12-26 Semikron Elektronik Gmbh & Co. Kg Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
ES2983966T3 (es) * 2022-01-27 2024-10-28 Siemens Energy Global Gmbh & Co Kg Tubo de alimentación eléctrica y disposición de convertidor de potencia con un tubo de este tipo
EP4438986A1 (de) * 2023-03-27 2024-10-02 Siemens Aktiengesellschaft Faltbare kühlvorrichtung, umrichter, faltbares elektronikgerät und simulationsprogrammprodukt

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490160B2 (en) * 1999-07-15 2002-12-03 Incep Technologies, Inc. Vapor chamber with integrated pin array
US7032389B2 (en) * 2003-12-12 2006-04-25 Thermoelectric Design, Llc Thermoelectric heat pump with direct cold sink support
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US7203063B2 (en) * 2004-05-21 2007-04-10 Hewlett-Packard Development Company, L.P. Small form factor liquid loop cooling system
US20060278370A1 (en) * 2005-06-08 2006-12-14 Uwe Rockenfeller Heat spreader for cooling electronic components
KR100772381B1 (ko) * 2005-09-29 2007-11-01 삼성전자주식회사 히트싱크
CA2635413C (en) * 2005-12-22 2016-02-23 Oxycom Beheer B.V. Evaporative cooling device
US8422218B2 (en) * 2007-04-16 2013-04-16 Stephen Samuel Fried Liquid cooled condensers for loop heat pipe like enclosure cooling
EP2031332B1 (en) * 2007-08-27 2010-09-15 ABB Research LTD Heat exchanger for power-electronics components
US7855397B2 (en) * 2007-09-14 2010-12-21 Nextreme Thermal Solutions, Inc. Electronic assemblies providing active side heat pumping
US9025330B2 (en) * 2007-09-30 2015-05-05 Alcatel Lucent Recirculating gas rack cooling architecture
US20130192272A1 (en) * 2008-10-23 2013-08-01 Gentherm Incorporated Temperature control systems with thermoelectric devices
US7969733B1 (en) * 2008-12-17 2011-06-28 Nvidia Corporation Heat transfer system, method, and computer program product for use with multiple circuit board environments
US20100281884A1 (en) * 2009-01-22 2010-11-11 John Myron Rawski Thermoelectric Management Unit
US9151540B2 (en) * 2010-06-29 2015-10-06 Johnson Controls Technology Company Multichannel heat exchanger tubes with flow path inlet sections
RU2014150083A (ru) * 2012-05-11 2016-07-10 Дантхерм Кулинг А/С Термосифон переменной проводимости
EP2734020B1 (en) * 2012-11-19 2017-07-12 ABB Schweiz AG Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices
CN104427825B (zh) * 2013-08-28 2020-01-17 北京航空航天大学 用于电子设备多散热源定点冷却的多联变频式制冷系统及其运行方法
CN104362837B (zh) * 2014-11-25 2016-11-09 南车株洲电力机车研究所有限公司 一种变流器用散热系统
KR102398882B1 (ko) * 2017-05-30 2022-05-18 현대자동차주식회사 차량용 에어컨시스템의 발전모듈
US10602638B2 (en) * 2018-03-01 2020-03-24 Dell Products L.P. System and method of transferring energy

Also Published As

Publication number Publication date
CN110301169A (zh) 2019-10-01
RU2718760C1 (ru) 2020-04-14
WO2018149522A1 (de) 2018-08-23
CN110301169B (zh) 2021-06-11
US20200053917A1 (en) 2020-02-13
EP3563650A1 (de) 2019-11-06
EP3364735A1 (de) 2018-08-22
EP3563650B1 (de) 2021-01-06

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