DK3563650T3 - Køleindretning, omformer med en køleindretning og fremgangsmåde til køling af en omformer - Google Patents
Køleindretning, omformer med en køleindretning og fremgangsmåde til køling af en omformer Download PDFInfo
- Publication number
- DK3563650T3 DK3563650T3 DK17804819.5T DK17804819T DK3563650T3 DK 3563650 T3 DK3563650 T3 DK 3563650T3 DK 17804819 T DK17804819 T DK 17804819T DK 3563650 T3 DK3563650 T3 DK 3563650T3
- Authority
- DK
- Denmark
- Prior art keywords
- converter
- cooling
- cooling device
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D5/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
- F28D5/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation in which the evaporating medium flows in a continuous film or trickles freely over the conduits
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17156233.3A EP3364735A1 (de) | 2017-02-15 | 2017-02-15 | Kühlvorrichtung, umrichter mit einer kühlvorrichtung und verfahren zur kühlung eines umrichters |
| PCT/EP2017/078393 WO2018149522A1 (de) | 2017-02-15 | 2017-11-07 | Kühlvorrichtung, umrichter mit einer kühlvorrichtung und verfahren zur kühlung eines umrichters |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3563650T3 true DK3563650T3 (da) | 2021-03-22 |
Family
ID=58056985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK17804819.5T DK3563650T3 (da) | 2017-02-15 | 2017-11-07 | Køleindretning, omformer med en køleindretning og fremgangsmåde til køling af en omformer |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20200053917A1 (da) |
| EP (2) | EP3364735A1 (da) |
| CN (1) | CN110301169B (da) |
| DK (1) | DK3563650T3 (da) |
| RU (1) | RU2718760C1 (da) |
| WO (1) | WO2018149522A1 (da) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019133952A1 (de) * | 2019-12-11 | 2021-06-17 | Semikron Elektronik Gmbh & Co. Kg | Leistungselektronisches System mit einem Gehäuse, einer Kühleinrichtung, einem Leistungshalbleitermodul und einer Kondensatoreinrichtung |
| US11856687B2 (en) | 2021-12-21 | 2023-12-26 | Semikron Elektronik Gmbh & Co. Kg | Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device |
| ES2983966T3 (es) * | 2022-01-27 | 2024-10-28 | Siemens Energy Global Gmbh & Co Kg | Tubo de alimentación eléctrica y disposición de convertidor de potencia con un tubo de este tipo |
| EP4438986A1 (de) * | 2023-03-27 | 2024-10-02 | Siemens Aktiengesellschaft | Faltbare kühlvorrichtung, umrichter, faltbares elektronikgerät und simulationsprogrammprodukt |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6490160B2 (en) * | 1999-07-15 | 2002-12-03 | Incep Technologies, Inc. | Vapor chamber with integrated pin array |
| US7032389B2 (en) * | 2003-12-12 | 2006-04-25 | Thermoelectric Design, Llc | Thermoelectric heat pump with direct cold sink support |
| US7327578B2 (en) * | 2004-02-06 | 2008-02-05 | Sun Microsystems, Inc. | Cooling failure mitigation for an electronics enclosure |
| US7203063B2 (en) * | 2004-05-21 | 2007-04-10 | Hewlett-Packard Development Company, L.P. | Small form factor liquid loop cooling system |
| US20060278370A1 (en) * | 2005-06-08 | 2006-12-14 | Uwe Rockenfeller | Heat spreader for cooling electronic components |
| KR100772381B1 (ko) * | 2005-09-29 | 2007-11-01 | 삼성전자주식회사 | 히트싱크 |
| CA2635413C (en) * | 2005-12-22 | 2016-02-23 | Oxycom Beheer B.V. | Evaporative cooling device |
| US8422218B2 (en) * | 2007-04-16 | 2013-04-16 | Stephen Samuel Fried | Liquid cooled condensers for loop heat pipe like enclosure cooling |
| EP2031332B1 (en) * | 2007-08-27 | 2010-09-15 | ABB Research LTD | Heat exchanger for power-electronics components |
| US7855397B2 (en) * | 2007-09-14 | 2010-12-21 | Nextreme Thermal Solutions, Inc. | Electronic assemblies providing active side heat pumping |
| US9025330B2 (en) * | 2007-09-30 | 2015-05-05 | Alcatel Lucent | Recirculating gas rack cooling architecture |
| US20130192272A1 (en) * | 2008-10-23 | 2013-08-01 | Gentherm Incorporated | Temperature control systems with thermoelectric devices |
| US7969733B1 (en) * | 2008-12-17 | 2011-06-28 | Nvidia Corporation | Heat transfer system, method, and computer program product for use with multiple circuit board environments |
| US20100281884A1 (en) * | 2009-01-22 | 2010-11-11 | John Myron Rawski | Thermoelectric Management Unit |
| US9151540B2 (en) * | 2010-06-29 | 2015-10-06 | Johnson Controls Technology Company | Multichannel heat exchanger tubes with flow path inlet sections |
| RU2014150083A (ru) * | 2012-05-11 | 2016-07-10 | Дантхерм Кулинг А/С | Термосифон переменной проводимости |
| EP2734020B1 (en) * | 2012-11-19 | 2017-07-12 | ABB Schweiz AG | Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices |
| CN104427825B (zh) * | 2013-08-28 | 2020-01-17 | 北京航空航天大学 | 用于电子设备多散热源定点冷却的多联变频式制冷系统及其运行方法 |
| CN104362837B (zh) * | 2014-11-25 | 2016-11-09 | 南车株洲电力机车研究所有限公司 | 一种变流器用散热系统 |
| KR102398882B1 (ko) * | 2017-05-30 | 2022-05-18 | 현대자동차주식회사 | 차량용 에어컨시스템의 발전모듈 |
| US10602638B2 (en) * | 2018-03-01 | 2020-03-24 | Dell Products L.P. | System and method of transferring energy |
-
2017
- 2017-02-15 EP EP17156233.3A patent/EP3364735A1/de not_active Withdrawn
- 2017-11-07 DK DK17804819.5T patent/DK3563650T3/da active
- 2017-11-07 EP EP17804819.5A patent/EP3563650B1/de active Active
- 2017-11-07 WO PCT/EP2017/078393 patent/WO2018149522A1/de not_active Ceased
- 2017-11-07 US US16/486,014 patent/US20200053917A1/en not_active Abandoned
- 2017-11-07 RU RU2019125619A patent/RU2718760C1/ru active
- 2017-11-07 CN CN201780086405.3A patent/CN110301169B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110301169A (zh) | 2019-10-01 |
| RU2718760C1 (ru) | 2020-04-14 |
| WO2018149522A1 (de) | 2018-08-23 |
| CN110301169B (zh) | 2021-06-11 |
| US20200053917A1 (en) | 2020-02-13 |
| EP3563650A1 (de) | 2019-11-06 |
| EP3364735A1 (de) | 2018-08-22 |
| EP3563650B1 (de) | 2021-01-06 |
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