DK3583622T3 - Indretning til varmespredning og elektrisk isolering - Google Patents

Indretning til varmespredning og elektrisk isolering Download PDF

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Publication number
DK3583622T3
DK3583622T3 DK17708996.8T DK17708996T DK3583622T3 DK 3583622 T3 DK3583622 T3 DK 3583622T3 DK 17708996 T DK17708996 T DK 17708996T DK 3583622 T3 DK3583622 T3 DK 3583622T3
Authority
DK
Denmark
Prior art keywords
electrical insulation
heat distribution
distribution
heat
insulation
Prior art date
Application number
DK17708996.8T
Other languages
English (en)
Inventor
Patrik Apelgren
Original Assignee
Lohmann Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohmann Gmbh & Co Kg filed Critical Lohmann Gmbh & Co Kg
Application granted granted Critical
Publication of DK3583622T3 publication Critical patent/DK3583622T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK17708996.8T 2017-02-20 2017-02-20 Indretning til varmespredning og elektrisk isolering DK3583622T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/053804 WO2018149512A1 (en) 2017-02-20 2017-02-20 Thermal dissipation and electrical isolating device

Publications (1)

Publication Number Publication Date
DK3583622T3 true DK3583622T3 (da) 2021-05-25

Family

ID=58231576

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17708996.8T DK3583622T3 (da) 2017-02-20 2017-02-20 Indretning til varmespredning og elektrisk isolering

Country Status (3)

Country Link
EP (1) EP3583622B1 (da)
DK (1) DK3583622T3 (da)
WO (1) WO2018149512A1 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10986723B2 (en) * 2018-10-16 2021-04-20 Ingersoll-Rand Industrial U.S., Inc. Heat sink tray for printed circuit boards
CN110267502B (zh) * 2019-07-10 2024-10-15 东莞市源冠科技有限公司 一种新型电子设备散热贴片
US11483948B2 (en) * 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
DE102019215644A1 (de) * 2019-10-11 2021-04-15 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für Elektrofahrzeuge oder Hybridfahrzeuge
CN114379166B (zh) * 2020-10-19 2025-08-22 深圳垒石热管理技术股份有限公司 石墨膜及其制造工艺
EP4013203B1 (en) 2020-12-10 2024-07-31 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
US12209664B2 (en) 2020-12-10 2025-01-28 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7303820B2 (en) * 2003-10-14 2007-12-04 Graftech International Holdings Inc. Heat spreader for display device
US20050270746A1 (en) * 2004-06-04 2005-12-08 Reis Bradley E Insulating structure having combined insulating and heat spreading capabilities
JP2006188022A (ja) * 2005-01-07 2006-07-20 Taisei Laminator Co Ltd カーボングラファイトシート
JP5707039B2 (ja) 2007-06-07 2015-04-22 株式会社カネカ グラファイト複合フィルム
JP5142367B2 (ja) * 2007-11-06 2013-02-13 北川工業株式会社 薄膜熱拡散シート
CN101712217B (zh) 2009-05-12 2013-07-31 大连丽昌新材料有限公司 一种石墨导热界面材料的制造工艺
JP5903984B2 (ja) * 2012-03-29 2016-04-13 Dic株式会社 着色粘着テープおよびグラファイト複合シート
CN103043301A (zh) 2012-11-30 2013-04-17 苏州安洁科技股份有限公司 一种新型石墨导热片
WO2015155940A1 (ja) * 2014-04-08 2015-10-15 パナソニックＩｐマネジメント株式会社 熱伝導シートおよびその製造方法
JP6454587B2 (ja) 2015-03-31 2019-01-16 リンテック株式会社 グラファイトシート積層体の製造方法、グラファイトシート積層体の個片化物の製造方法、グラファイトシート積層体の個片化物封止粘着シートの製造方法およびグラファイトシート積層体封止粘着シートの個片化物の製造方法
JP6543803B2 (ja) * 2015-05-18 2019-07-17 パナソニックＩｐマネジメント株式会社 熱伝導シート

Also Published As

Publication number Publication date
EP3583622B1 (en) 2021-04-14
WO2018149512A1 (en) 2018-08-23
EP3583622A1 (en) 2019-12-25

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