DK358879A - Kemisk aetsning af polymere til metallisering - Google Patents
Kemisk aetsning af polymere til metalliseringInfo
- Publication number
- DK358879A DK358879A DK358879A DK358879A DK358879A DK 358879 A DK358879 A DK 358879A DK 358879 A DK358879 A DK 358879A DK 358879 A DK358879 A DK 358879A DK 358879 A DK358879 A DK 358879A
- Authority
- DK
- Denmark
- Prior art keywords
- metallization
- polymers
- chemical etching
- etching
- chemical
- Prior art date
Links
- 238000003486 chemical etching Methods 0.000 title 1
- 238000001465 metallisation Methods 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/940,406 US4227963A (en) | 1978-09-07 | 1978-09-07 | Chemical etching of polymers for metallizing utilizing an aqueous sulfuric-carboxylic acid etchant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK358879A true DK358879A (da) | 1980-03-08 |
Family
ID=25474772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK358879A DK358879A (da) | 1978-09-07 | 1979-08-28 | Kemisk aetsning af polymere til metallisering |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4227963A (de) |
| EP (1) | EP0009128B1 (de) |
| JP (1) | JPS5536286A (de) |
| AT (1) | AT362640B (de) |
| AU (1) | AU529000B2 (de) |
| CA (1) | CA1113355A (de) |
| DE (1) | DE2964617D1 (de) |
| DK (1) | DK358879A (de) |
| ZA (1) | ZA794233B (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4335164A (en) * | 1978-12-19 | 1982-06-15 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
| US4415406A (en) * | 1980-03-07 | 1983-11-15 | Standard Oil Company | Chemical etching of polymers for metallizing |
| US4639380A (en) * | 1985-05-06 | 1987-01-27 | International Business Machines Corporation | Process for preparing a substrate for subsequent electroless deposition of a metal |
| US6139762A (en) * | 1998-12-11 | 2000-10-31 | Shipley Company, L.L.C. | Methods for manufacture of electronic devices |
| JP4687119B2 (ja) * | 2005-01-25 | 2011-05-25 | 株式会社ニコン | メッキ被膜を有するabs樹脂成形品の製造方法およびabs樹脂成形品 |
| ES2326513B1 (es) * | 2006-02-01 | 2010-07-23 | Gabilondo Muguerza, Andres | Procedimiento para metalizar polimeros de urea y otros polimeros. |
| WO2007088217A1 (es) * | 2006-02-01 | 2007-08-09 | Gabilondo Muguerza, Andres | Procedimiento para metalizar polímeros de urea y otros polímeros |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3235426A (en) * | 1961-08-01 | 1966-02-15 | Du Pont | Method of rendering thermoplastic resins receptive to coatings |
| FR1508104A (fr) * | 1965-06-28 | 1968-01-05 | Ibm | Corrosion par l'acide |
| US3484270A (en) * | 1966-10-27 | 1969-12-16 | Enthone | Composition and process for conditioning normally hydrophobic surfaces of acrylonitrile - butadiene - styrene terpolymer |
| US3616294A (en) * | 1967-05-03 | 1971-10-26 | Standard Oil Co | Surface treatment of plastics with mineral acids containing hexavalent chromium and a petroleum fraction or neopentyl group containing acids and olefins |
| US3671289A (en) * | 1969-09-23 | 1972-06-20 | Crown City Plating Co | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating |
| US3689303A (en) * | 1970-12-21 | 1972-09-05 | Crown City Plating Co | Process for electroless plating of abs resins |
| US3769061A (en) * | 1971-06-14 | 1973-10-30 | Shipley Co | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating |
-
1978
- 1978-09-07 US US05/940,406 patent/US4227963A/en not_active Expired - Lifetime
-
1979
- 1979-08-13 AU AU49873/79A patent/AU529000B2/en not_active Ceased
- 1979-08-13 ZA ZA00794233A patent/ZA794233B/xx unknown
- 1979-08-16 CA CA333,863A patent/CA1113355A/en not_active Expired
- 1979-08-21 EP EP79103056A patent/EP0009128B1/de not_active Expired
- 1979-08-21 DE DE7979103056T patent/DE2964617D1/de not_active Expired
- 1979-08-23 JP JP10764579A patent/JPS5536286A/ja active Pending
- 1979-08-28 DK DK358879A patent/DK358879A/da not_active Application Discontinuation
- 1979-09-03 AT AT584379A patent/AT362640B/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| ATA584379A (de) | 1980-10-15 |
| EP0009128B1 (de) | 1983-01-26 |
| CA1113355A (en) | 1981-12-01 |
| AU529000B2 (en) | 1983-05-19 |
| US4227963A (en) | 1980-10-14 |
| ZA794233B (en) | 1980-09-24 |
| DE2964617D1 (en) | 1983-03-03 |
| JPS5536286A (en) | 1980-03-13 |
| EP0009128A1 (de) | 1980-04-02 |
| AU4987379A (en) | 1980-03-13 |
| AT362640B (de) | 1981-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AHS | Application shelved for other reasons than non-payment |