DK3764541T3 - Anordning til overfladeakustiske bølger og fremstillingsmetode herfor - Google Patents

Anordning til overfladeakustiske bølger og fremstillingsmetode herfor

Info

Publication number
DK3764541T3
DK3764541T3 DK19200015.6T DK19200015T DK3764541T3 DK 3764541 T3 DK3764541 T3 DK 3764541T3 DK 19200015 T DK19200015 T DK 19200015T DK 3764541 T3 DK3764541 T3 DK 3764541T3
Authority
DK
Denmark
Prior art keywords
manufacturing
acoustic wave
surface acoustic
wave device
wave
Prior art date
Application number
DK19200015.6T
Other languages
English (en)
Inventor
Cheng-Hung Shih
Cheng-Fan Lin
Original Assignee
Chipbond Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipbond Tech Corporation filed Critical Chipbond Tech Corporation
Application granted granted Critical
Publication of DK3764541T3 publication Critical patent/DK3764541T3/da

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02952—Means for compensation or elimination of undesirable effects of parasitic capacitance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02637—Details concerning reflective or coupling arrays
    • H03H9/02669—Edge reflection structures, i.e. resonating structures without metallic reflectors, e.g. Bleustein-Gulyaev-Shimizu [BGS], shear horizontal [SH], shear transverse [ST], Love waves devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DK19200015.6T 2019-07-10 2019-09-27 Anordning til overfladeakustiske bølger og fremstillingsmetode herfor DK3764541T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108124391A TWI690156B (zh) 2019-07-10 2019-07-10 表面聲波裝置及其製造方法

Publications (1)

Publication Number Publication Date
DK3764541T3 true DK3764541T3 (da) 2026-04-27

Family

ID=68072217

Family Applications (1)

Application Number Title Priority Date Filing Date
DK19200015.6T DK3764541T3 (da) 2019-07-10 2019-09-27 Anordning til overfladeakustiske bølger og fremstillingsmetode herfor

Country Status (7)

Country Link
US (2) US11522517B2 (da)
EP (1) EP3764541B1 (da)
JP (1) JP6845904B2 (da)
KR (1) KR102283709B1 (da)
CN (1) CN112217489A (da)
DK (1) DK3764541T3 (da)
TW (1) TWI690156B (da)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12470201B2 (en) * 2021-08-27 2025-11-11 Skyworks Solutions, Inc. Packaged multilayer piezoelectric surface acoustic wave device with conductive pillar
CN116155229B (zh) * 2023-02-17 2023-11-28 北京超材信息科技有限公司 声表面波器件及其制造方法
US12512803B2 (en) * 2023-03-10 2025-12-30 Richwave Technology Corp. Acoustic wave device and manufacturing method thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10209164A (ja) 1997-01-23 1998-08-07 Toyota Motor Corp 半導体装置の製造方法
JPH10284980A (ja) * 1997-04-08 1998-10-23 Murata Mfg Co Ltd 弾性表面波装置
JP5269301B2 (ja) 2006-07-21 2013-08-21 太陽誘電株式会社 弾性表面波装置
JP2008130932A (ja) 2006-11-22 2008-06-05 Shinkawa Ltd 側面電極付半導体チップ及びその製造方法並びにその半導体チップを積層した３次元実装モジュール
JP4567775B2 (ja) * 2008-08-26 2010-10-20 富士通メディアデバイス株式会社 弾性表面波デバイスおよびその製造方法
JP5596970B2 (ja) * 2009-12-17 2014-10-01 京セラ株式会社 弾性波装置及びその製造方法
KR101228688B1 (ko) 2010-11-25 2013-02-01 삼성전기주식회사 적층형 세라믹 캐패시터
US9660171B2 (en) * 2011-04-19 2017-05-23 Kyocera Corporation Electronic component and acoustic wave device
JP5259024B1 (ja) 2011-08-22 2013-08-07 京セラ株式会社 弾性波装置および電子部品
WO2013128823A1 (ja) * 2012-02-28 2013-09-06 パナソニック株式会社 弾性波装置およびその製造方法
KR101336150B1 (ko) 2012-06-21 2013-12-03 (주)와이솔 표면탄성파 소자 및 그 제조방법
JP2014011487A (ja) * 2012-06-27 2014-01-20 Taiyo Yuden Co Ltd 弾性波デバイス及びその製造方法
JP6026829B2 (ja) 2012-09-11 2016-11-16 スカイワークスフィルターソリューションズジャパン株式会社 弾性表面波デバイス
JP2015012428A (ja) 2013-06-28 2015-01-19 京セラ株式会社 弾性波装置、電子部品モジュールおよび移動体端末
JP5883100B2 (ja) 2014-09-29 2016-03-09 京セラ株式会社 弾性波装置およびその製造方法
KR101959455B1 (ko) * 2015-03-16 2019-03-18 가부시키가이샤 무라타 세이사쿠쇼 탄성 표면파 장치
WO2016185866A1 (ja) 2015-05-18 2016-11-24 株式会社村田製作所 弾性表面波装置、高周波モジュール及び弾性表面波装置の製造方法
JP6350510B2 (ja) * 2015-12-24 2018-07-04 株式会社村田製作所 弾性表面波装置
JP6298120B2 (ja) * 2016-08-25 2018-03-20 京セラ株式会社 弾性波装置および回路基板
JP6534406B2 (ja) * 2017-03-21 2019-06-26 太陽誘電株式会社 マルチプレクサ

Also Published As

Publication number Publication date
CN112217489A (zh) 2021-01-12
JP6845904B2 (ja) 2021-03-24
US20220337216A1 (en) 2022-10-20
KR102283709B1 (ko) 2021-07-30
JP2021016144A (ja) 2021-02-12
KR20210008287A (ko) 2021-01-21
US20210013865A1 (en) 2021-01-14
TW202103446A (zh) 2021-01-16
EP3764541A1 (en) 2021-01-13
US11522517B2 (en) 2022-12-06
EP3764541B1 (en) 2026-03-25
TWI690156B (zh) 2020-04-01
US12224734B2 (en) 2025-02-11

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